Plassys Evaporator

Overview

Physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

It also provides an ion gun for surface preparation and etching purposes.

The system has the capability of in-situ oxidation.

The sample stage can be cooled with LN2.

Film Quality: Surface roughness - 1.6 nm for 100nm thick film ( scan area 2 um /AFM Analysis (June 2023)

Currently loaded materials

Crucible position	Material	Comment
1	Ti	Currently In Use
2	-	Empty
3	-	Empty
4	Al	NBI crucible
5	Al	NQCP crucible

Substrates allowed

• Silicon and Sapphire only
• III/V substrates are not allowed in the chamber

Standard Operating Procedure

This is the standard operating procedure for the Plassys evaporator at the process lab on the second floor.

Pre-checks and log in

Pre-checks

1. Log the loadlock and main chamber pressures in the Excel log sheet at the external computer.
   • P_LL ~ 1e-7 bar
   • P_main < 5e-8 bar
2. Verify that the turbopump and the cryopump are both running (check main software interface)
   • Turbo should be running on 100% speed
   • T_cryo should be in the range 12-15 K
3. Verify that nobody has loaded a sample and that no user is logged on

Log in

• Click on the logged off indication of the GUI and use your group's credentials to log in