FS bonder: Difference between revisions

From cleanroom
Jump to navigation Jump to search
 
(46 intermediate revisions by the same user not shown)
Line 6: Line 6:
|description = Semi-automatic bonder
|description = Semi-automatic bonder
|location = 1st floor lab (03.1.111)
|location = 1st floor lab (03.1.111)
|primary = Nader
|primary = Harry
|secondary = Karolis
|secondary = Nader
}}
}}
F/S Bondtec 5630 is a semi-automatic bonder.
F/S Bondtec 5630 is a semi-automatic bonder.
Line 14: Line 14:


The bonder shares the flow hood and PC monitor with the [[Lynx EVO stereomicroscope]].
The bonder shares the flow hood and PC monitor with the [[Lynx EVO stereomicroscope]].
<blockquote style="background-color: #F0F0F0; border: dashed thin grey;">
The source PC can be switched by pressing <code>Scroll Lock, Scroll Lock, Enter</code> on the keyboard.
The source PC can be switched by pressing <code>Scroll Lock, Scroll Lock, Enter</code> on the keyboard.
</blockquote>
== Standard operating procedure ==
== Standard operating procedure ==
''adapted from an original SOP by Masoomeh''


This is a standard operating procedure (SOP) describing the use of F&S 5630 bonder on the first floor Lab.
This is a standard operating procedure describing the use of '''F&S 5630 bonder''' on the first floor lab.


=== Preparation ===
=== Preparation ===
* Turn on the light on top of the laminar air flow bench. Set flow between 2-5.
# Turn on the light on top of the laminar air flow bench. Set the flow to 5.
* Open the sash.  
# Open the sash.  
* Start the 5630 program [red]
# Start the 5630 program.
** Do you want to move home?: Yes
## Do you want to move home? '''Yes'''
** Do you want to open the last bonding program?: No
## Do you want to open the last bonding program? '''No'''
* Load the appropriate block for your daughterboard. There are three different blocks corresponding to different daughterboards/PCBs:
## <code>File > Load</code>: Load your preferable bondprogramme.
** Copenhagen
# Choose the appropriate block for your daughterboard from the first drawer. There are four different blocks corresponding to different daughterboards:
** Sydney
## Copenhagen (large and small block)
** transmon
## QBoard II
* Remove the dummy daughterboard from the block.
## Sydney
* Screw your PCB (with a chip glued onto it) onto the block.
## transmon
** In case of the transmon block, you can further secure your board to the block:
## QCage
*** Turn on the vacuum pump located in the left behind the bonder
# Remove the dummy daughterboard from the block.
*** Click on "device clamp" in ribbon.
# Screw your PCB onto the block.
 
# Mount your chip to the board following the procedure you learnt from your group.
=== First-time setup ===
## Wait a few minutes for the chip to dry.
* <code>File > New</code>
# Mount the block on the bonder stage.
** "Create Program Dialog" box appears.
# Connect the grounding cable to the block.
*** Data source: Create from default value
# Use an ESD anti-static wrist strap.
**** 25 um
# Press <code>F1</code> on the side key panel to bring up the bonding dialog.
* Use the joystick to move to the bonding pads on the daughterboard (not your chip)
** It should be at least 5 mm away from any screws or connectors.
* "Global Camera setting": Adjust Gain and Shutter to make the daughter board visible.
* Adjust head height to see the PCB in focus
** press button on joystick, tilt joystick down <i>slowly</i>
* <code>Next</code>
* <code>Store trace - 6</code> to set "Workheight1"
* <code>Store trace - 6</code> to set "Workheight2"
* Bring the bonding head halfway down (no closer than 5 mm above the highest point of any screws)
* <code>Store trace - 6</code> to set "Joystick Limit"
* <code>Store trace - 6</code> to set "max z position"
** The head will touch down on the PCB and adjust the height. Note that the head might leave a small mark where it touches down.
** In all of these four states you don’t need to move the stage or change the height of the head (except height for "joystick limit").
* <code>Next</code>  
* Bonding parameter suggestions:
** Bond force: 25
** US power: 80
** Total bond time: 25
** Other parameters default
*** You can change these parameters later ant any point before/during/after bonding.
*** You are encouraged to look up parameters that previous users have used on similar surfaces.
**** The easiest way to gain access to other software at this point is to press <code>Windows key</code>.
* <code>File > Save as...</code> to save your bonding program.
** Please make a folder for yourself in the users folder.


