cleanroom - Recent changes [en-gb]

AJA systems

Harry — Tue, 06 Oct 2026 09:07:07 GMT

System pre-checks

← Older revision		Revision as of 09:07, 6 October 2026
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	<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">		<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
	* Check the cryo-pump monitor. It should be between '''12-17 K'''. If it's higher than 20 K, grab a tool responsible or a technical staff member.		* Check the cryo-pump monitor. It should be between '''12-17 K'''. If it's higher than 20 K, grab a tool responsible or a technical staff member.
	* Check that the turbo frequency is '''1500 Hz'''. The turbo pumps on the load lock.
	* Check that the pressure in the main chamber (ion gauge sensor) is '''<1x10<sup>-7</sup> Torr'''.		* Check that the pressure in the main chamber (ion gauge sensor) is '''<1x10<sup>-7</sup> Torr'''.
	*:'''Log this value.'''		*:'''Log this value.'''

Etching

Harry — Mon, 05 Oct 2026 14:31:05 GMT

Dry etching

@@ Line 52: / Line 52: @@
 For dry etching, you can use [[AJA systems]] or [[Plassys Evaporator]]. AJA1 and Plassys have an Ion gun for DC Kaufman milling, and in AJA2 you can do RF milling.
 ==Erch rate with AJA1==
-* Argon flow: 15 sccm.
-* pressure:  1 mTorr.
+Based on the logs, from Jan 2023 the tool has been used with the following conditions:
 * Angle: 90 degree tilt , i.e. head on.
-* Milling duration: 2 minutes warm-up followed by 4 minutes milling.
+* Argon flow: 15 sccm
 === Kaufmann settings ===
@@ Line 68: / Line 76: @@
 * Neutralizer Amps = 11.0
-=== Gold ===
+===October 2026===
 {| class="wikitable"
@@ Line 87: / Line 146: @@
 [[File:AJA1_Au.jpg|500px]]
-=== Aluminum ===
+==== Aluminum ====
 {| class="wikitable"
@@ Line 106: / Line 165: @@
 [[File:AJA1_Al.jpg|500px]]
-==Erch rate with AJA2==
+The materials milled were: Si, SiOx, SiGe InAs, InSb, InAsSb, InP, GaAs, Al, AlOx, NbTiN, TiN, NbN, Ta, EuS, STO/LAO
-===SiOx===
+===August 2016===
 Milling of SiOx on Si for 5 minutes at different pressures

Cambridge ALD

Harry — Mon, 21 Sep 2026 12:11:21 GMT

← Older revision		Revision as of 12:11, 21 September 2026
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	In the [[knowledge database for ALD]] you can find more information about the recipes.		In the [[knowledge database for ALD]] you can find more information about the recipes.

	~~Other material deposition alternatives at the [[Main Page\|NBI cleanroom]]:~~
	* [[AJA systems]] for sputtering/e-gun evaporation
	* [[E-Gun evaporator]]
	* [[Leica sputter coater]]
	* [[MBE\|Molecular beam epitaxy system]]

	== Available processes ==		== Available processes ==

AJA service

Harry — Mon, 14 Sep 2026 09:09:56 GMT

Standard maintenance

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	= Maintenance =		= Maintenance =

	== Standard maintenance ==		== Standard maintenance ==

	# Log cryo temp, base pressure.		# Log cryo temp, base pressure.
	# Close cryo gate valve.		# Close cryo gate valve.
Line 26:		Line 24:
	#** Top up target material if needed, log amount.		#** Top up target material if needed, log amount.
	# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.		# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
	#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.		#* AJA1: gold-plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
	#* AJA2: ~~silver~~ plated 6 MHz ~~(doesn't fail immediately during Pt evaporation)~~		#* AJA2: gold-plated 6 MHz.
	# Push the linear drive back inside, screw the nuts back on the bolts		# Push the linear drive back inside, screw the nuts back on the bolts
	# Check if you can see the crucible in the mirror. If not:		# Check if you can see the crucible in the mirror. If not:
Line 41:		Line 39:
	# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.		# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
	# Write a message to the users!		# Write a message to the users!

