FS bonder

FS bonder

Essentials
Full name	F&S Bondtec 5630
Manufacturer	F&S Bondtec
Description	Semi-automatic bonder
Location	1st floor lab (03.1.111)
Responsibility
Primary	Nader
Secondary	Karolis

F/S Bondtec 5630 is a semi-automatic bonder. Users typically use it to bond semiconductor substrates to PCB daughterboards. It uses a 25 um aluminum wire, bonded at room temperature.

The bonder shares the flow hood and PC monitor with the Lynx EVO stereomicroscope. The source PC can be switched by pressing Scroll Lock, Scroll Lock, Enter on the keyboard.

Standard operating procedure

adapted from an original SOP by Masoomeh

This is a standard operating procedure (SOP) describing the use of F&S 5630 bonder on the first floor Lab.

Preparation

• Turn on the light on top of the laminar air flow bench. Set the flow to 5.
• Open the sash.
• Start the 5630 program
  • Do you want to move home? Yes
  • Do you want to open the last bonding program? No
• Choose the appropriate block for your daughterboard from the first drawer. There are four different blocks corresponding to different daughterboards:

1. Copenhagen (large and small block)
2. QBoard II
3. Sydney
4. transmon
5. QCage

• Remove the dummy daughterboard from the block.
• Screw your PCB onto the block.
• Mount your chip to the board following the procedure you learnt from your group.
  • Wait a few minutes for the chip to dry
• mount the block to the bonder stage

First-time setup

• File > New
  • "Create Program Dialog" box appears.
    • Data source: Create from default value
      • 25 um
• Use the joystick to move to the bonding pads on the daughterboard (not your chip)
  • It should be at least 5 mm away from any screws or connectors.
• "Global Camera setting": Adjust Gain and Shutter to make the daughter board visible.
• Adjust head height to see the PCB in focus
  • press button on joystick, tilt joystick down slowly
• Next
• Store trace - 6 to set "Workheight1"
• Store trace - 6 to set "Workheight2"
• Bring the bonding head halfway down (no closer than 5 mm above the highest point of any screws)
• Store trace - 6 to set "Joystick Limit"
• Store trace - 6 to set "max z position"
  • The head will touch down on the PCB and adjust the height. Note that the head might leave a small mark where it touches down.
  • In all of these four states you don’t need to move the stage or change the height of the head (except height for "joystick limit").
• Next
• Bonding parameter suggestions:
  • Bond force: 25
  • US power: 80
  • Total bond time: 25
  • Other parameters default
    • You can change these parameters later ant any point before/during/after bonding.
    • You are encouraged to look up parameters that previous users have used on similar surfaces.
      • The easiest way to gain access to other software at this point is to press Windows key.
• File > Save as... to save your bonding program.
  • Please make a folder for yourself in the users folder.

Bonding

• File to load your program.
• F1 to bring up the bonding dialog.

• In Bond1:
  • Move the stage near the bonding pads of your PCB, at least 5 mm away from connectors or screws.
  • Adjust light settings and focus on the PCB.
  • Store trace - 6 to store PCB height.
• Press Right - 2 or click on Bond2. Note that the head might leave a small mark where it touches down.

• In Bond2:
  • Move the stage near the bonding pads of your chip.
  • Adjust light settings and focus on the chip.
  • Store trace - 6 to store chip height. Note that the head might leave a small mark where it touches down.

• Now you are ready to bond! Drag and drop Bond1 and Bond2 on the desired positions and then press F1 to bond.

Notes:

• Arrows left/right move between Bond1 and Bond2
• Pressing F1 bond on Bond1 moves to Bond2 position
• Pressing F1 bond on Bond2 bonds
• Pressing 0 home | escape homes the stage, turns off light, turns off camera

Clean-up

• Check the thread
  • Feed # feeds a bit of the wire. If the wire does not come out of the wedge you need to rethread the wire.
• Close the bonding window. Save the bond program by selecting File > Save if you would like to save your changes.
• Close the 5630 program.
• Wait until the sample stage move to its home position.
• Unscrew your PCB.
• Check that all of the fuzz buttons are present. If not, replace.
• Screw on the protector plate.
• Fill in the log. Requires fields are name, date and comments/problems if there are any.
• Turn off the vacuum pump if you were using it during bonding.
• Close the sash.
• Turn down the air flow to 1.
• Turn off the light.

