Fabrication: Difference between revisions
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__NOTOC__ | __NOTOC__ | ||
=Computers and software= | =Computers and software= | ||
[[Remote access and N-Drive]] | |||
[[Cleanroom computers]] | |||
[[Design computers]] | |||
[[Design software]] | [[Design software]] | ||
[[ | [[Booking Calendar]] | ||
=Electron Beam Lithography= | |||
[[Recommended parameters for EBL]] | |||
[[Doses]] | |||
[[Design template for EBL]] | |||
[[BEAMER]] | |||
[[ProSEM]] | |||
[[ | [[TRACER]] | ||
=Lithography= | =Lithography= | ||
[[Fundamentals of lithography]] | [[Fundamentals of lithography]] | ||
= | =Materials & Processes in the NBI Cleanroom= | ||
==Materials== | |||
[[Resists]] | [[Resists]] | ||
[[Wafers]] | |||
==Processes== | |||
[[Resist spin coating]] | [[Resist spin coating]] | ||
[[Cleaning]] | [[Cleaning]] | ||
[[Ga removal from backside of GaAs wafers]] | [[Ga removal from backside of GaAs wafers]] | ||
[[Etching]] | [[Etching]] | ||
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[[Category:Fabrication]] | [[Category:Fabrication]] | ||
Latest revision as of 08:01, 14 April 2026
Computers and software
Electron Beam Lithography
Recommended parameters for EBL