Dicing saw: Difference between revisions
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|image = Tool dicing saw.jpg | |image = Tool dicing saw.jpg | ||
|toolfullname = DISCO DAD3221 | |toolfullname = DISCO DAD3221 | ||
|website = https://www.disco.co.jp/eg/ | |website = https://www.disco.co.jp/eg/technology/index.html | ||
|company = DISCO | |company = DISCO | ||
|description = Automatic dicing saw | |description = Automatic dicing saw | ||
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* [[Süss scriber|Manual Süss scriber]] | * [[Süss scriber|Manual Süss scriber]] | ||
* [[Loomis scriber|Automatic Loomis scriber]] | * [[Loomis scriber|Automatic Loomis scriber]] | ||
This tool is operated only by the cleanroom staff and superuser. For any inquiries for dicing please write to [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]. | |||
=Tool specifications= | |||
The wafer saw is used for dicing '''Si''' and '''sapphire''' wafers. For dicing of III/Vs refer to [[Loomis scriber]] | |||
Details on the tool specifications can be found on the [https://www.disco.co.jp/eg/products/dicer/dad3221.html website]. | |||
General information about available tapes can be found [https://www.gtsaz.com/downloads/Dicing_Tape_Series.pdf here] | |||
==Si dicing components== | ==Si dicing components== | ||
Blade | Blade Lot ID: [https://www.disco.co.jp/eg/products/blade/zh05.html ZH5-SD2000-N1-70] | ||
Tape | |||
Blade parameters | Tape: | ||
===Blade parameters=== | |||
Spindle revolution: 30000 per minute | |||
==Sapphire dicing components== | ==Sapphire dicing components== | ||
Blade | Blade Lot ID: [https://www.disco.co.jp/eg/products/blade/p1a.html P1A851] | ||
Tape | |||
Blade parameters | Tape: [https://www.denka.co.jp/product/detail_00020/ UHP1515M3-30B] | ||
===Blade parameters=== | |||
Spindle revolution: | |||
[[Category:Tools]] | |||
Latest revision as of 16:31, 2 December 2024
 | |
| Essentials | |
|---|---|
| Full name | DISCO DAD3221 |
| Manufacturer | DISCO |
| Description | Automatic dicing saw |
| Location | 1st floor (03.1.109) |
| Responsibility | |
| Primary | Nader |
| Secondary | Martin |
Other tools at the NBI cleanroom for wafer processing:
This tool is operated only by the cleanroom staff and superuser. For any inquiries for dicing please write to cleanroom@nbi.ku.dk.
Tool specifications
The wafer saw is used for dicing Si and sapphire wafers. For dicing of III/Vs refer to Loomis scriber
Details on the tool specifications can be found on the website.
General information about available tapes can be found here
Si dicing components
Blade Lot ID: ZH5-SD2000-N1-70
Tape:
Blade parameters
Spindle revolution: 30000 per minute
Sapphire dicing components
Blade Lot ID: P1A851
Tape: UHP1515M3-30B
Blade parameters
Spindle revolution: