Lithography glossary: Difference between revisions
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* '''Dark erosion''': non zero dissolution of resist in unexposed areas in developer | * '''Dark erosion''': non zero dissolution of [[Resists|resist]] in unexposed areas in developer | ||
* '''EBL''': electron beam lithography | * '''EBL''': electron beam lithography | ||
* '''Flash point''': The lowest temperature at which vapor of a material will ignite, given an ignition source. This is not to be confused with the autoignition temperature. | * '''Flash point''': The lowest temperature at which vapor of a material will ignite, given an ignition source. This is not to be confused with the autoignition temperature. | ||
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* '''MIF''': Metal ion free | * '''MIF''': Metal ion free | ||
* '''MIB''': Metal ion bearing, same as MIF | * '''MIB''': Metal ion bearing, same as MIF | ||
* '''Softbake''': The baking-out of a solvent from a polymer following spin coating. In e.g. the case of photoresist, this helps avoid e.g. mask contamination, popping or foaming of the resist by N2 created during exposure, improves resist adhesion, minimizes dark erosion, etc. | * '''Softbake''': The baking-out of a solvent from a polymer following [[Laurell spinners|spin coating]]. In e.g. the case of photoresist, this helps avoid e.g. mask contamination, popping or foaming of the resist by N2 created during exposure, improves resist adhesion, minimizes dark erosion, etc. | ||
* '''Resin''': "Soft solid or highly viscous substance, usually containing prepolymers with reactive groups" (source) | * '''Resin''': "Soft solid or highly viscous substance, usually containing prepolymers with reactive groups" (source) | ||
* '''Vapor pressure''': The pressure exerted by a vapor in thermodynamic equilibrium with its condensed (liquid or solid) phase at a given temperature in a closed system. The higher the vapor pressure, the more volatile. | * '''Vapor pressure''': The pressure exerted by a vapor in thermodynamic equilibrium with its condensed (liquid or solid) phase at a given temperature in a closed system. The higher the vapor pressure, the more volatile. | ||
[[Category:Fabrication]] | |||
Latest revision as of 19:37, 10 April 2022
- Dark erosion: non zero dissolution of resist in unexposed areas in developer
- EBL: electron beam lithography
- Flash point: The lowest temperature at which vapor of a material will ignite, given an ignition source. This is not to be confused with the autoignition temperature.
- Mercury emission lines:
| I-line | 365.4 nm | ultraviolet |
| H-line | 404.7 nm | violet |
| G-line | 435.8 nm | blue |
- MIC: Metal ion containing
- MIF: Metal ion free
- MIB: Metal ion bearing, same as MIF
- Softbake: The baking-out of a solvent from a polymer following spin coating. In e.g. the case of photoresist, this helps avoid e.g. mask contamination, popping or foaming of the resist by N2 created during exposure, improves resist adhesion, minimizes dark erosion, etc.
- Resin: "Soft solid or highly viscous substance, usually containing prepolymers with reactive groups" (source)
- Vapor pressure: The pressure exerted by a vapor in thermodynamic equilibrium with its condensed (liquid or solid) phase at a given temperature in a closed system. The higher the vapor pressure, the more volatile.