=== Bonding ===
=== Bonding ===
* <code>File</code> to load your program.
# In <code>Bond1</code>:
* <code>F1</code> to bring up the bonding dialog.
## Find one of the bonding pads of your daughterboard.
## Adjust light settings and focus.
## <code>Store trace - 6</code> to register the height and xy-coordinates.
# Press <code>Right - 2</code> or click on <code>Bond2</code>. Note that the head might leave a small mark where it touches down.
# In <code>Bond2</code>:
## Find one of the bonding pads of your chip. Preferably choose a spare if you have any available.
## Adjust light settings and focus on the chip.
## <code>Store trace - 6</code> to store chip height. Note that the head might leave a small mark where it touches down.
# Now you are ready to bond!
##It is always a good idea to start with a test bond on spare pads to test the success and the profile of your wirebond. Adjust the bonding parameters if necessary.
##Once you find the optimal bonding parameters. Drag and drop '''Bond1''' and '''Bond2''' on the desired positions and then press <code>F1</code> to bond.


* In <code>Bond1</code>:
<blockquote style="background-color: #F0F0F0; border: dashed thin grey;">
** Move the stage near the bonding pads of your PCB, at least 5 mm away from connectors or screws.
'''Notes'''
** Adjust light settings and focus on the PCB.
* Arrows left/right move between Bond1 and Bond2.
** <code>Store trace - 6</code> to store PCB height.
* Pressing <code>F1</code> bond on Bond1 moves to Bond2 position.
* Press <code>Right - 2</code> or click on <code>Bond2</code>. Note that the head might leave a small mark where it touches down.
* Pressing <code>F1</code> bond on Bond2 bonds.
* Pressing <code>0 home | escape</code> homes the stage, turns off the light and turns off the camera.
</blockquote>


* In <code>Bond2</code>:
=== Clean-up ===
** Move the stage near the bonding pads of your chip.
# Close the bonding dialog. Save the bond program by selecting <code>File > Save</code> if you would like to save your changes.
** Adjust light settings and focus on the chip.
# Close the 5630 program.
** <code>Store trace - 6</code> to store chip height. Note that the head might leave a small mark where it touches down.
# Wait until the sample stage moves to the home position.
# Unscrew the block from the stage.
# You can move the block Under the Lynx Microscope to take some images of your final bonding result.
# Unscrew your bonded chip/daughterboard from the block.
# Check that all of the fuzz buttons are present. '''If not, replace.'''
# Screw a dummy board in place.  
# Fill in the sheet-log. Required fields are name, date and comments/problems, if there are any.
# Close the sash.
# Turn down the air flow to 1.
# Turn off the light.


* Now you are ready to bond! Drag and drop Bond1 and Bond2 on the desired positions and then press <code>F1</code> to bond.
== Common issues ==


Notes:
=== DLC flatline===
* Arrows left/right move between Bond1 and Bond2
:If you see a DLC curve flatline near 0 (usually accompanied by a failed bond) it is likely the bond wire has come out of the wedge or clamp and needs rethreading. Try <code>Wire Feed -#</code> to check if you can see the wire tail first.
* Pressing <code>F1</code> bond on Bond1 moves to Bond2 position
* Pressing <code>F1</code> bond on Bond2 bonds
* Pressing <code>0 home | escape</code> homes the stage, turns off light, turns off camera


