Fabrication: Difference between revisions
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[[Lithography | __NOTOC__ | ||
=Computers and software= | |||
[[Remote access and N-Drive]] | |||
[[Cleanroom computers]] | |||
[[Design computers]] | |||
[[Design software]] | |||
[[Booking Calendar]] | |||
=Electron Beam Lithography= | |||
[[Recommended parameters for EBL]] | |||
[[Doses]] | |||
[[BEAMER]] | |||
[[ProSEM]] | |||
[[TRACER]] | |||
=Lithography= | |||
[[Fundamentals of lithography]] | |||
[[Design template for lithography training]] | |||
=Preparing your sample= | |||
[[Resists]] | [[Resists]] | ||
[[Resist spin coating]] | |||
[[Cleaning]] | |||
[[Wafers]] | |||
[[Ga removal from backside of GaAs wafers]] | |||
=Processing your sample= | |||
[[Etching]] | |||
[[Preparation of solutions]] | |||
[[Category:Fabrication]] | |||
Latest revision as of 08:42, 9 April 2026
Computers and software
Electron Beam Lithography
Recommended parameters for EBL
Lithography
Design template for lithography training
Preparing your sample
Ga removal from backside of GaAs wafers