			=== Checklist ===
			* Weigh all crucibles and top up if necessary.
			*: Include the following information:
			** '''Crucible + melt before refill (g)'''
			** '''Crucible + melt + pellets after refill (g)'''
			* Chisel off additional material flaking around the crucible
			** Vacuum and ensure that there are no stray flakes on the filament
			* Check that the driving rods and bearings are in place and in good shape (test the mounting screws)
			* Replace QCMs if life <60%
			** Verify that you didn't touch the mirror.
			* If the mirror is no longer reflective, replace
			* Verify all shutters are in the correct position

	== Cryo pump regeneration ==		== Cryo pump regeneration ==

	# Close cryo VAT valve ( Adaptive pressure controller ) .		# Close cryo VAT valve ( Adaptive pressure controller ) .
	# Open the loadloack valve.		# Open the loadloack valve.

Working with Piranha

Harry — Thu, 10 Sep 2026 16:02:27 GMT

Mixing KOH pellets and etching

← Older revision		Revision as of 16:02, 10 September 2026
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	=~~=Mixing KOH pellets and etching=~~=		=Standard operating procedure=
	<div style="background-color: #c0c0c0; border: 1px solid #00000; padding: 10px; border-radius: 5px;">		<div style="background-color: #c0c0c0; border: 1px solid #00000; padding: 10px; border-radius: 5px;">
	* Book the HF fumehood in CR1.		* Book the HF fumehood in CR1.

Working with Piranha

Harry — Thu, 10 Sep 2026 16:02:02 GMT

Created page with "==Mixing KOH pellets and etching== <div style="background-color: #c0c0c0; border: 1px solid #00000; padding: 10px; border-radius: 5px;"> * Book the HF fumehood in CR1. : ''It is recommended to use a setup where you can run your process undisturbed'' * Gather all necessary glassware: ** two PTFE (Teflon) beakers * Gather all necessary chemicals: ** Concentrated sulfuric acid ** Hydrogen peroxide * Turn on MQ 30-minute timer. Flush the MQ for 30 seconds * Make sure you hav..."

New page

==Mixing KOH pellets and etching==
<div style="background-color: #c0c0c0; border: 1px solid #00000; padding: 10px; border-radius: 5px;">
* Book the HF fumehood in CR1.
: ''It is recommended to use a setup where you can run your process undisturbed''
* Gather all necessary glassware:
** two PTFE (Teflon) beakers
* Gather all necessary chemicals:
** Concentrated sulfuric acid
** Hydrogen peroxide
* Turn on MQ 30-minute timer. Flush the MQ for 30 seconds
* Make sure you have compatible tweezers: PTFE (Teflon) or steel.
* Pour some MQ in one beaker for rinsing. Dry any wet spots on the bench.
* Calculate the portions of sulfuric acid and Hydrogen peroxide that you would like to mix:
*: '''For 3:1 sratio solurtion'''
** Pour 3 parts concentrated sulfuric acid into the empty beaker.
** Very slowly pour 1 part 30% hydrogen peroxide into the sulfuric acid.
**: ''If H2O2 is poured too fast, fumes appear. The solution will heat up during this step.''
* '''The solution is now ready for sample cleaning/etching.'''
* Dip the samples into the Piranha solution for as long as necessary.
* Rinse the samples in MQ. Avoid any organic solvents.
* Dry the samples away from the Piranha solution.
* Let Piranha cool down until at room temperature.
* Use a funnel to collect the Piranha waste in the '''dedicated 1L bottle located at the bottom of the left CR1 cabinet'''.
** '''Write your name and date on the bottle'''
** '''Do not close the cap tightly.'''
** '''Place the bottle at the temporary storage in CR1.'''
* Dispose of the MQ in the sink
* Ensure that all the setup that you used (beakers, volumetrics) is back in their original location.
</div>

Working with KOH

Harry — Thu, 10 Sep 2026 15:53:52 GMT

Mixing KOH pellets and etching

← Older revision		Revision as of 15:53, 10 September 2026
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	** KOH pellets		** KOH pellets
	* Set up your equipment		* Set up your equipment
			** Turn on MQ 30-minute timer. Flush the MQ for 30 seconds
	** Fill 2L beaker with water to create a hotbath and add a magnetic stirring pill.		** Fill 2L beaker with water to create a hotbath and add a magnetic stirring pill.
	** Balance the scale.		** Balance the scale.