=== Clean-up ===
=== The wedge may be clogged ===  
* Check the thread
# Check the thread.
** <code>Feed #</code> feeds a bit of the wire. If the wire does not come out of the wedge you need to rethread the wire.
# Press <code>Feed #</code> to feed the wire. If the wire does not come out of the wedge, you need to rethread.
* Close the bonding window. Save the bond program by selecting <code>File > Save</code> if you would like to save your changes.  
# Release the right clamp by rotating it 90 degrees clockwise.
* Close the 5630 program.
# Use the scissors to cut the damaged part of the wire.
* Wait until the sample stage move to its home position.
# Use the designated tweezers for rethreading.
* Unscrew your PCB.
# If the wire doesn't pass through the wedge hole:
* Check that all of the fuzz buttons are present. If not, replace.
## Press <code>Test</code> on the ultrasonic generator while touching the wedge close to the tip with your metallic tweezers.
* Screw on the protector plate.
## Try rethreading again and repeat the process if you don't succeed by your first attempt.
* Fill in the log. Requires fields are name, date and comments/problems if there are any.
## As a last resort, you can try rethreading in the opposite direction. This will verify that your wedge is clogged (or not).
* Turn off the vacuum pump if you were using it during bonding.  
## Once you verify that the wedge is clogged, contact one of the tool administrators and they will replace the wedge.
* Close the sash.
#'''Do not attempt to replace the wedge by yourself.'''
* Turn down the air flow to 1.
* Turn off the light.


=== Z motor error ===
Can happen "randomly" but most common after a failed bond.
# Check to see if the red sensor light on the left-hand side of the bond head is ON.
# If it is on, gently rotate the mushroom shaped wheel clockwise until the red light goes off.
# Restart 5630 software (save? Yes) and carry on bonding as before.


== How to: reuse a program (single wire mode) ==
=== The bond is in the wrong place, even though the Bond1 Bond2 positions were correctly set ===  
''adapted from instructions written by Rob McNeil''
: If you use <code>Bond - F1</code> to switch between the tabs "Bond1 > Bond2 > BOND" make sure the stage has finished moving before pressing <code>F1</code> to advance.
: The bonder appears to read the stage instantaneous position as you switch tabs, rather than use the stored bond position.


# Turn on air flow. Open the sash.
=== After power loss, if the ultrasound generator lights are red ===
# Start 5630 program and click "yes" at the "Do you want to move home?" dialog box.
: Check the blue ultrasound generator software and reset the errors in each tab
# Mount your PCB with sample on brass sample holder so that sample and PCB is securely held down (glue/resist/vacuum). Load brass sample holder onto bonder stage if not already mounted.
#: Load selected program "File > Open"
#; Warning:
#: It is usually safe to load any program written for the specific sample holder you are using (standard thickness brass block is 10mm). If you have a PCB with additional features e.g. capacitors or extra tall connectors beware when loading programs, the last bond position (to which the bonder will drive directly when you open the bonding dialog) may be INSIDE one of your tall features. It is safest to load the program first, open the bonding dialog, and check the bond head position and height and then go to "Home position" to load your sample/PCB. If in doubt ask an experienced user or a member of staff.
# If required select "Single Wire" mode.
# Press <code>Bond - F1</code> to bring up the Bonding Dialog...
#:It is very strongly recommended that you perform a touch down to verify the height of your chip and PCB before you start bonding. If you don't and you are unlucky you may damage your chip and/or bend the bondhead! You have been warned!
#:# Adjust Bond1 focus and light settings until you can see the PC in reasonably sharp focus.
#:# Drag and drop the Bond1 position to a suitable touchdown location (e.g. Bond pad at least 5mm away from any connectors - remember the rear of the wedge.)
#:# Click to place the cursor in the "Height" box
#:# Press <code>Store Trace - 6</code>, bondhead will now touch down and update both the bond height and the focus height for Bond1.
#:# Switch to Bond2 tab and repeat steps 2-4. Note the touch down will probably leave a small mark so select a location (e.g. Off-mesa/blank space) where you do not actually want to bond.
# Drag and drop the bond end points and <code>Bond - F1</code> as normal.


== Common issues ==
=== Other errors ===
: Most other problems can be resolved by saving and restarting the 5630 program. But please take a screenshot and report the problem to the [[About|cleanroom staff]]: [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].


''adapted from Rob McNeil''
==Bondprogramme setup==


; The bond is in the wrong place, even though the Bond1 Bond2 positions were correctly set
: If you use <code>Bond - F1</code> to switch between the tabs "Bond1 > Bond2 > BOND" make sure the stage has finished moving before pressing <code>F1</code> to advance.
: The bonder appears to read the stage instantaneous position as you switch tabs, rather than use the stored bond position.


