Dicing saw: Difference between revisions
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==Si dicing components== | ==Si dicing components== | ||
Blade | Blade Lot ID: ZH5-SD2000-N1-70 https://www.disco.co.jp/eg/products/blade/zh05.html | ||
Spindle revolution: 30000 per minute | |||
Tape | Tape | ||
Blade parameters | Blade parameters | ||
Revision as of 16:03, 2 December 2024
 | |
| Essentials | |
|---|---|
| Full name | DISCO DAD3221 |
| Manufacturer | DISCO |
| Description | Automatic dicing saw |
| Location | 1st floor (03.1.109) |
| Responsibility | |
| Primary | Nader |
| Secondary | Martin |
Other tools at the NBI cleanroom for wafer processing:
This tool is operated only by the cleanroom staff and superuser. For any inquiries for dicing please write to cleanroom@nbi.ku.dk.]
Wafer saw details:
The wafer saw is used for dicing Si and sapphire wafers:
Si dicing components
Blade Lot ID: ZH5-SD2000-N1-70 https://www.disco.co.jp/eg/products/blade/zh05.html Spindle revolution: 30000 per minute Tape Blade parameters
Sapphire dicing components
Blade Tape Blade parameters