cleanroom - User contributions [en-gb]

Main Page

2026-02-04T08:33:35Z

Zhe:

'''Welcome to the NBI Cleanroom wiki!'''

This site contains public information for the users of the cleanroom and related facilities. All items are available '''without login'''. Internal information that should not be disclosed can be posted at the password protected [https://wiki.nbi.ku.dk/qdevwiki/Main_Page QDev wiki].

{| style="width: 60%;" align="center"
|- style="text-align:center;"
|[[File:Tools_button.png|100px|link=Tools|Tools]] || [[File:Safety_button.png|100px|link=Safety|Safety]] || [[File:Fabrication_button.png|100px|link=Fabrication|Fabrication]] || [[File:Calendar_button.png|100px|link=http://cleanroom.brickhost.com/|Calendar]] || [[File:Training ico.png|100px|link=Training|Training]] || [[File:Info_button.png|100px|link=About|About]] || [[File:MBE.png|90px|link=MBE|MBE]] || [[File:sustain.png|90px|link=Sustainability|Sustainability]]
|- style="text-align:center;"
| Tools || Safety || Fabrication || Booking || Training || About || MBE || Sustainability
|}

==Current tool status==

{| cellspacing=0px style="text-align: left;"
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|Heidelberg LED writer]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|Raith eLine 30 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_7000|Elionix 7000 100 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_F-125|Elionix F-125 125 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1]]
| style="background-color: #ff9f9f" | Tool maintenance: Baking in progress...
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA2]]
| style="background-color: #FFBF00" | No Au available
|-
| style="text-align:right; padding-right:6px;" | [[Plassys Evaporator]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator]]
| style="background-color: #c6e0b4" | All good! Available materials In, Ni, SiOx,Au
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD1]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[FS bonder]]
| style="background-color: #c6e0b4" | All good! ''' Please return the hex Wera screwdrivers'''.
|-
| style="text-align:right; padding-right:6px;" | [[K&S bonder]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Dicing saw]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F]]
| style="background-color: #ff9f9f" | Microscope downtime due to N2 gas supply. Expect to be operational on 4 February 2026.
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F prime]]
| style="background-color: #ff9f9f" | Turbo failure, service on February 2nd & 3rd
|}

''List updated: Tue 3 Jan 2026''

Main Page

2026-02-02T10:01:52Z

Zhe: Undo revision 2709 by Zhe (talk)

'''Welcome to the NBI Cleanroom wiki!'''

This site contains public information for the users of the cleanroom and related facilities. All items are available '''without login'''. Internal information that should not be disclosed can be posted at the password protected [https://wiki.nbi.ku.dk/qdevwiki/Main_Page QDev wiki].

{| style="width: 60%;" align="center"
|- style="text-align:center;"
|[[File:Tools_button.png|100px|link=Tools|Tools]] || [[File:Safety_button.png|100px|link=Safety|Safety]] || [[File:Fabrication_button.png|100px|link=Fabrication|Fabrication]] || [[File:Calendar_button.png|100px|link=http://cleanroom.brickhost.com/|Calendar]] || [[File:Training ico.png|100px|link=Training|Training]] || [[File:Info_button.png|100px|link=About|About]] || [[File:MBE.png|90px|link=MBE|MBE]] || [[File:sustain.png|90px|link=Sustainability|Sustainability]]
|- style="text-align:center;"
| Tools || Safety || Fabrication || Booking || Training || About || MBE || Sustainability
|}

==Current tool status==

{| cellspacing=0px style="text-align: left;"
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|Heidelberg LED writer]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|Raith eLine 30 kV]]
| style="background-color: #ff9f9f" | Annual service
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_7000|Elionix 7000 100 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_F-125|Elionix F-125 125 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (e-gun)]]
| style="background-color: #c6e0b4" | Almost good! The bellow is slowly outgassing, pressure will drop in the next weeks
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (milling and sputtering)]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Plassys Evaporator]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator]]
| style="background-color: #c6e0b4" | All good! Available materials In, Ni, SiOx,Au
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD1]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[FS bonder]]
| style="background-color: #c6e0b4" | All good! ''' Please return the hex Wera screwdrivers'''.
|-
| style="text-align:right; padding-right:6px;" | [[K&S bonder]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Dicing saw]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F prime]]
| style="background-color: #ff9f9f" | Turbo failure, service on February 2nd & 3rd
|}

''List updated: Wed 28 Jan 2026''

Main Page

2026-02-02T10:01:08Z

Zhe:

'''Welcome to the NBI Cleanroom wiki!'''

This site contains public information for the users of the cleanroom and related facilities. All items are available '''without login'''. Internal information that should not be disclosed can be posted at the password protected [https://wiki.nbi.ku.dk/qdevwiki/Main_Page QDev wiki].

{| style="width: 60%;" align="center"
|- style="text-align:center;"
|[[File:Tools_button.png|100px|link=Tools|Tools]] || [[File:Safety_button.png|100px|link=Safety|Safety]] || [[File:Fabrication_button.png|100px|link=Fabrication|Fabrication]] || [[File:Calendar_button.png|100px|link=http://cleanroom.brickhost.com/|Calendar]] || [[File:Training ico.png|100px|link=Training|Training]] || [[File:Info_button.png|100px|link=About|About]] || [[File:MBE.png|90px|link=MBE|MBE]] || [[File:sustain.png|90px|link=Sustainability|Sustainability]]
|- style="text-align:center;"
| Tools || Safety || Fabrication || Booking || Training || About || MBE || Sustainability
|}

==Current tool status==

{| cellspacing=0px style="text-align: left;"
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|Heidelberg LED writer]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|Raith eLine 30 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_7000|Elionix 7000 100 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_F-125|Elionix F-125 125 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (e-gun)]]
| style="background-color: #c6e0b4" | Almost good! The bellow is slowly outgassing, pressure will drop in the next weeks
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (milling and sputtering)]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Plassys Evaporator]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator]]
| style="background-color: #c6e0b4" | All good! Available materials In, Ni, SiOx,Au
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD1]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[FS bonder]]
| style="background-color: #c6e0b4" | All good! ''' Please return the hex Wera screwdrivers'''.
|-
| style="text-align:right; padding-right:6px;" | [[K&S bonder]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Dicing saw]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F prime]]
| style="background-color: #ff9f9f" | Turbo failure, service on February 2nd & 3rd
|}

''List updated: Wed 28 Jan 2026''

Main Page

2026-01-27T09:46:41Z

Zhe:

'''Welcome to the NBI Cleanroom wiki!'''

This site contains public information for the users of the cleanroom and related facilities. All items are available '''without login'''. Internal information that should not be disclosed can be posted at the password protected [https://wiki.nbi.ku.dk/qdevwiki/Main_Page QDev wiki].

