Training

Getting trained on a tool. Refer to the relevant tool section.

Elionix 7000 (100 kV)

• You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use a tool.
• Elionix is a high level tool: Make sure you are already trained to:
  • enter the cleanroom
  • use the microscope, spinner, asher
  • any other tool you'll need to prepare chips for the training. This could be the micromanipulator or the Heidelberg.
• You'll need 3 sessions of about 2.5 hrs each on the tool to get trained on this tool.
  • Session 1 involves exposing alignment marks and one half of the overlay test pattern on a blank chip. After exposure you need to develop the pattern in the PMMA developer. This is enough for session 2.
  • Session 2 involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (e.g., 2nd half of the overlay pattern).
  • Session 3 involves exposing a "real" pattern on a "real" chip.
• Before any training slots are booked on the tool you'll need all of the following prepared:
  • Shadow someone on the tool 2-3 times before starting the prep.
  • Si chip (5-10 mm square) spin coated with A2 and baked at 185C/2mins. This chip will be used for sessions 1 & 2. This has to be a dummy chip.
  • A chip for your 3rd session. This is a "real" chip. Plan this internally within your sub group.
  • A design (gds, dxf, cif) for sessions 1 & 2 with:
    • 4 alignment crosses (find out what marks work on the tool from your sub-group).
    • Something to break the symmetry so you can tell chip orientation with your bare eye
    • A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
    • Something creative, somethin fun :) This is an exercise in learning CAD as well.
  • A design for the "real" chip to be exposed in session 3.
• You'll also need a software session of about 0.5 hrs -- arrange this with an Elionix superuser within your group.
• Then follow workflow 3 at Qdev wiki to convert your design files into the Elionix exposure format .co7. Make dedicated folders for each exposure.
• Note: Do not use Beamer to prep the Elionix con files

Elionix F-125 (125 kV)

Please contact Zhe Liu (zhe.liu@nbi.ku.dk)

Heidelberg upg501

• Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
• Have a chip spin coated with an appropriate photoresist before the training session.
  • The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already "expose" your resist.

Raith e-Line

• A design (gds, dxf, cif) for sessions 1 & 2 with:
  • 4 alignment crosses (find out what marks work on the tool from your sub-group).
  • Something to break the symmetry so you can tell chip orientation with your bare eye.
  • A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
  • Something creative, somethin fun :) This is an exercise in learning CAD as well.

JEOL 7800-F

• Training takes about 2-3 sessions.
• You need a chip/sample to be imaged before a session is booked.
• Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
• Request the training session only once you have gathered the chips and information.

AJA metallization, sputtering or ion milling

• You must have a sample ready before the training is arranged.

ALD 1 & 2

• You must have a sample ready before the training is arranged.

F&S autobonder

• You must have a chip for bonding.
• Figure out which daughterboard is it that your team/fridge needs.
• Have a team member show your how to glue the chip to the daughterboard with silver paint, PMMA or whatever is specific to your measurement.
• Request to a training session at this point.