; DLC flatline
===First-time bondprogramme setup===
If you see a DLC curve flatline near 0 (usually accompanied by a failed bond) it is likely the bond wire has come out of the wedge or clamp and needs rethreading. Try <code>Wire Feed -#</code> to check if you can see the wire tail first.
## "Create Program Dialog" box appears.
hardware tention delected
## Data source: Create from default value: 25 um
# Use the joystick to move to the bonding pads on the daughterboard (not your chip): It should be at least 5 mm away from any screws or connectors.
# "Global Camera setting": Adjust Gain and Shutter to make the daughter board visible.
# Adjust head height to see the PCB in focus: press button on joystick, tilt joystick down <i>slowly</i>
# <code>Next</code>
# <code>Store trace - 6</code> to set "Workheight1"
# <code>Store trace - 6</code> to set "Workheight2"
# Bring the bonding head halfway down (no closer than 5 mm above the highest point of any screws)
# <code>Store trace - 6</code> to set "Joystick Limit"
# <code>Store trace - 6</code> to set "max z position"
## The head will touch down on the PCB and adjust the height. Note that the head might leave a small mark where it touches down.
## In all of these four states you don’t need to move the stage or change the height of the head (except height for "joystick limit").
# <code>Next</code>
# <code>File > Save as...</code> to save your bonding program.
## Please make a folder for yourself in the ''users'' folder.
<blockquote style="background-color: #F0F0F0; border: dashed thin grey;">
'''Bonding parameter suggestions'''
* Bond force: 30
* US power: 60
* Total bond time: 30
* Other parameters default


; Z motor error
''You can change these parameters later ant any point before/during/after bonding.''
: Can happen "randomly" but most common after a failed bond.
:# Check to see if the red sensor light on the left-hand side of the bond head is ON.
:# If it is on, gently rotate the mushroom shaped wheel clockwise until the red light goes off.
:# Restart 5630 software (save? Yes) and carry on bonding as before.


; After power loss, if the ultrasound generator lights are red:
''You are encouraged to look up parameters that previous users have used on similar surfaces.''
: Check the blue ultrasound generator software and reset the errors in each tab
</blockquote>


; Other errors
=== Reuse a bondprogramme (single wire mode) ===
: Most other problems can be resolved by saving and restarting the 5630 program. But please take a screenshot and report the problem to the [[About|cleanroom staff]]: [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].


== Weight calibration ==
#: Load selected program "File > Open" <p>'''Warning:''' It is usually safe to load any program written for the specific sample holder you are using (standard thickness brass block is 10mm). If you have a PCB with additional features e.g. capacitors or extra tall connectors beware when loading programs, the last bond position (to which the bonder will drive directly when you open the bonding dialog) may be INSIDE one of your tall features. It is safest to load the program first, open the bonding dialog, and check the bond head position and height and then go to "Home position" to load your sample/PCB. If in doubt, ask an experienced user or a member of staff.</p>
 
# If required select "Single Wire" mode.
''adapted from an original SOP by Masoomeh''
# Press <code>Bond - F1</code> to bring up the Bonding Dialog...
# '''It is very strongly recommended that you perform a touch down to verify the height of your chip and PCB before you start bonding'''. If you don't and you are unlucky you may damage your chip and/or bend the bondhead! You have been warned!
## Adjust Bond1 focus and light settings until you can see the PC in reasonably sharp focus.
## Drag and drop the Bond1 position to a suitable touchdown location (e.g. Bond pad at least 5mm away from any connectors - remember the rear of the wedge.)
## Click to place the cursor in the "Height" box
## Press <code>Store Trace - 6</code>, bondhead will now touch down and update both the bond height and the focus height for Bond1.
## Switch to Bond2 tab and repeat steps 2-4. Note the touch down will probably leave a small mark so select a location (e.g. Off-mesa/blank space) where you do not actually want to bond.
# Drag and drop the bond end points and <code>Bond - F1</code> as normal.