{| style="width: 60%;" align="center"
|- style="text-align:center;"
|[[File:Tools_button.png|100px|link=Tools|Tools]] || [[File:Safety_button.png|100px|link=Safety|Safety]] || [[File:Fabrication_button.png|100px|link=Fabrication|Fabrication]] || [[File:Calendar_button.png|100px|link=http://cleanroom.brickhost.com/|Calendar]] || [[File:Training ico.png|100px|link=Training|Training]] || [[File:Info_button.png|100px|link=About|About]] || [[File:MBE.png|90px|link=MBE|MBE]] || [[File:sustain.png|90px|link=Sustainability|Sustainability]]
|- style="text-align:center;"
| Tools || Safety || Fabrication || Booking || Training || About || MBE || Sustainability
|}

==Current tool status==

{| cellspacing=0px style="text-align: left;"
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|Heidelberg LED writer]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|Raith eLine 30 kV]]
| style="background-color: #ff9f9f" | Annual service
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_7000|Elionix 7000 100 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_F-125|Elionix F-125 125 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (e-gun)]]
| style="background-color: #ff9f9f" | The bellow of the e-gun has a vacuum leak. Currently is in factory for repair.[estimated return: Week 3]
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (milling and sputtering)]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Plassys Evaporator]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator]]
| style="background-color: #c6e0b4" | All good! Available materials In, Ni, SiOx,Au
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD1]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[FS bonder]]
| style="background-color: #c6e0b4" | All good! ''' Please return the hex Wera screwdrivers'''.
|-
| style="text-align:right; padding-right:6px;" | [[K&S bonder]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Dicing saw]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F prime]]
| style="background-color: #ff9f9f" | Turbo failure, service on February 2nd & 3rd
|}

''List updated: Fri 9 Jan 2026''

Main Page

2025-12-15T09:24:19Z

Zhe:

'''Welcome to the NBI Cleanroom wiki!'''

This site contains public information for the users of the cleanroom and related facilities. All items are available '''without login'''. Internal information that should not be disclosed can be posted at the password protected [https://wiki.nbi.ku.dk/qdevwiki/Main_Page QDev wiki].

{| style="width: 60%;" align="center"
|- style="text-align:center;"
|[[File:Tools_button.png|100px|link=Tools|Tools]] || [[File:Safety_button.png|100px|link=Safety|Safety]] || [[File:Fabrication_button.png|100px|link=Fabrication|Fabrication]] || [[File:Calendar_button.png|100px|link=http://cleanroom.brickhost.com/|Calendar]] || [[File:Training ico.png|100px|link=Training|Training]] || [[File:Info_button.png|100px|link=About|About]] || [[File:MBE.png|90px|link=MBE|MBE]] || [[File:sustain.png|90px|link=Sustainability|Sustainability]]
|- style="text-align:center;"
| Tools || Safety || Fabrication || Booking || Training || About || MBE || Sustainability
|}

==Current tool status==

{| cellspacing=0px style="text-align: left;"
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|Heidelberg LED writer]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|Raith eLine 30 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_7000|Elionix 7000 100 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_F-125|Elionix F-125 125 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (e-gun)]]
| style="background-color: #ff9f9f" | The bellow of the e-gun has a vacuum leak. Currently is in factory for repair (Week 46).[estimated return: Week 48]
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (milling and sputtering)]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Plassys Evaporator]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator]]
| style="background-color: #c6e0b4" | All good! Available materials In, Ni, SiOx,Au
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD1]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[FS bonder]]
| style="background-color: #c6e0b4" | All good! ''' Please return the hex Wera screwdrivers'''.
|-
| style="text-align:right; padding-right:6px;" | [[K&S bonder]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #FFD700" | Dual PC is not working, the tool is okay to use with a single operating PC
|-
| style="text-align:right; padding-right:6px;" | [[Dicing saw]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F prime]]
| style="background-color: #ff9f9f" | Turbo failure
|}

''List updated: Thu 4 Dec 2025''

Main Page

2025-12-12T11:05:40Z

Zhe:

'''Welcome to the NBI Cleanroom wiki!'''

This site contains public information for the users of the cleanroom and related facilities. All items are available '''without login'''. Internal information that should not be disclosed can be posted at the password protected [https://wiki.nbi.ku.dk/qdevwiki/Main_Page QDev wiki].

{| style="width: 60%;" align="center"
|- style="text-align:center;"
|[[File:Tools_button.png|100px|link=Tools|Tools]] || [[File:Safety_button.png|100px|link=Safety|Safety]] || [[File:Fabrication_button.png|100px|link=Fabrication|Fabrication]] || [[File:Calendar_button.png|100px|link=http://cleanroom.brickhost.com/|Calendar]] || [[File:Training ico.png|100px|link=Training|Training]] || [[File:Info_button.png|100px|link=About|About]] || [[File:MBE.png|90px|link=MBE|MBE]] || [[File:sustain.png|90px|link=Sustainability|Sustainability]]
|- style="text-align:center;"
| Tools || Safety || Fabrication || Booking || Training || About || MBE || Sustainability
|}

==Current tool status==

{| cellspacing=0px style="text-align: left;"
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|Heidelberg LED writer]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|Raith eLine 30 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_7000|Elionix 7000 100 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_F-125|Elionix F-125 125 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (e-gun)]]
| style="background-color: #ff9f9f" | The bellow of the e-gun has a vacuum leak. Currently is in factory for repair (Week 46).[estimated return: Week 48]
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (milling and sputtering)]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA2]]
| style="background-color: #ff9f9f" | Sample holder drops to the chamber
|-
| style="text-align:right; padding-right:6px;" | [[Plassys Evaporator]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator]]
| style="background-color: #c6e0b4" | All good! Available materials In, Ni, SiOx,Au
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD1]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[FS bonder]]
| style="background-color: #c6e0b4" | All good! ''' Please return the hex Wera screwdrivers'''.
|-
| style="text-align:right; padding-right:6px;" | [[K&S bonder]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #FFD700" | Dual PC is not working, the tool is okay to use with a single operating PC
|-
| style="text-align:right; padding-right:6px;" | [[Dicing saw]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F prime]]
| style="background-color: #ff9f9f" | Turbo failure
|}

''List updated: Thu 4 Dec 2025''

Main Page

2025-12-04T14:33:36Z

Zhe:

'''Welcome to the NBI Cleanroom wiki!'''

This site contains public information for the users of the cleanroom and related facilities. All items are available '''without login'''. Internal information that should not be disclosed can be posted at the password protected [https://wiki.nbi.ku.dk/qdevwiki/Main_Page QDev wiki].

