Dicing saw: Difference between revisions
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This tool is operated only | This tool is operated only by the cleanroom staff and superuser. For any inquiries for dicing please write to [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].] | ||
Wafer saw details: | |||
The wafer saw is used for dicing Si and sapphire wafers: | |||
==Si dicing components== | |||
Blade | |||
Tape | |||
Blade parameters | |||
==Sapphire dicing components== | |||
Blade | |||
Tape | |||
Blade parameters | |||
Revision as of 15:34, 2 December 2024
 | |
| Essentials | |
|---|---|
| Full name | DISCO DAD3221 |
| Manufacturer | DISCO |
| Description | Automatic dicing saw |
| Location | 1st floor (03.1.109) |
| Responsibility | |
| Primary | Nader |
| Secondary | Martin |
Other tools at the NBI cleanroom for wafer processing:
This tool is operated only by the cleanroom staff and superuser. For any inquiries for dicing please write to cleanroom@nbi.ku.dk.]
Wafer saw details:
The wafer saw is used for dicing Si and sapphire wafers:
Si dicing components
Blade Tape Blade parameters
Sapphire dicing components
Blade Tape Blade parameters