FS bonder

FS bonder

Essentials
Full name	F&S Bondtec 5630
Manufacturer	F&S Bondtec
Description	Automatic bonder
Location	1st floor lab (03.1.111)
Responsibility
Primary	Nader
Secondary	Karolis

Standard operating procedure

adapted from an original SOP by Masoomeh

This is a standard operating procedure (SOP) describing the use of F&S 5630 bonder on the first floor Lab.

Preparation

• Turn on the light on top of the laminar air flow bench. Set flow between 2-5.
• Open the sash.
• Start the 5630 program [red]
  • Do you want to move home?: Yes
  • Do you want to open the last bonding program?: No
• Load the appropriate block for your daughterboard. There are three different blocks corresponding to different daughterboards/PCBs:
  • Copenhagen
  • Sydney
  • transmon
• Remove the dummy daughterboard from the block.
• Screw your PCB (with a chip glued onto it) onto the block.
  • In case of the transmon block, you can further secure your board to the block:
    • Turn on the vacuum pump located in the left behind the bonder
    • Click on "device clamp" in ribbon.

First-time setup

• File > New
  • "Create Program Dialog" box appears.
    • Data source: Create from default value
      • 25 um
• Use the joystick to move to the bonding pads on the daughterboard (not your chip)
  • It should be at least 5 mm away from any screws or connectors.
• "Global Camera setting": Adjust Gain and Shutter to make the daughter board visible.
• Adjust head height to see the PCB in focus
  • press button on joystick, tilt joystick down slowly
• Next
• Store trace - 6 to set "Workheight1"
• Store trace - 6 to set "Workheight2"
• Bring the bonding head halfway down (no closer than 5 mm above the highest point of any screws)
• Store trace - 6 to set "Joystick Limit"
• Store trace - 6 to set "max z position"
  • The head will touch down on the PCB and adjust the height. Note that the head might leave a small mark where it touches down.
  • In all of these four states you don’t need to move the stage or change the height of the head (except height for "joystick limit").
• Next
• Bonding parameter suggestions:
  • Bond force: 25
  • US power: 80
  • Total bond time: 25
  • Other parameters default
    • You can change these parameters later ant any point before/during/after bonding.
    • You are encouraged to look up parameters that previous users have used on similar surfaces.
      • The easiest way to gain access to other software at this point is to press Windows key.
• File > Save as... to save your bonding program.
  • Please make a folder for yourself in the users folder.

Bonding

• File to load your program.
• F1 to bring up the bonding dialog.

• In Bond1:
  • Move the stage near the bonding pads of your PCB, at least 5 mm away from connectors or screws.
  • Adjust light settings and focus on the PCB.
  • Store trace - 6 to store PCB height.
• Press Right - 2 or click on Bond2. Note that the head might leave a small mark where it touches down.

• In Bond2:
  • Move the stage near the bonding pads of your chip.
  • Adjust light settings and focus on the chip.
  • Store trace - 6 to store chip height. Note that the head might leave a small mark where it touches down.

• Now you are ready to bond! Drag and drop Bond1 and Bond2 on the desired positions and then press F1 to bond.

Notes:

• Arrows left/right move between Bond1 and Bond2
• Pressing F1 bond on Bond1 moves to Bond2 position
• Pressing F1 bond on Bond2 bonds
• Pressing 0 home | escape homes the stage, turns off light, turns off camera

Clean-up

• Check the thread
  • Feed # feeds a bit of the wire. If the wire does not come out of the wedge you need to rethread the wire.
• Close the bonding window. Save the bond program by selecting [File > Save] if you would like to save your changes.
• Close the 5630 program.
• Wait until the sample stage move to its home position.
• Unscrew your PCB.
• Check that all of the fuzz buttons are present. If not, replace.
• Screw on the protector plate.
• Fill in the log. Requires fields are name, date and comments/problems if there are any.
• Turn off the vacuum pump if you were using it during bonding.
• Close the sash.
• Turn down the air flow to 1.
• Turn off the light.

Weight calibration

adapted from an original SOP by Masoomeh

Procedure

• Place a digital weighing scale on the bonder sample holder. You will need a scale with a range over 200 g.
• Make a new bond program for the height of the scale.
• Bonder software: Mode > Head calibration
• In BW-Calib tab:
  • Weight point 1: Store trace - 6
    • Needle comes down and presses on the scale.
    • Update weight point 1.
  • Weight point 2: Store trace - 6
    • Needle comes down and presses on the scale.
    • Update weight point 2.
  • Repeat until both weights are accurate within 1 g.

Calibration test

• Open the bond program for the scale.
• F1 to open the bonding window.
• Click on Bond1.
• Set the bonding force to e.g. 25 g and US power to 0.
• Change to step mode with F2.
• F1 to go through the bonding steps until the head presses on the scale.
• Verify that the weight is within 1 g, otherwise repeat the procedure.