{| style="width: 60%;" align="center"
|- style="text-align:center;"
|[[File:Tools_button.png|100px|link=Tools|Tools]] || [[File:Safety_button.png|100px|link=Safety|Safety]] || [[File:Fabrication_button.png|100px|link=Fabrication|Fabrication]] || [[File:Calendar_button.png|100px|link=http://cleanroom.brickhost.com/|Calendar]] || [[File:Training ico.png|100px|link=Training|Training]] || [[File:Info_button.png|100px|link=About|About]] || [[File:MBE.png|90px|link=MBE|MBE]] || [[File:sustain.png|90px|link=Sustainability|Sustainability]]
|- style="text-align:center;"
| Tools || Safety || Fabrication || Booking || Training || About || MBE || Sustainability
|}

==Current tool status==

{| cellspacing=0px style="text-align: left;"
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|Heidelberg LED writer]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|Raith eLine 30 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_7000|Elionix 7000 100 kV]]
| style="background-color: #c6e0b4" | All good! The current is back to regular values [Mon 24 Nov 2025]
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_F-125|Elionix F-125 125 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (e-gun)]]
| style="background-color: #ff9f9f" | The bellow of the e-gun has a vacuum leak. Currently is in factory for repair (Week 46).[estimated return: Week 48]
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (milling and sputtering)]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Plassys Evaporator]]
| style="background-color: #c6e0b4" | All good! Al5(AlNQCP) is refilled and melted
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator]]
| style="background-color: #c6e0b4" | All good! Available materials In, Ni, SiOx
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD1]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD2]]
| style="background-color: #c6e0b4" | All good! Scroll pump tip seal service is done!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[FS bonder]]
| style="background-color: #c6e0b4" | All good! ''' Please return the hex Wera screwdrivers'''.
|-
| style="text-align:right; padding-right:6px;" | [[K&S bonder]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #FFD700" | Dual PC is not working, the tool is okay to use with a single operating PC
|-
| style="text-align:right; padding-right:6px;" | [[Dicing saw]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F prime]]
| style="background-color: #ff9f9f" | Turbo failure
|}

''List updated: Tue 25 Nov 2025''

Elionix F-125

2025-11-10T15:08:25Z

Zhe:

{{Infobox tool
|image = F125.jpg
|toolfullname = Elionix F125
|website = http://www.elionix.co.jp/english/
|company = ELIONIX INC.
|description = Electron beam lithography system
|location = 01.K03
|primary = Zhe
|secondary = Harry
}}

Elionix F125 is a 125 kV acceleration electron beam lithography tool.
== Tool Specification ==
* Acceleration voltage 50,75,100,125 kV
* Minimum beam diameter - 1.8 nm
* Beam current - 100 pA to 100nA
* Field Size - Min 100 um Max 3000 um
* Minimum line width - 7nm
* Overlay accuracy - 20nm

File:F125.jpg

2025-11-10T15:07:56Z

Zhe:

File:Tool Elionix.jpg

2025-11-10T15:06:04Z

Zhe: Zhe reverted File:Tool Elionix.jpg to an old version

File:Tool Elionix.jpg

2025-11-10T15:01:56Z

Zhe: Zhe uploaded a new version of File:Tool Elionix.jpg

Elionix F-125

2025-11-10T14:59:15Z

Zhe: Created page with "{{Infobox tool |image = Tool Elionix.jpg |toolfullname = Elionix F125 |website = http://www.elionix.co.jp/english/ |company = ELIONIX INC. |description = Electron beam lithography system |location = 01.K03 |primary = Zhe |secondary = Harry }} Elionix F125 is a 125 kV acceleration electron beam lithography tool. == Tool Specification == * Acceleration voltage 50,75,100,125 kV * Minimum beam diameter - 1.8 nm * Beam current - 100 pA to 100nA * Field Size - Min 100 um Ma..."

{{Infobox tool
|image = Tool Elionix.jpg
|toolfullname = Elionix F125
|website = http://www.elionix.co.jp/english/
|company = ELIONIX INC.
|description = Electron beam lithography system
|location = 01.K03
|primary = Zhe
|secondary = Harry
}}

Elionix F125 is a 125 kV acceleration electron beam lithography tool.
== Tool Specification ==
* Acceleration voltage 50,75,100,125 kV
* Minimum beam diameter - 1.8 nm
* Beam current - 100 pA to 100nA
* Field Size - Min 100 um Max 3000 um
* Minimum line width - 7nm
* Overlay accuracy - 20nm

Main Page

2025-11-10T14:51:24Z

Zhe:

'''Welcome to the NBI Cleanroom wiki!'''

This site contains public information for the users of the cleanroom and related facilities. All items are available '''without login'''. Internal information that should not be disclosed can be posted at the password protected [https://wiki.nbi.ku.dk/qdevwiki/Main_Page QDev wiki].

{| style="width: 60%;" align="center"
|- style="text-align:center;"
|[[File:Tools_button.png|100px|link=Tools|Tools]] || [[File:Safety_button.png|100px|link=Safety|Safety]] || [[File:Fabrication_button.png|100px|link=Fabrication|Fabrication]] || [[File:Calendar_button.png|100px|link=http://cleanroom.brickhost.com/|Calendar]] || [[File:Training ico.png|100px|link=Training|Training]] || [[File:Info_button.png|100px|link=About|About]] || [[File:MBE.png|90px|link=MBE|MBE]] || [[File:sustain.png|90px|link=Sustainability|Sustainability]]
|- style="text-align:center;"
| Tools || Safety || Fabrication || Booking || Training || About || MBE || Sustainability
|}

==Current tool status==

{| cellspacing=0px style="text-align: left;"
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|Heidelberg LED writer]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|Raith eLine 30 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_7000|Elionix 7000 100 kV]]
| style="background-color: #FFD700" | Waiting for a quotation for new Dovetails on multipiece stage holder. [estimated service: Week 45]
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_F-125|Elionix F-125 125 kV]]
| style="background-color: #ff9f9f" | Annual service & gun fillament exchange. An accident happened to the filament chamber, so need more service time [down time: Weeks 45 and 48]
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (e-gun)]]
| style="background-color: #ff9f9f" | The bellow of the e-gun has a vacuum leak (verified with He test). Has been sent to the US for repair. Scheduled for evaluation in factory: Week 45.[estimated return: Week 50]
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (milling and sputtering)]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Plassys Evaporator]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator]]
| style="background-color: #c6e0b4" | All good! Available materials In (x2), SiOx
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD1]]
| style="background-color: #FFD700" | Waiting for a new venting MAC valve from buch & holm [estimated service: Week 45]. System can be used but ask Harry to help you with loading if you have issues.
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD2]]
| style="background-color: #c6e0b4" | All good! [Scheduled servicing of the scroll pump: Week 47]
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[FS bonder]]
| style="background-color: #c6e0b4" | All good! ''' Please return the hex Wera screwdrivers'''. The primary bondhead (SN:004) is in the factory for servicing [estimated return: end of Week 46]. Once we receive it back, we will set up a bondhead with Au wire!
|-
| style="text-align:right; padding-right:6px;" | [[K&S bonder]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #FFD700" | Dual PC is not working, the tool is okay to use with a single operating PC
|-
| style="text-align:right; padding-right:6px;" | [[Dicing saw]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #ff9f9f" | System down. Planning to send parts for repair. Estimated lead time: min. 4 weeks.
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F prime]]
| style="background-color: #c6e0b4" | All good!
|}

