Plassys Evaporator: Difference between revisions
Jump to navigation
Jump to search
| (5 intermediate revisions by the same user not shown) | |||
| Line 1: | Line 1: | ||
== Overview == | == Overview == | ||
Physical vapor deposition tool of aluminum via e-beam evaporation for Josephson junction fabrication. | |||
The system has the capability of in-situ oxidation . | It also provides an ion gun for surface preparation and etching purposes. | ||
The system has the capability of in-situ oxidation . | |||
Film Quality : Surface roughness - 1.6 nm for 100nm thick film ( scan area 2 um /AFM Analysis ( June 2023) | |||
== Currently loaded materials == | == Currently loaded materials == | ||
{| | |||
Ti ( | |- | ||
| | |||
{| class="wikitable" | |||
|- | |||
! Crucible position | |||
! Material | |||
! Comment | |||
|- | |||
| 1 | |||
| Ti | |||
| Plassys ( currently In Use) | |||
|- | |||
| 2 | |||
| Al | |||
| Plassys ( Material consumed) | |||
|- | |||
| 3 | |||
| Al | |||
| Melted. Currently In Use | |||
|- | |||
| 4 | |||
| Al | |||
| new pellets. Not melted | |||
|} | |||
== Substrates allowed == | |||
Silicon and Sapphire only | |||
Latest revision as of 09:16, 20 June 2023
Overview
Physical vapor deposition tool of aluminum via e-beam evaporation for Josephson junction fabrication. It also provides an ion gun for surface preparation and etching purposes. The system has the capability of in-situ oxidation .
Film Quality : Surface roughness - 1.6 nm for 100nm thick film ( scan area 2 um /AFM Analysis ( June 2023)
Currently loaded materials
Substrates allowedSilicon and Sapphire only |