=== Procedure ===
== Maintenance ==
* Place a digital weighing scale on the bonder sample holder. You will need a scale with a range over 200 g.
=== Weight calibration ===
* Make a new bond program for the height of the scale.  
==== Procedure ====
* Bonder software: <code>Mode > Head calibration</code>
# Place a digital weighing scale on the bonder sample holder. You will need a scale with a range over 200 g.
* In BW-Calib tab:
# Make a new bond program for the height of the scale.  
** Weight point 1: <code>Store trace - 6</code>
# Bonder software: <code>Mode > Head calibration</code>
*** Needle comes down and presses on the scale.
# In BW-Calib tab:
*** Update weight point 1.
## Weight point 1: <code>Store trace - 6</code>
** Weight point 2: <code>Store trace - 6</code>
### Wedge comes down and presses on the scale.
*** Needle comes down and presses on the scale.
### Update weight point 1.
*** Update weight point 2.
## Weight point 2: <code>Store trace - 6</code>
** Repeat until both weights are accurate within 1 g.
### Wedge comes down and presses on the scale.
### Update weight point 2.
## Repeat until both weights are accurate within 1 g.


=== Calibration test ===
=== Calibration test ===
* Open the bond program for the scale.
# Open the bond program for the scale.
* <code>F1</code> to open the bonding window.
# <code>F1</code> to open the bonding window.
* Click on <code>Bond1</code>.  
# Click on <code>Bond1</code>.  
* Set the bonding force to e.g. 25 g and US power to 0.
# Set the bonding force to e.g. 25 g and US power to 0.
* Change to step mode with <code>F2</code>.
# Change to step mode with <code>F2</code>.
* <code>F1</code> to go through the bonding steps until the head presses on the scale.
# <code>F1</code> to go through the bonding steps until the head presses on the scale.
* Verify that the weight is within 1 g, otherwise repeat the procedure.
# Verify that the weight is within 1 g, otherwise repeat the procedure.


=== Cleaning of clogged wedges===
# 15 min Acetonce sonication at 35°C, 37kHz and 50% power (in a glass beaker)
# 5 min IPA sonication at 35°C, 37kHz and 50% power
# 5 min IPA
# Blow dry with N2 gun
# Blow dry with hot air
# Optical inspection of the wedges at the microscope located on the left side of the bonder
20 Aug 2024: '''Nader, Harry''' out of approx 35 wedges, only 4 were clogged after cleaning.
[[Category:Tools]]
[[Category:Tools]]

Latest revision as of 14:13, 5 September 2024

FS bonder
Picture of FS bonder text
Essentials
Full nameF&S Bondtec 5630
ManufacturerF&S Bondtec
DescriptionSemi-automatic bonder
Location1st floor lab (03.1.111)
Responsibility
PrimaryHarry
SecondaryNader

F/S Bondtec 5630 is a semi-automatic bonder. Users typically use it to bond semiconductor substrates to PCB daughterboards. It uses a 25 um aluminum wire, bonded at room temperature.

The bonder shares the flow hood and PC monitor with the Lynx EVO stereomicroscope.

The source PC can be switched by pressing Scroll Lock, Scroll Lock, Enter on the keyboard.


Standard operating procedure

This is a standard operating procedure describing the use of F&S 5630 bonder on the first floor lab.

Preparation

  1. Turn on the light on top of the laminar air flow bench. Set the flow to 5.
  2. Open the sash.
  3. Start the 5630 program.
    1. Do you want to move home? Yes
    2. Do you want to open the last bonding program? No
    3. File > Load: Load your preferable bondprogramme.
  4. Choose the appropriate block for your daughterboard from the first drawer. There are four different blocks corresponding to different daughterboards:
    1. Copenhagen (large and small block)
    2. QBoard II
    3. Sydney
    4. transmon
    5. QCage
  5. Remove the dummy daughterboard from the block.
  6. Screw your PCB onto the block.
  7. Mount your chip to the board following the procedure you learnt from your group.
    1. Wait a few minutes for the chip to dry.
  8. Mount the block on the bonder stage.
  9. Connect the grounding cable to the block.
  10. Use an ESD anti-static wrist strap.
  11. Press F1 on the side key panel to bring up the bonding dialog.