''List updated: Wed 5 Nov 2025''

Critical point dryer

2025-11-07T20:14:34Z

Zhe:

{{Infobox tool
|image = Tools CPD.jpg
|toolfullname = Critical Point Dryer Leica EM CPD300
|website = https://www.leica-microsystems.com/products/sample-preparation-for-electron-microscopy/p/leica-em-cpd300/
|company = Leica
|description = Critical point dryer
|location = Cleanroom 2 (03.2.203B)
|primary = Zhe
|secondary = Nader
}}
== CPD introduction and usage guidelines ==
* The procedure of critical point drying is an efficient method for drying delicate samples for SEM applications. It preserves the surface structure of a specimen which could otherwise be damaged due to surface tension when changing from the liquid to gaseous state.
* Si and III-V chips are allowed to be dried in this CPD tool, but chips releasing nanoparticles or nanowires are forbidden.
* The maximum chip size is 10*10 mm.
* This tool belongs to Quantum Photonics group, and is available for all cleanroom users. Please write to the cleanroom staff ([mailto:cleanroom@nbi.dk cleanroom@nbi.dk]) to ask for training and access.


[[Category:Tools]]

AccuThermo RTA

2025-11-07T20:12:27Z

Zhe:

{{Infobox tool
|image = Tool RTA.jpg
|toolfullname = AccuThermo AW 610
|website = https://allwin21.com/accuthermo-aw-610/
|company = Allwin21 Corp.
|description = Rapid thermal annealer
|location = 03.2.213
|primary = Nader
|secondary = Harry
}}

== RTP AW610 ==

Short description

=== Startup Procedure ===

If this is your first time using the machine, consult the Czar for training. You can use the computer to create a recipe without powering on the machine, so there is no reason not to do it first. Refer to '''Creating a recipe'''

If your recipe is already created:

:#Sign up the sheet..
:#Make sure the Lamp Power is set to '''OFF'''
:#Make sure the power switch on the wall is set to '''ON'''.
:#Check that the emergency button is not engaged( is pulled out ).
:#Load your sample into the susceptor.
:#Open oven door approx. '''10cm out.''' ''This will prevent any potential overpressure from shattering the quartz isolation chamber''
:#Load the susceptor inside the chamber and close the door.
:#Open up for Air cooling valves'''(5.5 bar)'''.
:#Open up the process gas/gasses on the cylinders that you need by opening the main valves on the cylinders. Pressure of the regulator on secondary manometer should be set to '''1.5 bar''' ( Check them also during the run ).
:#Turn the blue valve on the blue tube to open for air cooling line. '''The pressure should be around 2.5 bar and the flow rate of above 280'''.
:#Turn the Lamp Power '''ON''' in front.
:#Choose and load your recipe.
:#Run the proces.
:#Check that the water flow is between '''500-700''' lph during your run( Flowmeter is below Scriber ).

=== Power Down Procedure ===

After the system has cooled down and the sample was removed:

:#Make sure the Lamp Power is set to '''OFF'''
:#Open the oven door and unload the susceptor.
:#'''Put''' the wafer back in the oven and close the door.
:#Turn the blue knob on the blue tube the line to '''Close''' position.
:#Close the main valves for the process gasses that have been used.
:#'''Close''' the Air cooling valves.
:# On the computer press ESC until the main menu appears.
:#'''Leave''' AC power at '''ON''' position at the wall

For recipe creation and sample handling refer to the wiki.

=== Creating a recipe ===

For managing the annealing process the RTP AW610 uses a custom software suite. Before creating a recipe consider if you will be using a susceptor''(refer to Sample loading)''.

To create a recipe:

:*First navigate to '''''Process for Engineer''''' tab in the main menu
:*click on the '''NEW''' recipe in the recipe list
:*click on '''''Edit Recipe'''''
:*Write a new name for your recipe in the respective field and click on '''''Save'''''. This creates a new recipe in the list that you can now freely edit.
:*Check '''''Sensor type''''' to be set to '''''Thermocouple''''' and '''''Wafer Type''''' to be set to either '''''Susceptor''''' or '''''Wafer''''' depending on what you will be using.(''consult Sample loading section'')

Other parameters should be left as they are unless you know what you are doing and want something different.

You can now proceed with creating the recipe sequence itself. The available parameters are step number, function, time for a given step, temperature, init factor and gas flow for each connected process gas. Ignore the initiation factor.

Main available functions are:

:*'''Delay''' - keeps the lamp power off while maintaining other parametes, such as gas flow rates. Used for purging the chamber of air as an initial step and is a good option for cooling.

:*'''Ramp''' - ramps the temperature up or down to a desired value. The ramping rate is calculated by '''''time/target temperature'''''. Note: ''when using a susceptor, maximum ramp up rates should not exceed 15C/s''

:*'''Steady''' - keeps the lamps turned on and the temperature at a set value. The ideal step for baking the sample at a particular temperatures for a longer time.

==='''Important'''===

'''The total flow rate through the chamber should never exceed 15slpm'''.

'''At the temperatures above 600C the thermocouple begins to melt with the susceptor or a silicon wafer.'''

Tips for creating a good recipe:

A good initial step is to displace the normal atmosphere by Nitrogen. The total volume of the quartz chamber is 0.84l, therefore it is a good idea to start the process by letting Nitrogen flow into the chamber at around 5slpm for 15-20 seconds. After this initial step is complete, add or replace Nitrogen with a desired process gas.

During '''''Ramping''''' and '''''Steady''''' step, the maximum total flow rate should be 5slpm

It takes between 10-15 seconds for the machine to stabilize the temperature. Consider this when creating a multistep recipe.

=== Sample loading ===

The first rule: Dont touch anything behind the front door without gloves!

The sample holder is a quartz tray. Be gentle when putting down your sample!

=====Thermocouple=====

The temperature measurement in the RTP is obtained with a thermocouple which is connected to the oven door. When placing a sample(a wafer or a susceptor) onto the quartz loading tray make sure that:

::*the thermocople is still in one piece
::*the tip of the thermocouple is in contact with your sample
::*the two wires of the thermocouple are not in contact with eachother or the sample at any point
::*when closing the door ensure that the thermocouple will not be bent

If not set correctly, the temperature readout will not be accurate and might lead to the destruction of the sample or the machine. Use your fingers of tweezers to gently shape the thermocople wires in a sort of a bow shaped spring. If broken, contact the Czar or refer to the Service Manual to replace it.

=====Susceptor=====

When using a small sample or if your sample is transparent to the radiation spectrum emitted by the lamps(like GaAs) you'd want to use a susceptor. The susceptor is a SiC coated graphite piece that will evenly heat the sample that is placed inside.