Safety

Harry — Thu, 10 Sep 2026 15:50:13 GMT

Safety topics

← Older revision		Revision as of 15:50, 10 September 2026
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	*[[HF safety\|Working with HF]]		*[[HF safety\|Working with HF]]
	*[[Working with KOH]]		*[[Working with KOH]]
			*[[Working with Piranha]]
	*[[Working with nanowires and nanotubes]]		*[[Working with nanowires and nanotubes]]
	*[[Working in the cleanroom while pregnant]]		*[[Working in the cleanroom while pregnant]]

Working with KOH

Harry — Thu, 10 Sep 2026 15:37:10 GMT

← Older revision		Revision as of 15:37, 10 September 2026
(One intermediate revision by the same user not shown)
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	At NBI cleanroom, we use as standard a 28% w/w KOH solution. The etch rate and the selectivity towards a SiO2 mask depends on the temperature. We normally use a temperature of 80°C but it may reduce it to, e.g., 60 °C or 70°C for a higher-precision timed etch.		At NBI cleanroom, we use as standard a 28% w/w KOH solution. The etch rate and the selectivity towards a SiO2 mask depends on the temperature. We normally use a temperature of 80°C but it may reduce it to, e.g., 60 °C or 70°C for a higher-precision timed etch.

			Before doing any chemical process related to KOH you are obligated to read and understand the current wiki page as well as the relevant [[Media:APV_KOH_V1.pdf \| Risk Assessment]].

	=Properties and guidelines=		=Properties and guidelines=

File:APV KOH V1.pdf

Harry — Thu, 10 Sep 2026 15:34:59 GMT

Harry uploaded File:APV KOH V1.pdf

New page

Working with KOH

Harry — Thu, 10 Sep 2026 13:11:59 GMT

Mixing KOH (with pellets)

← Older revision		Revision as of 13:11, 10 September 2026
(10 intermediate revisions by the same user not shown)
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	=Properties and guidelines=		=Properties and guidelines=
			<div style="background-color: #f8d7da; border: 1px solid #f5c6cb; padding: 10px; border-radius: 5px;">
	==Physical properties==		==Physical properties==
	{\| class="wikitable"		{\| class="wikitable"
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	Must be stored tightly sealed in a well-ventilated chemical cabinet. Should not be stored higher than 160 cm due to the risk of corrosion.		Must be stored tightly sealed in a well-ventilated chemical cabinet. Should not be stored higher than 160 cm due to the risk of corrosion.

	==~~Chemical~~ properties==		==Dangers and Toxicological properties==
	~~KOH-etching is a highly versatile and cheap way to realize micromechanical structures using Si3N4 or SiO2 masking materials.~~		===Dangers===

	{\| class="wikitable"		{\| class="wikitable"
	\|-		\|-
	! !! ~~Temperature !! Etch rate~~		! Pellets !! 25-50% w/w solution
	\|-		\|-
	~~!rowspan~~=3\|~~Si (001)~~		\| <span style="color:#ff0000"> H290: May be corrosive to metals. <br> H302: Harmful if swallowed. <br> H314: Causes severe skin burns and eye damage. <br> P280: Wear protective gloves/eye protection/face protection. <br> P301+312: IF SWALLOWED: Call a POISON CENTRE/doctor/ if you feel unwell. <br> P305+351+338: IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing. <br> P406: Store in a corrosion-resistant/ container with a resistant inner liner.</span>\|\| <span style="color:#ff0000"> H314: Causes severe skin burns and eye damage. <br> H302: Harmful if swallowed. <br> P260: Do not breathe dust/fume/gas/mist/vapours/spray. <br> P280: Wear protective gloves/eye protection/face protection. <br> P305+351+338: IF IN EYES: Rinse cautiously with water for several minutes. Remove contact lenses, if present and easy to do. Continue rinsing. <br> P301+312: IF SWALLOWED: Call a POISON CENTRE/doctor/ if you feel unwell.</span>
	\|~~\| 60°C \|\| 0~~.~~4 μm~~/~~min~~
	\|-		\|-
	\| ~~70°C~~ \|~~\| 0.7 μm/min~~		\|}