How to: reuse a program (single wire mode)

adapted from instructions written by Rob McNeil

1. Turn on air flow. Open the sash.
2. Start 5630 program and click "yes" at the "Do you want to move home?" dialog box.
3. Mount your PCB with sample on brass sample holder so that sample and PCB is securely held down (glue/resist/vacuum). Load brass sample holder onto bonder stage if not already mounted.

   Load selected program "File > Open"

   Warning

   It is usually safe to load any program written for the specific sample holder you are using (standard thickness brass block is 10mm). If you have a PCB with additional features e.g. capacitors or extra tall connectors beware when loading programs, the last bond position (to which the bonder will drive directly when you open the bonding dialog) may be INSIDE one of your tall features. It is safest to load the program first, open the bonding dialog, and check the bond head position and height and then go to "Home position" to load your sample/PCB. If in doubt ask an experienced user or a member of staff.

4. If required select "Single Wire" mode.
5. Press Bond - F1 to bring up the Bonding Dialog...

   It is very strongly recommended that you perform a touch down to verify the height of your chip and PCB before you start bonding. If you don't and you are unlucky you may damage your chip and/or bend the bondhead! You have been warned!

   1. Adjust Bond1 focus and light settings until you can see the PC in reasonably sharp focus.
   2. Drag and drop the Bond1 position to a suitable touchdown location (e.g. Bond pad at least 5mm away from any connectors - remember the rear of the wedge.)
   3. Click to place the cursor in the "Height" box
   4. Press Store Trace - 6, bondhead will now touch down and update both the bond height and the focus height for Bond1.
   5. Switch to Bond2 tab and repeat steps 2-4. Note the touch down will probably leave a small mark so select a location (e.g. Off-mesa/blank space) where you do not actually want to bond.

6. Drag and drop the bond end points and Bond - F1 as normal.

Common issues

adapted from Rob McNeil

The bond is in the wrong place, even though the Bond1 Bond2 positions were correctly set

If you use Bond - F1 to switch between the tabs "Bond1 > Bond2 > BOND" make sure the stage has finished moving before pressing F1 to advance.

The bonder appears to read the stage instantaneous position as you switch tabs, rather than use the stored bond position.

DLC flatline

If you see a DLC curve flatline near 0 (usually accompanied by a failed bond) it is likely the bond wire has come out of the wedge or clamp and needs rethreading. Try Wire Feed -# to check if you can see the wire tail first. hardware tention delected

Z motor error

Can happen "randomly" but most common after a failed bond.

1. Check to see if the red sensor light on the left-hand side of the bond head is ON.
2. If it is on, gently rotate the mushroom shaped wheel clockwise until the red light goes off.
3. Restart 5630 software (save? Yes) and carry on bonding as before.

After power loss, if the ultrasound generator lights are red

Check the blue ultrasound generator software and reset the errors in each tab

Other errors

Most other problems can be resolved by saving and restarting the 5630 program. But please take a screenshot and report the problem to the cleanroom staff: cleanroom@nbi.ku.dk.

Weight calibration

adapted from an original SOP by Masoomeh

Procedure

• Place a digital weighing scale on the bonder sample holder. You will need a scale with a range over 200 g.
• Make a new bond program for the height of the scale.
• Bonder software: Mode > Head calibration
• In BW-Calib tab:
  • Weight point 1: Store trace - 6
    • Needle comes down and presses on the scale.
    • Update weight point 1.
  • Weight point 2: Store trace - 6
    • Needle comes down and presses on the scale.
    • Update weight point 2.
  • Repeat until both weights are accurate within 1 g.

Calibration test

• Open the bond program for the scale.
• F1 to open the bonding window.
• Click on Bond1.
• Set the bonding force to e.g. 25 g and US power to 0.
• Change to step mode with F2.
• F1 to go through the bonding steps until the head presses on the scale.
• Verify that the weight is within 1 g, otherwise repeat the procedure.