Heidelberg µPG 501

Heidelberg upg501

Work flow 1: Measuring diode intensity

Work flow 2: Loading the chip

• Center the chip and mind the rotated XY coordinate system compared to all other systems in the house (Elionix, eLine, SEM, etc)
• Find plate center to determine your chip dimensions
  • The exposure must NOT go over the chip else you risk crashing the write head (100 um working distance)

Work flow 3: Design conversion

• Copy your design down to the Design PC. Access this folder from EXP PC.
  • gdsII, dxf, cif all work. DXF or GDS is recommended.
  • No local user sub folders - gds files go in the gds sub folder, etc.
• Convert to HIMT format: (Complete tasks and then complete job)
  • Be aware that often overwriting an old job with a new file or changes still results in the old job file being exposed
  • Blank chip or overlay?

Work flow 4: Exposure

• Dose test
• Standard exposure (blank chip, no alignment to edge, etc)
• Alignment:
  • Edge alignment on a blank rectangular chip
  • Cross alignment: Works like a dream
  • Manual alignment: If you don't have well defined alignment crosses

Workflow 5: Unload