Bonding

  1. In Bond1:
    1. Find one of the bonding pads of your daughterboard.
    2. Adjust light settings and focus.
    3. Store trace - 6 to register the height and xy-coordinates.
  2. Press Right - 2 or click on Bond2. Note that the head might leave a small mark where it touches down.
  3. In Bond2:
    1. Find one of the bonding pads of your chip. Preferably choose a spare if you have any available.
    2. Adjust light settings and focus on the chip.
    3. Store trace - 6 to store chip height. Note that the head might leave a small mark where it touches down.
  4. Now you are ready to bond!
    1. It is always a good idea to start with a test bond on spare pads to test the success and the profile of your wirebond. Adjust the bonding parameters if necessary.
    2. Once you find the optimal bonding parameters. Drag and drop Bond1 and Bond2 on the desired positions and then press F1 to bond.

Notes

  • Arrows left/right move between Bond1 and Bond2.
  • Pressing F1 bond on Bond1 moves to Bond2 position.
  • Pressing F1 bond on Bond2 bonds.
  • Pressing 0 home | escape homes the stage, turns off the light and turns off the camera.

Clean-up

  1. Close the bonding dialog. Save the bond program by selecting File > Save if you would like to save your changes.
  2. Close the 5630 program.
  3. Wait until the sample stage moves to the home position.
  4. Unscrew the block from the stage.
  5. You can move the block Under the Lynx Microscope to take some images of your final bonding result.
  6. Unscrew your bonded chip/daughterboard from the block.
  7. Check that all of the fuzz buttons are present. If not, replace.
  8. Screw a dummy board in place.
  9. Fill in the sheet-log. Required fields are name, date and comments/problems, if there are any.
  10. Close the sash.
  11. Turn down the air flow to 1.
  12. Turn off the light.

Common issues

DLC flatline

If you see a DLC curve flatline near 0 (usually accompanied by a failed bond) it is likely the bond wire has come out of the wedge or clamp and needs rethreading. Try Wire Feed -# to check if you can see the wire tail first.

The wedge may be clogged

  1. Check the thread.
  2. Press Feed # to feed the wire. If the wire does not come out of the wedge, you need to rethread.
  3. Release the right clamp by rotating it 90 degrees clockwise.
  4. Use the scissors to cut the damaged part of the wire.
  5. Use the designated tweezers for rethreading.
  6. If the wire doesn't pass through the wedge hole:
    1. Press Test on the ultrasonic generator while touching the wedge close to the tip with your metallic tweezers.
    2. Try rethreading again and repeat the process if you don't succeed by your first attempt.
    3. As a last resort, you can try rethreading in the opposite direction. This will verify that your wedge is clogged (or not).
    4. Once you verify that the wedge is clogged, contact one of the tool administrators and they will replace the wedge.
  7. Do not attempt to replace the wedge by yourself.

Z motor error

Can happen "randomly" but most common after a failed bond.

  1. Check to see if the red sensor light on the left-hand side of the bond head is ON.
  2. If it is on, gently rotate the mushroom shaped wheel clockwise until the red light goes off.
  3. Restart 5630 software (save? Yes) and carry on bonding as before.

The bond is in the wrong place, even though the Bond1 Bond2 positions were correctly set

If you use Bond - F1 to switch between the tabs "Bond1 > Bond2 > BOND" make sure the stage has finished moving before pressing F1 to advance.
The bonder appears to read the stage instantaneous position as you switch tabs, rather than use the stored bond position.

After power loss, if the ultrasound generator lights are red

Check the blue ultrasound generator software and reset the errors in each tab

Other errors

Most other problems can be resolved by saving and restarting the 5630 program. But please take a screenshot and report the problem to the cleanroom staff: cleanroom@nbi.ku.dk.

