Loomis scriber: Difference between revisions
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|description = Automated semiconductor scriber and breaker | |description = Automated semiconductor scriber and breaker | ||
|location = 1st floor lab (03.1.111) | |location = 1st floor lab (03.1.111) | ||
|primary = | |primary = Harry | ||
|secondary = | |secondary = Martin | ||
}} | }} | ||
Other tools at the [[Main Page|NBI cleanroom]] for wafer processing: | Other tools at the [[Main Page|NBI cleanroom]] for wafer processing: | ||
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* [[Dicing saw]] | * [[Dicing saw]] | ||
[[Category:Tools]] | [[Category:Tools]] | ||
==About== | |||
The Loomis LSD-155Lt is a production scribe and break system that can be used for processing large grids, arrays of laser bars, cleaving high quality mirror facets, and dicing wafers. | |||
Primarily, it is dedicated to scribe and dice III/V samples, but it is also possible to use it for Si. | |||
You can read the news about the tool in the designated '''Teams''' of '''UCPH_NBI_Cleanroom''' called '''Loomis''' | |||
==Policy== | |||
Only a limited number of users are trained on this tool. If you want to dice a wafer using this tool, contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].]. | |||
Please include the following details: | |||
* Amount, material and crystal orientation of wafers. | |||
* Dicing dimensions | |||
** Is your wafer patterned? A schematic is well appreciated | |||
* Resist that the sample is coated | |||
==Standard operating procedure== | |||
===Load your sample to the membrane=== | |||
How to load it | |||
===initialise settings and calibrate=== | |||
* Place the tape ring on the stage. ''Slide the ring underneath the two black tabs and ensure that it is sitting flush on the bottom bezel of the stage'' | |||
* Rotate the retaining lever to secure the tape ring. | |||
* Press <code>Load Wafer</code> | |||
* Press <code>Load Recipe</code> and select '''Si 001'''. | |||
* Choose the right tool | |||
<blockquote style="background-color: #F0F0F0; border: dashed thin grey;"> | |||
'''What is a tool?''' | |||
A ''tool'' is practically a diamond tip with specific cuts that can scribe "deeper" or "broader" a surface. | |||
</blockquote> | |||
* Press <code>Change tool</code> | |||
* Find an area that you are fine if it gets damaged and press <code>Tool down</code> | |||
* If <span style="background:##c0c0c0">Tool touch</span> indicates <span style="background:#ff0000">TOOL OFF</span> then: | |||
** Rotate the wheel behind the microscope lens counterclockwise. ** | |||
** While rotating the indication will change to <span style="background:#66CC00">TOOL ON</span>. At that point, stop turning the wheel. | |||
* Press <code>Tool up</code> | |||
* Press <code>Peck once</code> | |||
* Press <code>Tool up</code> | |||
* Check the peck line: | |||
** Is it aligned with the crosshair? | |||
*** '''Yes''' all good | |||
*** '''No''' adjust the croshair by pressing <code>Recticle</code> in the correct x-direction so that it matches the peck line | |||
*** '''Can't see the peck line at all?''' Bring the tool a bit more down by rotating the wheel of the previous steps further. Then, repeat pecking. | |||
* If you want to save the sample position that you are in right now, press right click on <code>XV2</code> and <code>XV1</code> to store the positions. | |||
''Right click is storing, left click is going'' | |||
===Scribe single lines=== | |||
theta adjustment | |||
diec on x and Y aexe | |||
===Break=== | |||
=== Remove chips, unload and cleanup=== | |||
Revision as of 13:37, 7 July 2025
 | |
| Essentials | |
|---|---|
| Full name | Loomis LSD-155 |
| Manufacturer | Loomis Inc |
| Description | Automated semiconductor scriber and breaker |
| Location | 1st floor lab (03.1.111) |
| Responsibility | |
| Primary | Harry |
| Secondary | Martin |
Other tools at the NBI cleanroom for wafer processing:
About
The Loomis LSD-155Lt is a production scribe and break system that can be used for processing large grids, arrays of laser bars, cleaving high quality mirror facets, and dicing wafers.
Primarily, it is dedicated to scribe and dice III/V samples, but it is also possible to use it for Si.
You can read the news about the tool in the designated Teams of UCPH_NBI_Cleanroom called Loomis
Policy
Only a limited number of users are trained on this tool. If you want to dice a wafer using this tool, contact cleanroom@nbi.ku.dk.]. Please include the following details:
- Amount, material and crystal orientation of wafers.
- Dicing dimensions
- Is your wafer patterned? A schematic is well appreciated
- Resist that the sample is coated
Standard operating procedure
Load your sample to the membrane
How to load it
initialise settings and calibrate
- Place the tape ring on the stage. Slide the ring underneath the two black tabs and ensure that it is sitting flush on the bottom bezel of the stage
- Rotate the retaining lever to secure the tape ring.
- Press
Load Wafer - Press
Load Recipeand select Si 001. - Choose the right tool
What is a tool?
A tool is practically a diamond tip with specific cuts that can scribe "deeper" or "broader" a surface.
- Press
Change tool - Find an area that you are fine if it gets damaged and press
Tool down
- If Tool touch indicates TOOL OFF then:
- Rotate the wheel behind the microscope lens counterclockwise. **
- While rotating the indication will change to TOOL ON. At that point, stop turning the wheel.
- Press
Tool up - Press
Peck once - Press
Tool up - Check the peck line:
- Is it aligned with the crosshair?
- Yes all good
- No adjust the croshair by pressing
Recticlein the correct x-direction so that it matches the peck line - Can't see the peck line at all? Bring the tool a bit more down by rotating the wheel of the previous steps further. Then, repeat pecking.
- Is it aligned with the crosshair?
- If you want to save the sample position that you are in right now, press right click on
XV2andXV1to store the positions.
Right click is storing, left click is going
Scribe single lines
theta adjustment diec on x and Y aexe