::* The inside of the susceptor should not be exposed outside of the cleanroom
::* Before loading your sample into the susceptor, examine the latter for cracks and scratches. If any deep scratches or cracks are present - use another one and report the issue to a Czar
::* With flow rates of around 5 slpm, the process gasses should have no problem reaching the inside of the susceptor
::* '''''Be careful not to scratch the susceptor when placing your sample inside it'''''
::* '''''When using a susceptor the maximum heating rate should not exceed 15C/s!'''''
::* '''''Do not heat the susceptor without a sample inside it'''''
::* Store the susceptor in a designated spot. Do not leave it in the oven.

==[[RTP log]]==

List of avalable spare parts and maintenance log

[[Category:Tools]]

Dicing saw

2025-11-07T20:05:28Z

Zhe:

{{Infobox tool
|image = Tool dicing saw.jpg
|toolfullname = DISCO DAD3221
|website = https://www.disco.co.jp/eg/technology/index.html
|company = DISCO
|description = Automatic dicing saw
|location = 1st floor (03.1.109)
|primary = Nader
|secondary = Harry
}}
Other tools at the [[Main Page|NBI cleanroom]] for wafer processing:
* [[Süss scriber|Manual Süss scriber]]
* [[Loomis scriber|Automatic Loomis scriber]]

This tool is operated only by the cleanroom staff and superuser. For any inquiries for dicing please write to [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].

=Tool specifications=

The wafer saw is used for dicing '''Si''' and '''sapphire''' wafers. For dicing of III/Vs refer to [[Loomis scriber]]

Details on the tool specifications can be found on the [https://www.disco.co.jp/eg/products/dicer/dad3221.html website].

General information about available tapes can be found [https://www.gtsaz.com/downloads/Dicing_Tape_Series.pdf here]

==Si dicing components==
Blade Lot ID: [https://www.disco.co.jp/eg/products/blade/zh05.html ZH5-SD2000-N1-70]

Tape:
===Blade parameters===
Spindle revolution: 30000 per minute

==Sapphire dicing components==
Blade Lot ID: [https://www.disco.co.jp/eg/products/blade/p1a.html P1A851]

Tape: [https://www.denka.co.jp/product/detail_00020/ UHP1515M3-30B]
===Blade parameters===
Spindle revolution:

[[Category:Tools]]

Loomis scriber

2025-11-07T20:04:10Z

Zhe:

{{Infobox tool
|image = Tool Loomis.jpg
|toolfullname = Loomis LSD-155
|website = http://www.loomisinc.com/products/lsd155_overview.html
|company = Loomis Inc
|description = Automated semiconductor scriber and breaker
|location = 1st floor lab (03.1.111)
|primary = Harry
|secondary = Nader
}}
Other tools at the [[Main Page|NBI cleanroom]] for wafer processing:
* [[Süss scriber|Manual Süss scriber]]
* [[Dicing saw]]
[[Category:Tools]]

==About==
The Loomis LSD-155 is a production scribe and break system that can be used for processing large grids, arrays of laser bars, cleaving high quality mirror facets, and dicing wafers.

Primarily, it is dedicated to scribe and dice III/V samples, but it is also possible to use it for Si.

You can read the news about the tool in the designated '''Teams''' channel of '''UCPH_NBI_Cleanroom''' called '''Loomis'''

==Policy==
===Users and training===
Only a limited number of users are trained on this tool. If you want to dice a wafer using this tool, contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].].
Please include the following details:
* Amount, material and crystal orientation of wafers.
* Dicing dimensions
** Is your wafer patterned? A schematic is well appreciated
* Resist that the sample is coated

All certified users should book a timeslot via [https://cleanroom.brickhost.com/Web/schedule.php?sid=15&sd=2025-7-10 cleanroom.brickhost.com] before operating the tool.

===General===

* Always dispose of the membrane after a single use. Never reuse a membrane.

==Standard operating procedure==

===Load your sample to the membrane===
How to load it

===Initialise settings and calibrate===
* Place the tape ring on the stage. ''Slide the ring underneath the two black tabs and ensure that it is sitting flush on the bottom bezel of the stage''
* Rotate the retaining lever to secure the tape ring.
* Press <code>Load Wafer</code>
* Press <code>Load Recipe</code> and select '''Si 001'''.
* Choose the right tool

<div class="toccolours mw-collapsible mw-collapsed" style="overflow:auto;">
<div style="line-height:1.6;"> '''What is a tool?'''</div>
<div class="mw-collapsible-content">
A ''scribe tool'' is a bar with a faceted diamond attached to its end. Every facet and feature of a Loomis scribe tool exists to create the optimum scribe line. The leading edge of the diamond point encourages ductile flow of material around the point as it travels across the wafer, much like the flow of water around the keel of a boat. The trailing edge is responsible for the stress crack that travels down into the wafer. The scribe lines break cleanly and leave edges on the resultant dice that have integrity and strength.
[[File:loomis_tool.png|thumb|left|Proprietary T-bar Loomis scribe tool and precision diamond tip. Top: schematics from the manufacturer. Bottom: optical images of a tool.]]
</div></div>
* Press <code>Change tool</code>
* Find an area that you are fine if it gets damaged and press <code>Tool down</code>

* If Tool touch indicates '''>TOOL OFF<''' then:
** Rotate the wheel behind the microscope lens counterclockwise.
** While rotating the indication will change to '''>TOOL ON<'''. At that point, stop turning the wheel.
* Press <code>Tool up</code>
* Press <code>Peck once</code>
* Check the peck line:
** Is it aligned with the crosshair?
*** '''Yes''' all good
*** '''No''' adjust the croshair by pressing <code>Recticle</code> in the correct x-direction (<code>-></code> or <code><-</code>)so that it matches the peck line
*** '''Can't see the peck line at all?''' Bring the tool a bit more down by rotating the wheel of the previous steps further. Then, repeat pecking.
* If you want to save the sample position that you are in right now, press right click on <code>XV2</code> and <code>XV1</code> to store the positions.
*:''Right click is storing, left click is going''
* Press <code>Back</code>
* You will get a dialogue window called " '''Tool report''' "
** Fill in the details

===Scribe single lines===
* Press <code>Two Point Theta Adj</code>
** Follow the dialogue at the bottom right of the screen to align with a high-order crystal symmetry
** Check how well the alignment is by driving through the line.
**: ''You can also do a quick alignment by right-clicking on two different points of the screen. However, the final alignment is recommended to be done with the'' <code>Two Point Theta Adj</code>.
* Find the point that you want to scribe and press <code>Scribe</code>
* If you want to navigate with specific coordinates go to <code>Recipe manager</code> > <code>Technical</code> and edit the <code>x-index</code>
*: ''You only move across X, so don't edit the Y-index. The Y-index will be used later for the BREAK command, and it was found to be 63.5mm''
* Scribe all lines in the first direction
* Single right click on the rotation button to rotate (+ or -) 90°.
* Scribe all lines in the other direction

===Break===
'''Breaking in the first direction'''
* Find the top edge of your sample.
* Align the hairline with a scribed line
* Move up by 63.5mm (click the dash & arrow-up button)
* Press <code>Record Drop Position </code>
* Move back down by 63.5mm (click the dash & arrow-down button)
* Press <code>Drop</code>
*: To check that the break is successful, open the hood window, press with your finger the membrane and see from the microscope camera that the two pieces are indeed split.
* Move to the next scribe line, align, and press <code>Drop</code>
* Repeat the previous step until everything in the current direction is broken.
*:''You don't need to'' <code>Record Drop Position </code> ''every time. The first time is sufficient.''

