Doses: Difference between revisions

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== Note ==
== Note ==
Base dose does not change with resist thickness, developing time does. However, if the developing time is fixed, say to 60s, a thinner layer of resist will need lower "base dose", since it's being over developed.
Base dose does not change with resist thickness, developing time does. However, if the developing time is fixed, say to 60s, a thinner layer of resist will need lower "base dose", since it's being over developed.
== Experimental ==
125 kV:
InP: 607 uC/cm2 and phi = 35%
InAs:
Si: 906 uC/cm2 and phi = 45%
GaAs:752 uC/cm2 and phi = 39%

Revision as of 14:35, 30 July 2018

125 kV
Si InAsUC InPUC GaAsUC SiGe
A2 1000 700 ? ? ?
A4 1000 700 ? 630 ?
A6 1200 ? ? 760 ?
El6 ? ? ? ? ?
El9 ? ? ? 420 ?
CSAR4 430 ? ? ? ?
CSAR9 ? ? ? ? ?
CSAR13 450 ? ? 350 ?
50k+A4 ? ? ? 745 ?
100 kV
Si InAsUC InPUC GaAsUC SiGe
A2 900 ? 300 ? ?
A4 900 ? 500 630 ?
A6 1000 ? ? 670 ?
El6 ? ? ? ? ?
El9 ? ? ? ? ?
CSAR4 400 ? ? ? ?
CSAR9 ? ? ? ? ?
CSAR13 ? ? ? ? ?
50k+A4 ? ? ? 630 ?
  • GaAs: Uniform clearing
  • InP: Uniform clearing
  • InAs: Uniform clearing
  • Si: Optimal contrast

Note

Base dose does not change with resist thickness, developing time does. However, if the developing time is fixed, say to 60s, a thinner layer of resist will need lower "base dose", since it's being over developed.

Experimental

125 kV: InP: 607 uC/cm2 and phi = 35% InAs: Si: 906 uC/cm2 and phi = 45% GaAs:752 uC/cm2 and phi = 39%