			=== Toxicological properties===
			{\| class="wikitable"
	\|-		\|-
	~~\| 80°C \|\| 1.3 μm~~/~~min~~		! Pellets !! 25-50% w/w solution
	\|-		\|-
	~~!Si (110)~~		\| '''Inhalation:''' No information available<br>'''Inhalation-long:''' No information available<br>'''Skin-acute:''' Causes burns<br>'''Skin-long:''' May cause allergic skin reaction<br>'''Eyes:''' Causes burns.<br>'''Ingestion:''' Harmful if swallowed and corrosive to the mucosa of the gastrointestinal tract.\|\| '''Inhalation:''' Irritation. May be corrosive to the mucous membranes in the upper respiratory tract.<br> '''Inhalation-long:''' No information available.<br>'''Skin-acute:''' Causes burns.<br>'''Skin-long:''' May cause allergic skin reaction.<br>'''Eyes:''' Causes burns.<br>'''Ingestion:''' Harmful if swallowed.
	\|\| ~~80°C~~ \|~~\| 2~~.~~5 μm/min~~
	\|-
	~~!rowspan=2\|Thermal SiOx~~
	~~\|\| 60°C \|\| 1~~.~~2 nm/min~~
	\|-
	~~\|\| 80°C \|\| 7~~.~~5 nm/min~~
	\|-		\|-
	\|}		\|}
			</div>

	=Standard Operating Procedure=		=Standard Operating Procedure=
	==Mixing KOH ~~(with~~ pellets)==		==Mixing KOH pellets and etching==
	<div style="background-color: #c0c0c0; border: 1px solid #00000; padding: 10px; border-radius: 5px;">		<div style="background-color: #c0c0c0; border: 1px solid #00000; padding: 10px; border-radius: 5px;">
	* Book the HF fumehood in CR1.		* Book the HF fumehood in CR1.
Line 70:		Line 67:
	** Beakers for measuring and mixing		** Beakers for measuring and mixing
	** KOH pellets		** KOH pellets
	* Set up equipment		* Set up your equipment
	** Fill 2L beaker with water to create a hotbath and add a magnetic stirring pill		** Fill 2L beaker with water to create a hotbath and add a magnetic stirring pill.
	** Balance the scale		** Balance the scale.
	* Calculate the portions of water and solid KOH pellets that you would like to mix:		* Calculate the portions of water and solid KOH pellets that you would like to mix:
	** You are aiming to make a 28% w/w solution		** You are aiming to make a 28% w/w solution
Line 78:		Line 75:
	** The KOH pellets come in units of xxx grams. Start by weighing an appropriate amount of KOH and set it to the side.		** The KOH pellets come in units of xxx grams. Start by weighing an appropriate amount of KOH and set it to the side.
	** Calculate the respective amount of water and fill a beaker with it.		** Calculate the respective amount of water and fill a beaker with it.

	* Slowly add the KOH pellets to the water a few at a time while stirring gently.		* Slowly add the KOH pellets to the water a few at a time while stirring gently.
	* Continue stirring until the pellets dissolve completely		* Continue stirring until the pellets dissolve completely.
	* Place your solution in the hotbath		* Place your solution in the hotbath.
	* Place a second beaker with MQ next to it		* Place a second beaker with MQ next to it.
	* Submerge the probe heater into the MQ beaker		* Submerge the probe heater into the MQ beaker.
	* Start the stirring and set the temperature.		* Start the stirring and set the temperature.
	* Once you reach the desired temperature, you can start etching your sample		* Once you reach the desired temperature, you can start etching your sample.
			*: '''Do not leave the solution unattended.'''
			* Rinse the samples in MQ water.
			* Rinse the samples in a second MQ water.
			* Dry or continue with the rest of your process.
			* Let the KOH solution to cool down to room temperature.
			* Transfer the KOH solution to the '''X-base waste container'''.
			* The MQ water that was used for rinsing can be discarded in the drain.
			* Ensure that all the setup that you used (scale, hotbath, beakers) is back in their original location.
	</div>		</div>

			==Etch rates==
			KOH-etching is a highly versatile and cheap way to realize micromechanical structures using Si3N4 or SiO2 masking materials.
			{\| class="wikitable"
			\|-
			! !! Temperature !! Etch rate
			\|-
			!rowspan=3\|Si (001)
			\|\| 60°C \|\| 0.4 μm/min
			\|-
			\| 70°C \|\| 0.7 μm/min
			\|-
			\| 80°C \|\| 1.3 μm/min
			\|-
			!Si (110)
			\|\| 80°C \|\| 2.5 μm/min
			\|-
			!rowspan=2\|Thermal SiOx
			\|\| 60°C \|\| 1.2 nm/min
			\|-
			\|\| 80°C \|\| 7.5 nm/min
			\|-
			\|}