Bondprogramme setup

First-time bondprogramme setup

    1. "Create Program Dialog" box appears.
    2. Data source: Create from default value: 25 um
  1. Use the joystick to move to the bonding pads on the daughterboard (not your chip): It should be at least 5 mm away from any screws or connectors.
  2. "Global Camera setting": Adjust Gain and Shutter to make the daughter board visible.
  3. Adjust head height to see the PCB in focus: press button on joystick, tilt joystick down slowly
  4. Next
  5. Store trace - 6 to set "Workheight1"
  6. Store trace - 6 to set "Workheight2"
  7. Bring the bonding head halfway down (no closer than 5 mm above the highest point of any screws)
  8. Store trace - 6 to set "Joystick Limit"
  9. Store trace - 6 to set "max z position"
    1. The head will touch down on the PCB and adjust the height. Note that the head might leave a small mark where it touches down.
    2. In all of these four states you don’t need to move the stage or change the height of the head (except height for "joystick limit").
  10. Next
  11. File > Save as... to save your bonding program.
    1. Please make a folder for yourself in the users folder.

Bonding parameter suggestions

  • Bond force: 30
  • US power: 60
  • Total bond time: 30
  • Other parameters default

You can change these parameters later ant any point before/during/after bonding.

You are encouraged to look up parameters that previous users have used on similar surfaces.

Reuse a bondprogramme (single wire mode)

  1. Load selected program "File > Open"

    Warning: It is usually safe to load any program written for the specific sample holder you are using (standard thickness brass block is 10mm). If you have a PCB with additional features e.g. capacitors or extra tall connectors beware when loading programs, the last bond position (to which the bonder will drive directly when you open the bonding dialog) may be INSIDE one of your tall features. It is safest to load the program first, open the bonding dialog, and check the bond head position and height and then go to "Home position" to load your sample/PCB. If in doubt, ask an experienced user or a member of staff.

  2. If required select "Single Wire" mode.
  3. Press Bond - F1 to bring up the Bonding Dialog...
  4. It is very strongly recommended that you perform a touch down to verify the height of your chip and PCB before you start bonding. If you don't and you are unlucky you may damage your chip and/or bend the bondhead! You have been warned!
    1. Adjust Bond1 focus and light settings until you can see the PC in reasonably sharp focus.
    2. Drag and drop the Bond1 position to a suitable touchdown location (e.g. Bond pad at least 5mm away from any connectors - remember the rear of the wedge.)
    3. Click to place the cursor in the "Height" box
    4. Press Store Trace - 6, bondhead will now touch down and update both the bond height and the focus height for Bond1.
    5. Switch to Bond2 tab and repeat steps 2-4. Note the touch down will probably leave a small mark so select a location (e.g. Off-mesa/blank space) where you do not actually want to bond.
  5. Drag and drop the bond end points and Bond - F1 as normal.

Maintenance

Weight calibration

Procedure

  1. Place a digital weighing scale on the bonder sample holder. You will need a scale with a range over 200 g.
  2. Make a new bond program for the height of the scale.
  3. Bonder software: Mode > Head calibration
  4. In BW-Calib tab:
    1. Weight point 1: Store trace - 6
      1. Wedge comes down and presses on the scale.
      2. Update weight point 1.
    2. Weight point 2: Store trace - 6
      1. Wedge comes down and presses on the scale.
      2. Update weight point 2.
    3. Repeat until both weights are accurate within 1 g.

Calibration test

  1. Open the bond program for the scale.
  2. F1 to open the bonding window.
  3. Click on Bond1.
  4. Set the bonding force to e.g. 25 g and US power to 0.
  5. Change to step mode with F2.
  6. F1 to go through the bonding steps until the head presses on the scale.
  7. Verify that the weight is within 1 g, otherwise repeat the procedure.

Cleaning of clogged wedges

  1. 15 min Acetonce sonication at 35°C, 37kHz and 50% power (in a glass beaker)
  2. 5 min IPA sonication at 35°C, 37kHz and 50% power
  3. 5 min IPA
  4. Blow dry with N2 gun
  5. Blow dry with hot air
  6. Optical inspection of the wedges at the microscope located on the left side of the bonder

20 Aug 2024: Nader, Harry out of approx 35 wedges, only 4 were clogged after cleaning.