Doses: Difference between revisions

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==GaAs==
* GaAs: Uniform clearing  
Uniform clearing  
* InP: Uniform clearing  
 
* InAs: Uniform clearing  
==InP==
* Si: Optimal contrast
Uniform clearing  
 
==InAs==
Uniform clearing  
 
==Si==
Optimal contrast


== Note ==
== Note ==
Base dose does not change with resist thickness, developing time does. If the developing time is fixed, say to 60s, a thinner layer of resist will need a "base dose", since it's being over developed.
Base dose does not change with resist thickness, developing time does. If the developing time is fixed, say to 60s, a thinner layer of resist will need a "base dose", since it's being over developed.

Revision as of 21:51, 22 June 2018

125 kV
Si InAsUC InPUC GaAsUC SiGe
A2 1000 700 ? ? ?
A4 1000 700 ? 630 ?
A6 1200 ? ? 760 ?
El6 ? ? ? ? ?
El9 ? ? ? 420 ?
CSAR4 430 ? ? ? ?
CSAR9 ? ? ? ? ?
CSAR13 450 ? ? 350 ?
50k+A4 ? ? ? 745 ?
100 kV
Si InAsUC InPUC GaAsUC SiGe
A2 900 ? 500 ? ?
A4 900 ? 500 630 ?
A6 1000 ? ? 670 ?
El6 ? ? ? ? ?
El9 ? ? ? ? ?
CSAR4 400 ? ? ? ?
CSAR9 ? ? ? ? ?
CSAR13 ? ? ? ? ?
50k+A4 ? ? ? 630 ?
  • GaAs: Uniform clearing
  • InP: Uniform clearing
  • InAs: Uniform clearing
  • Si: Optimal contrast

Note

Base dose does not change with resist thickness, developing time does. If the developing time is fixed, say to 60s, a thinner layer of resist will need a "base dose", since it's being over developed.