Dicing saw: Difference between revisions
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Tape: [https://www.denka.co.jp/product/detail_00020/ UHP1515M3-30B] | Tape: [https://www.denka.co.jp/product/detail_00020/ UHP1515M3-30B] | ||
===Blade parameters=== | ===Blade parameters=== | ||
Spindle revolution: | Spindle revolution: | ||
[[Category:Tools]] | [[Category:Tools]] | ||
Revision as of 16:28, 2 December 2024
 | |
| Essentials | |
|---|---|
| Full name | DISCO DAD3221 |
| Manufacturer | DISCO |
| Description | Automatic dicing saw |
| Location | 1st floor (03.1.109) |
| Responsibility | |
| Primary | Nader |
| Secondary | Martin |
Other tools at the NBI cleanroom for wafer processing:
This tool is operated only by the cleanroom staff and superuser. For any inquiries for dicing please write to cleanroom@nbi.ku.dk.
Tool specifications
The wafer saw is used for dicing Si and sapphire wafers. For dicing of III/Vs refer to Loomis scriber Details on the tool specifications can be found on the website.
Si dicing components
Blade Lot ID: ZH5-SD2000-N1-70
Tape:
Blade parameters
Spindle revolution: 30000 per minute
Sapphire dicing components
Blade Lot ID: P1A851
Tape: UHP1515M3-30B
Blade parameters
Spindle revolution: