Heidelberg µPG 501: Difference between revisions
Jump to navigation
Jump to search
No edit summary |
mNo edit summary |
||
| Line 2: | Line 2: | ||
[[Category:MigrateToOpenWiki]] | [[Category:MigrateToOpenWiki]] | ||
Work flow 2: Loading the chip | == Work flow 1: Measuring diode intensity == | ||
== Work flow 2: Loading the chip == | |||
*Center the chip and mind the rotated XY coordinate system compared to all other systems in the house (Elionix, eLine, SEM, etc) | *Center the chip and mind the rotated XY coordinate system compared to all other systems in the house (Elionix, eLine, SEM, etc) | ||
*Find plate center to determine your chip dimensions | *Find plate center to determine your chip dimensions | ||
| Line 10: | Line 14: | ||
Work flow 3: Design conversion | |||
== Work flow 3: Design conversion == | |||
*Copy your design down to the Design PC. Access this folder from EXP PC. | *Copy your design down to the Design PC. Access this folder from EXP PC. | ||
** gdsII, dxf, cif all work. DXF or GDS is recommended. | ** gdsII, dxf, cif all work. DXF or GDS is recommended. | ||
| Line 19: | Line 25: | ||
Work flow 4: Exposure | == Work flow 4: Exposure == | ||
* Dose test | * Dose test | ||
* Standard exposure (blank chip, no alignment to edge, etc) | * Standard exposure (blank chip, no alignment to edge, etc) | ||
| Line 27: | Line 34: | ||
** Manual alignment: If you don't have well defined alignment crosses | ** Manual alignment: If you don't have well defined alignment crosses | ||
Workflow 5: Unload | |||
== Workflow 5: Unload == | |||
Revision as of 10:36, 15 January 2016
Work flow 1: Measuring diode intensity
Work flow 2: Loading the chip
- Center the chip and mind the rotated XY coordinate system compared to all other systems in the house (Elionix, eLine, SEM, etc)
- Find plate center to determine your chip dimensions
- The exposure must NOT go over the chip else you risk crashing the write head (100 um working distance)
Work flow 3: Design conversion
- Copy your design down to the Design PC. Access this folder from EXP PC.
- gdsII, dxf, cif all work. DXF or GDS is recommended.
- No local user sub folders - gds files go in the gds sub folder, etc.
- Convert to HIMT format: (Complete tasks and then complete job)
- Be aware that often overwriting an old job with a new file or changes still results in the old job file being exposed
- Blank chip or overlay?
Work flow 4: Exposure
- Dose test
- Standard exposure (blank chip, no alignment to edge, etc)
- Alignment:
- Edge alignment on a blank rectangular chip
- Cross alignment: Works like a dream
- Manual alignment: If you don't have well defined alignment crosses