'''Breaking in the other direction'''
* Rotate 90°
* Bring the bar above the entire wafer.
* Align the hairline with a scribed line
* Press <code>Record Drop Position </code>
* Press <code>Drop</code>
* Move to the next scribe line, align, and press <code>Drop</code>
* Repeat the previous step until everything in the current direction is broken.

'''Your wafer is died successfully!'''
* Press <code>Unload Wafer</code>

=== Remove chips, unload and cleanup===
* You can remove your chips from the membrane inside the hood.
** Bring your sample box inside the hood, detach each die and store it in your box.
*** Do you have any excess pieces that you will not use?
***: Store them in your box and discard them in the cleanroom at the designated III/V wafers waste
***: You can read more about the waste handling inside and outside the cleanroom in the page [[Waste handling]]
** Separate the tape ring inside the hood
** Detach the membrane
** Fold the sticky side
** Dispose it at the III/V waste bin below the table
** Wipe down the surfaces with ethanol
** Dispose your gloves and wipes at the III/V waste bin below the table

Süss scriber

2025-11-07T20:03:35Z

Zhe:

{{Infobox tool
|image = Tool Suss.jpg
|toolfullname = Karl Süss scriber
|company = Karl Süss
|description = Semiconductor scriber
|location = 2nd floor lab (03.2.213)
|primary = Nader
|secondary = Harry
|limits = None
|computer = TBD

}}
Other tools at the [[Main Page|NBI cleanroom]] for wafer processing:
* [[Loomis scriber|Automatic Loomis scriber]]
* [[Dicing saw]]
[[Category:Tools]]

Filmetrics reflectometer

2025-11-07T20:03:06Z

Zhe:

{{Infobox tool
|image = Tools Filmetrics.jpg
|toolfullname = Filmetrics F2-RT aRTie
|website = https://www.filmetrics.com/
|company = Filmetrics
|description = Reflectometer
|location = Cleanroom 2 (03.2.203B)
|primary = Zhe
|secondary = Harry
}}
== Filmetrics F2 introduction and usage guidelines ==
* The Filmetrics F2 is used to measure the reflectance and transmittance of thin films and with the proper software upgrades film thickness and refractive index can also be measured. Any films to be measured must be optically smooth and flat. Some commonly measured films include semiconductor process films such as oxides, nitrides, resists, and polysilicon, optical coatings such as hardcoats and anti-reflection coatings, and flat panel display films such as polyimides, resist, and cell gaps. Films that cannot be measured include very rough films and opaque metal films.
* This tool belongs to Quantum Photonics group, and is available for all cleanroom users. Please write to the cleanroom staff ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]) to ask for training and access.


[[Category:Tools]]
[[Category:Characterization]]

Olympus microscopes

2025-11-07T20:01:19Z

Zhe:

{{Infobox tool
|image = Tool Olympus BX51M.jpg
|toolfullname = Olympus BX51M Olympus BX53M
|website = http://www.olympus-ims.com/en/
|company = Olympus IMS
|description = Optical microscope
|location = Cleanroom 1 (03.2.209A) Cleanroom 2 (03.2.203B)
|primary = Harry
|secondary = Nader
}}
There are Olympus BX metrology microscopes both in CR1 (BX51M) and CR2 (BX53M).
They have feature parity and are equipped with 4K cameras and motorized Märzhäuser Wetzlar Tango stages.
Objectives are 5x, 10x, 20x, 50x, 100x.
Ultimate optical resolution (Rayleigh limit) of the 100x objective should be ~400 nm (at 550 nm wavelength).

There is also a [[Nikon microscope]] with a similar feature set in CR1.

If you want to resolve smaller features, you can use:
* [[JEOL 7800F|JEOL JSM-7800F]] SEM
* [[Raith eLine]] SEM
* [[Philips TEM]]

If you want to resolve topographical features, you can use:
* [[Tencor profilometer]]
* [[Bruker Dimension Icon AFM]]

If you want to observe [[Resists|photoresist]], insert the green filter at the back of the microscope body.
Otherwise white light will expose your resist.

== Usage rules ==
No booking is required, but please be flexible with regard to needs of other users.

The microscopes should be left with the light turned off or all the way down using the controls on the microscope body.

Do not leave samples on the stage or elsewhere in the working area, they might get discarded.

Save images you want to keep to Z drive, local files might get discarded.

== How to: take an overview image ==
<gallery>
File:Olympus-define-overview-area.png|''Stage Navigator'' toolbar should be at the top left of the ''Stream Motion'' software, above the overview image.
File:Olympus-stage-navigator-menu.png|To enable ''Stage Navigator'' toolbar: ''View > Tool Windows > Stage Navigator''.
</gallery>

=== Scanning the area ===
# Make sure the ''Stage Navigator'' toolbar is open.
# Click the left-most icon ''Define Overview Area''.
# Follow the instructions on screen:
## Find the top-left of your area, press ''OK''.
## Find the bottom-right of your area, press ''OK''.
# The microscope will now automatically take and tile the images of the entire area defined by the two corners.
It is now possible to navigate the area by clicking on the overview image.

=== Saving the image ===
If you want to save the overview image:
# ''Right click on the overview image on the left > Open Overview Image''
# ''File > Save As... (Ctrl+Shift+S)''
# Select a filetype that suits your needs:
#* Lossy (recommended for overview images):
#** Recommended 85% quality JPEG (JFIF).
#** High quality compression is imperceptible by human eye.
#** Filesize can be some tens of megabytes.
#** JPEG2000 provides 5-10x smaller filesizes but is not a universally compatible image format.
#* Lossless:
#** Recommended PNG or uncompressed TIFF.
#** The filesize can easily be several hundred megabytes.
#** LZW TIFF compression can reduce the size in half, but the microscope PC struggles with it.
#** JPEG2000 provides lossless compression, but is not a universally compatible image format.
# Save directly into Z drive.