	=First aid measures=		=First aid measures=

HF safety

Harry — Thu, 10 Sep 2026 12:16:48 GMT

Chemical and Toxicological Properties

← Older revision		Revision as of 12:16, 10 September 2026
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	= Chemical and Toxicological Properties =		= Chemical and Toxicological Properties =
			<div style="background-color: #f8d7da; border: 1px solid #f5c6cb; padding: 10px; border-radius: 5px;">
	== Chemical Properties ==		== Chemical Properties ==
	~~<div style="background-color: #f8d7da; border: 1px solid #f5c6cb; padding: 10px; border-radius: 5px;">~~
	* Clear and colorless with a density like that of water.		* Clear and colorless with a density like that of water.
	* HF dissolves glass, attacks metals, and forms explosive hydrogen gas.		* HF dissolves glass, attacks metals, and forms explosive hydrogen gas.
	* '''Use and Storage: polyethylene, polypropylene, or Teflon'''		* '''Use and Storage: polyethylene, polypropylene, or Teflon'''
	~~</div>~~
	== Toxicological Properties ==		== Toxicological Properties ==
	~~<div style="background-color: #f8d7da; border: 1px solid #f5c6cb; padding: 10px; border-radius: 5px;">~~
	* Fluoride ions cause soft tissue and bone damage by binding to calcium. Fluoride ions are both acutely and chronically toxic. Acute effects of HF exposure include extreme respiratory irritation, immediate and severe eye damage and [https://en.wikipedia.org/wiki/Pulmonary_edema pulmonary edema].		* Fluoride ions cause soft tissue and bone damage by binding to calcium. Fluoride ions are both acutely and chronically toxic. Acute effects of HF exposure include extreme respiratory irritation, immediate and severe eye damage and [https://en.wikipedia.org/wiki/Pulmonary_edema pulmonary edema].
	* '''Exposure Routes:''' '''Skin contact''' with HF is probably the most common route of exposure for laboratory personnel, although HF can also cause damage through '''eye contact''', '''inhalation''', or '''ingestion'''.		* '''Exposure Routes:''' '''Skin contact''' with HF is probably the most common route of exposure for laboratory personnel, although HF can also cause damage through '''eye contact''', '''inhalation''', or '''ingestion'''.

Working with KOH

Harry — Thu, 10 Sep 2026 12:16:08 GMT

Mixing KOH (with pellets)

← Older revision		Revision as of 12:16, 10 September 2026
(5 intermediate revisions by the same user not shown)
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	At NBI cleanroom, we use as standard a 28% w/w KOH solution. The etch rate and the selectivity towards a SiO2 mask depends on the temperature. We normally use a temperature of 80°C but it may reduce it to, e.g., 60 °C or 70°C for a higher-precision timed etch.		At NBI cleanroom, we use as standard a 28% w/w KOH solution. The etch rate and the selectivity towards a SiO2 mask depends on the temperature. We normally use a temperature of 80°C but it may reduce it to, e.g., 60 °C or 70°C for a higher-precision timed etch.

	=~~Physical properties~~ and guidelines=		=Properties and guidelines=
	==Physical properties==		==Physical properties==
	{\| class="wikitable"		{\| class="wikitable"
	\|-		\|-
	~~\| Description \|\| White or yellowish very hygroscopic pellets, flakes~~		! !! Pellets !! 25-50% w/w solution
	\|-		\|-
	\| ~~Molecular weight~~ \|\| ~~56,11 g/mol~~		! Description
			\| White or yellowish very hygroscopic pellets, flakes\|\| Liquid
	\|-		\|-
	\| ~~Density~~ \|\| ~~2,044~~ g/~~cm³~~		! Molecular weight
			\| 56.11 g/mol \|\| 56.1056 g/mol
	\|-		\|-
	\| pH \|\| ~~ca 13.5 (5~~.6g/L)		! Density
			\| 2.044 g/cm³ \|\| 1.4 g/cm³
	\|-		\|-
	\| ~~Melting point~~/~~freezing point~~ \|\| ~~361°C~~		! pH
			\| ca 13.5 (5.6g/L)\|\| >13
	\|-		\|-
	\| Boiling point \|\| ~~1327°C~~		! Melting point/freezing point
			\| 361°C \|\|
			\|-
			! Boiling point
			\| 1327°C\|\| 100°C
	\|-		\|-
	\|}		\|}

