Plassys Evaporator: Difference between revisions

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== Overview ==
= Overview =
Physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.
Physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.


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Film Quality: ''Surface roughness - 1.6 nm for 100nm thick film ( scan area 2 um /AFM Analysis (June 2023)''
Film Quality: ''Surface roughness - 1.6 nm for 100nm thick film ( scan area 2 um /AFM Analysis (June 2023)''


== Currently loaded materials ==
= Currently loaded materials =


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== Substrates allowed ==
= Substrates allowed =
* Silicon and Sapphire only
* III/V substrates are not allowed in the chamber


Silicon and Sapphire only
= Standard Operating Procedure=
This is the standard operating procedure for the Plassys evaporator at the process lab on the second floor.
==Pre-checks and log in==
===Pre-checks===
# Log the loadlock and main chamber pressures in the Excel log sheet at the external computer.
#* P<sub>LL</sub> ~ 1e-7 bar
#* P<sub>main</sub> < 5e-8 bar
# Verify that the turbopump and the cryopump are both running (check main software interface)
#* Turbo should be running on 100% speed
#* T<sub>cryo</sub> should be in the range 12-15 K
# Verify that nobody has loaded a sample and that no user is logged on
===Log in===
* Click on the <code>logged off</code> indication of the GUI and use your group's credentials to log in
==Sample loading==
 
==Load your recipe==
 
==Excecute your recipe==
 
==Monitor your process==
 
==Sample unloading==

Revision as of 12:36, 9 September 2025

Overview

Physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

It also provides an ion gun for surface preparation and etching purposes.

The system has the capability of in-situ oxidation.

The sample stage can be cooled with LN2.

Film Quality: Surface roughness - 1.6 nm for 100nm thick film ( scan area 2 um /AFM Analysis (June 2023)

Currently loaded materials

Crucible position Material Comment
1 Ti Currently In Use
2 - Empty
3 - Empty
4 Al NBI crucible
5 Al NQCP crucible

Substrates allowed

  • Silicon and Sapphire only
  • III/V substrates are not allowed in the chamber

Standard Operating Procedure

This is the standard operating procedure for the Plassys evaporator at the process lab on the second floor.

Pre-checks and log in

Pre-checks

  1. Log the loadlock and main chamber pressures in the Excel log sheet at the external computer.
    • PLL ~ 1e-7 bar
    • Pmain < 5e-8 bar
  2. Verify that the turbopump and the cryopump are both running (check main software interface)
    • Turbo should be running on 100% speed
    • Tcryo should be in the range 12-15 K
  3. Verify that nobody has loaded a sample and that no user is logged on

Log in

  • Click on the logged off indication of the GUI and use your group's credentials to log in

Sample loading

Load your recipe

Excecute your recipe

Monitor your process

Sample unloading