Fabrication: Difference between revisions
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[[Doses]] | [[Doses]] | ||
[[Design template for EBL]] | |||
[[BEAMER]] | [[BEAMER]] | ||
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[[Fundamentals of lithography]] | [[Fundamentals of lithography]] | ||
[[ | =Materials & Processes in the NBI Cleanroom= | ||
==Materials== | |||
[[Resists]] | |||
[[Wafers]] | |||
[[ | |||
==Processes== | |||
[[Resist spin coating]] | [[Resist spin coating]] | ||
[[Cleaning]] | [[Cleaning]] | ||
[[Ga removal from backside of GaAs wafers]] | [[Ga removal from backside of GaAs wafers]] | ||
[[Etching]] | [[Etching]] | ||
Latest revision as of 08:01, 14 April 2026
Computers and software
Electron Beam Lithography
Recommended parameters for EBL