	==Incompatibility==		==Incompatibility==
	Incompatible with a.o. strong oxidizing agents, acids (violent heat generation) acid chlorides, acid anhydrides, ketones, peroxides, water (strong heat generation and can boil violently) metals while releasing hydrogen which forms explosive mixtures with air. Incompatible with animal/plant tissues, glass, plastics. Harmful to aquatic life.		Incompatible with a.o. strong oxidizing agents, acids (violent heat generation) acid chlorides, acid anhydrides, ketones, peroxides, water (strong heat generation and can boil violently) metals while releasing hydrogen which forms explosive mixtures with air. Incompatible with animal/plant tissues, glass, plastics. Harmful to aquatic life.
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	==Storage==		==Storage==
	Must be stored tightly sealed in a well-ventilated chemical cabinet. Should not be stored higher than 160 cm due to the risk of corrosion.		Must be stored tightly sealed in a well-ventilated chemical cabinet. Should not be stored higher than 160 cm due to the risk of corrosion.

			==Chemical properties==
			KOH-etching is a highly versatile and cheap way to realize micromechanical structures using Si3N4 or SiO2 masking materials.

	{\| class="wikitable"		{\| class="wikitable"
	\|-		\|-
	! ~~Si(001) temperature~~ !! Etch rate ~~(μm/min)~~		! !! Temperature !! Etch rate
	\|-		\|-
	\| 60°C \|\| 0.4		!rowspan=3\|Si (001)
			\|\| 60°C \|\| 0.4 μm/min
	\|-		\|-
	\| 70°C \|\| 0.7		\| 70°C \|\| 0.7 μm/min
	\|-		\|-
	\| 80°C \|\| 1.3		\| 80°C \|\| 1.3 μm/min
	\|-		\|-
	! Si(110) ~~temperature !! Etch rate (~~μm/min)		!Si (110)
			\|\| 80°C \|\| 2.5 μm/min
	\|-		\|-
	\| ~~80°C~~ \|\| 2.5		!rowspan=2\|Thermal SiOx
			\|\| 60°C \|\| 1.2 nm/min
	\|-		\|-
	~~! Thermal SiOx temperature !! Etch rate (μm/min)~~		\|\| 80°C \|\| 7.5 nm/min
	\|-
	~~\| 60°C \|\| 0.0012~~
	\|-
	\| 80°C \|\| 0.~~0075~~
	\|-		\|-
	\|}		\|}




	=Standard Operating Procedure=		=Standard Operating Procedure=
	==Mixing KOH (with pellets)==		==Mixing KOH (with pellets)==
			<div style="background-color: #c0c0c0; border: 1px solid #00000; padding: 10px; border-radius: 5px;">
	* Book the HF fumehood in CR1.		* Book the HF fumehood in CR1.
	: ''It is recommended to use a setup where you can run your process undisturbed''		: ''It is recommended to use a setup where you can run your process undisturbed''
Line 66:		Line 75:
	* Calculate the portions of water and solid KOH pellets that you would like to mix:		* Calculate the portions of water and solid KOH pellets that you would like to mix:
	** You are aiming to make a 28% w/w solution		** You are aiming to make a 28% w/w solution
	: There is no shame on using an [https://www.physiologyweb.com/calculators/percent_solutions_calculator.html online calculator] to figure out the ~~ratios~~.		** There is no shame on using an [https://www.physiologyweb.com/calculators/percent_solutions_calculator.html online calculator] to figure out the ratio.
	** The KOH pellets come in units of xxx grams. Start by weighing an appropriate amount of KOH and ~~store~~ it to the side.		** The KOH pellets come in units of xxx grams. Start by weighing an appropriate amount of KOH and set it to the side.
	** Calculate the respective amount of water and fill a beaker with it.		** Calculate the respective amount of water and fill a beaker with it.

Line 77:		Line 86:
	* Start the stirring and set the temperature.		* Start the stirring and set the temperature.
	* Once you reach the desired temperature, you can start etching your sample		* Once you reach the desired temperature, you can start etching your sample
			</div>

	=First aid measures=		=First aid measures=