== Troubleshooting ==
; The corners of the image are dark (vignetting)!
: There is a mechanical spring that holds the microscope components together. It needs to be tightened by service. Please notify CR staff.
: For a temporary fix make a flatfield correction: ''Acquire > Devices > Device Settings > camera (UC90) > Shading Correction > Flatfield''
; Everything is green!
: There is a green filter at the back of the microscope body. It is used to observe photoresist without exposing it.
; The image is completely black!
: Switch from eyepiece mode to camera mode (or vice versa) using a rod at the top of the microscope body.
; The overview image is all jumbled up!
: The axes of the motorized stage got inverted by the software gremlins. You can try to fix this or simply ask the CR staff.
: Try: reverse X/Y axes in ''Acquire > Device Settings > Marzhauser Tango''
; The image is completely frozen!
: Turn on live imaging with the big button on the right side of the ''Stream Motion'' software.
; I can see a projection of the cleanroom lab in the image!
: Turn down the exposure/gain in the software and increase the light using the knob on the microscope body.
; The hand controller is not moving the stage!
: Verify that the install Märzhäuser Tango control software is installed.
== Remote access ==
* TeamViewer: SCOPE1, SCOPE2
* LogMeIn: Scope 1 (CR1) [OSIS-CR1Olympus], SCOPE2 (CR2)
[[Category:Tools]]
[[Category:Characterization]]

Sensofar optical profiler

2025-11-07T20:00:37Z

Zhe:

{{Infobox tool
|image = Tool Sensofar.jpg
|toolfullname = Sensofar S neox
|website = https://www.sensofar.com/metrology/sneox/
|company = Sensofar Metrology
|description = Optical surface profiler
|location = Cleanroom 2
|primary = Nikki
|secondary = Nader
}}

Alpha-SE ellipsometer

2025-11-07T20:00:06Z

Zhe:

{{Infobox tool
|image = Tools alpha-SE ellipsometer.jpg
|toolfullname = J.A. Woollam alpha-SE Ellipsometer
|website = https://www.jawoollam.com/products/alpha-se-ellipsometer
|company = J.A. Woollam
|description = Ellipsometer
|location = Cleanroom 2
|primary = Harry
|secondary = Nader
}}
The Woollam alpha-SE ellipsometer is a characterization tool for transparent thin film thickness and roughness measurements by evaluating change in reflected/transmitted light polarization.
Getting an accurate result relies on your substrate knowledge.
Therefore, it is best to measure your samples before and after film deposition using the same model.

Most users at NBI use it to measure:
* [[Resists|resist]]
* films deposited by [[Cambridge ALD|ALD]]
* in some cases, films deposited by [[AJA systems|PVD]]
* oxide on semiconductor chips

Other alternatives to measure film thickness at the [[Main Page|NBI cleanroom]] facilities:
* [[Bruker Dimension Icon AFM]]
* [[Tencor profilometer]]
* [[Filmetrics reflectometer]]
* in some cases, [[JEOL 7800F]] SEM
== Quick-start guide ==
Video on how to operate the alpha-SE Ellipsometer:

[[File:Ellipsometer.mp4|500px]]

[https://youtu.be/8NP7sFV3vzo Click here to watch the video on YouTube]
# Prepare for measurement:
#* Turn on using the green button on the top left of the tool.
#* Turn on the small orange pump behind the ellipsometer.
#* Place your sample on the slit in the middle of the instrument. Make sure the two small holes are covered.
#* Flip the ''Sample Vacuum'' switch on the front right of the tool.
# On the PC, open the ''Complete EASE'' software:
#* Mode: Standard
#* Angles: 65°, 70°, 75°
#* Model: choose from list
#* Save Data after Measurement: user choice
#* <code>Measure</code>
# Perform the measurement by following the prompts in the software:
#* Pull out the spring lock and move the laser arm to the requested angle. Make sure the spring locks into the slot.
#* Repeat for the other side.
#* <code>OK</code>
#* Wait until the first part of the measurement finishes.
#* Repeat for all requested angles.
# Read out film thickness value, uncertainty, mean squared error (MSE).
# Finish up:
#* Switch off vacuum
#* Unload sample
#* Turn off pump
#* Turn off tool
# Done!
== Remote access ==
* TeamViewer: WOOLLAM
* LogMeIn: WOOLLAM (213)
[[Category:Tools]]
[[Category:Characterization]]

Tencor profilometer

2025-11-07T19:59:36Z

Zhe:

{{Infobox tool
|image = Tool Tencor.jpg
|toolfullname = KLA Tencor D-120
|website = http://www.kla-tencor.com/
|company = KLA-Tencor Corp.
|description = Profilometer
|location = Cleanroom 2 (03.2.203B)
|primary = Nader
|secondary = Harry
}}
The KLA-Tencor profilometer (profiler) is a sample surface height and roughness characterization tool.
A stylus tip is pressed to the surface with a small force (0.1-10 mg) and dragged across the sample surface.

Most users at NBI use it to measure:
* [[Resists|resist]]
* films deposited by [[Cambridge ALD|ALD]]
* films deposited by [[AJA systems|PVD]]

Other alternatives to measure film thickness at the [[Main Page|NBI cleanroom]] facilities:
* [[Bruker Dimension Icon AFM]]
* [[Alpha-SE ellipsometer]] for transparent films
* [[Filmetrics reflectometer]] for transparent films
* in some cases, [[JEOL 7800F]] SEM

== Quick-start guide ==
Video on how to operate the Tencor profilometer:

[[File:Tencor.mp4|500px]]

[https://youtu.be/GWIt1polWDw Click here to watch the video on YouTube]
=== Load your sample ===
# Open lid
# Place your sample in stage center
#* The stylus scans only along the axis from the center of the room towards the wall behind the tool
# Align the step feature perpendicular to the scan axis
# In the software, drive stylus up to a safe height (a couple of mm above the substrate) using ''Z Stage'' arrows on the right side of the window
# Click ''Load Positions''
# ''Center'': ''Go To''
#* Stage moves in and centers under the stylus
# Close lid
# ''Ok''
=== Find the step to scan ===
# Bring down the stylus using ''Z Stage'' at medium speed (~50%)
#* You should start seeing the reflection of the stylus on your sample
# Reduce speed (~25%) before moving closer
# Drive to area of interest using arrows in ''X-Y Stages''
=== Perform the scan ===
# When at the desired scan start position, click ''Engage''
# In the ''Scan Parameters'' panel at the bottom of the screen set ''Speed'', ''Length'', and ''Profile'' according to your needs
# Set ''Range'' according to your expected step height
# Set ''Stylus Force''
#* 1.0 mg is a good starting point
#* If the stylus doesn't move during the scan, try less force
# In the toolbar of the ''Video Capture'' window, click ▶ ''Scan''
=== Process the scan data ===
# Drag the cursors ''R'' (reference) and ''M'' (measurement) to different positions at ''the same height on the substrate''
# Expand the cursor widths as much as possible
# Click ''Level Data'' in the right of the screen
# Drag one cursor to the step and adjust the width
#* Keep the other cursor at the reference level
# Read the step height at ''Delta Height''
=== Unload your sample ===
# Close all data windows
# Increase ''Z Stage'' speed
# Drive the stylus pup to a safe gheight
# Click ''Load Positions''
# ''Unload all the way out'': ''Go To''
#* Wait for stage to drive out
# Unload sample
# ''Ok''
# Done!

