Fabrication: Difference between revisions

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=Computers and software=
=Computers and software=
[[Remote access and N-Drive]]
[[Cleanroom computers]]
[[Design computers]]


[[Design software]]
[[Design software]]


[[Cleanroom PCs]]
[[Booking Calendar]]
 
=Electron Beam Lithography=
 
[[Recommended parameters for EBL]]
 
[[Doses]]
 
[[Design template for EBL]]
 
[[BEAMER]]


[[Booking Calendar]]
[[ProSEM]]
 
[[TRACER]]


=Lithography=
=Lithography=
[[Fundamentals of lithography]]
[[Fundamentals of lithography]]


==Preparing your sample==  
=Materials & Processes in the NBI Cleanroom=  
==Materials==
[[Resists]]
[[Resists]]
[[Resist spin coating]]
[[Cleaning]]


[[Wafers]]
[[Wafers]]


==Preparing your design==
==Processes==


[[Doses]]
[[Resist spin coating]]


[[BEAMER]]
[[Cleaning]]
 
[[TRACER]]


==Processing your sample==
[[Ga removal from backside of GaAs wafers]]


[[Etching]]
[[Etching]]
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[[Category:Fabrication]]
[[Category:Fabrication]]
==Characterisation software==
[[ProSEM]]

Latest revision as of 08:01, 14 April 2026