== Troubleshooting ==
; If your sample is too tilted (the data hits the range limits)
:# Drive stylus away from surface using ''Z Stage''
:# Turn the angle adjustment wheel counter-clockwise to level a negative slope, or clockwise to level a positive slope
:# Perform a scan to test the tilt correction and readjust if necessary
:# Tilt is correctly adjusted if you can level the entire scan
[[Category:Tools]]
[[Category:Characterization]]

JEOL 7800F

2025-11-07T19:58:57Z

Zhe:

{{Infobox tool
|image = Tools JEOL 7800F.jpg
|toolfullname = JEOL JSM-7800F
|website = http://www.jeol.de
|company = JEOL, Ltd.
|description = Scanning electron microscope
|location = 03.1.K08
|primary = Nader
|secondary = Nikki
|manual = A printed version is in a blue binder by the instrument
}}

The JEOL 7800F is a 30 kV field emission scanning electron microscope (SEM).
It is equipped with two [https://en.wikipedia.org/wiki/Everhart-Thornley_detector secondary electron detectors] a backscatter detector, and a EDS detector.
It has a eucentric stage, a range of different sample holders depending on application requirements, and can accommodate samples of up to 50 mm in diameter.
A unique feature of this SEM, is its ability to place a negative bias on the sample stage in order to decelerate incoming electrons as well as to eject secondary electrons, thereby increasing the signal-to-noise ratio.
This feature is known as gentle beam (GB), and is particularly useful when working at low acceleration voltages.

[[Raith eLine]] is an alternative to this tool.
It does not have beam deceleration capability, but supports scripting such as unattended imaging.
Repetitive imaging at predetermined locations should be carried out on that tool instead.

== Overview ==

The different components of the SEM are illustrated in the two figures below:

[[File:JEOL 7800F Overview 1.png|left|thumb|Left side of the JEOL 7800F]]
[[File:JEOL 7800F Overview 2.png|left|thumb|Right side of the JEOL 7800F]]
[[File:JEOL 7800F consoles.png|left|thumb|Stage and beam control consoles]]

* The lower electron detector (LED) is a [https://en.wikipedia.org/wiki/Secondary_electrons secondary electron] detector, located in the chamber, and is mostly used for overview images, or in conjunction with sample tilting or high acceleration voltages.
* The upper electron detector (UED) is an in-lens secondary electron detector located in the electron beam column. It is typically used for obtaining ultrahigh resolution iamges at low acceleration voltages. It is usually used in conjunction with the gentle beam (GB).
* The backscatter detector (BSD) measures the high energy electrons from the incident beam that are backscattered by the sample surface. Particularly useful for samples composed of different materials of contrasting densities. The detector is inserted by a pneumatic valve when needed by the user, but is otherwise retracted.
* The EDS detector measures the x-ray wavelengths of photons generated in the sample when exposed to the electron beam. Using the measured x-ray spectrum, the sample material composition may be determined.
* The chamber camera is colour sensitive, and primarily used to see the sample and sample holder in relation to the pole-piece. It can only be switched on if the gun-valve is closed, and the gun-valve cannot be opened while the camera is on.
* The loadlock camera automatically takes a picture of the sample surface when the loadlock is evacuated. However, if the user is not logged in, the image will not be taken, and there is no way to take it without venting and re-evacuating the loadlock. The overview picture can be used for rough navigation of the sample.
* There is a magnetic field sensor suspended adjacent the electron beam column, and is connected to a magnetic field cancellation unit in the corner of the room. If you notice interference, or feel that you are not reaching the image resolution you feel you should, check the field cancellation unit to see if it has been tripped. This happens once in a while due to vibration from foot traffic outside, etc, and the field cancellation may be restored by pressing the reset button on the unit.
* The SEM has a N2 dewar for cooling the sample stage.

== Loading sample ==

# '''Select the appropriate sample holder:''' There are several different sample holders available for the SEM, each adapted for a particular sample size or function, such as a full 2 inch wafer holder, cross-sectional sample holder etc. Generally, you should use the smallest sample holder that will accommodate your sample. This will give you the greatest range of tilt. The PC-SEM software knows about the geometry of the different sample holders, and will automatically set the safe tilt angles for you, and prevent you from accidentally running the sample holder into the pole-piece.
# '''Attach the sample:''' The 2 inch wafer holder allows for the attachment of samples to the holder via clips, and the cross-sectional sample holders alow the samples to be either clamped in place or mounted with a screw. For the remaining sample holders, and adhesive must be used, e.g. carbon tape, graphite paste, or silver conducting paste. Most users use the carbon tape. It is easy to use, and to remove, but due to the elastic nature of the tape, some drift may occur at high magnification. If this is a problem, or you have fragile samples that may break when removed from the adhesive tape, you can try the graphite paste. It has lower adhesion, but also more electrically resistive. There are two pastes available, one suspended in water solution, and the other in isopropanol. Apply only a small dot to the sample holder surface and place your sample over it, press down gently on the sample and then leave it to try for about 5 minutes. Test whether the sample is well attached to the sample holder before loading. Note: Do not use for full wafers.
# '''Set the sample height:''' [[File:Sample holder.png|right|thumb|The 12.5 mm sample holder as seen from the side and from below.]] The sample must be attached to the sample holder such that its surface protrudes slightly from the edge of the sample holder when viewed from the side. The height of this protrusion is known as the sample surface offset. If the sample surface is below the edge of the sample holder, it must be adjusted. In the case of the 12.5 mm sample holder (see figure), this is done by loosening the two retaining screws on the side of the holer, and then screwing the large screw on the underside of the holder. This adjusts the height of the central stub to which the sample is attached.
# '''Load the sample holder:''' Hold the VENT button for two seconds, or until you hear a valve close and the hissing sound of N2 entering the loadlock, and then release clip on the side of the loadlock. This avoids an overpressure from forming within the loadlock which could dislodge the loadlock o-ring. Once the hissing stops, open the loadlock and push the sample holder into the mounting brace. Make sure it sits snugly against the flat edge, and verify that it isn't tilted. Close the loadlock, close the brace, and then press the EVAC. The system will start rough-pumping the loadlock. Pressing EVAC will also trigger the loadlock camera to take a picture of the sample surface, which can be used for navigation later on.
# ''' Insert the sample holder into the chamber:''' Once the pressure in the loadlock reaches 1.6 Pa, the SEM will automatically move the rough pumping to the back of the turbopump, and open the gate valve. This process emits three hisses, after which you can move the sample holder into the chamber using the loading rod, in accordance with the following procedure.

{| width="80%" align="center"
|-
| [[File:JEOL 7800F loading 1.png | 275px]]
|
* Lower the loading rod to the horizontal position by pivoting it downwards by 90°. Once horizontal, it will be pulled in part-ways by a spring.
* Lightly lift the rod a few degrees while applying a very gentle force along it, in order for it to reach the loading position (you should hear a metallic snap).
|-
| [[File:JEOL 7800F loading 2.png | 275px]]
|
* Push the rod directly into the chamber. Do not apply a up/down force, nor twist the rod.
|-
| [[File:JEOL 7800F loading 3.png | 275px]]
|
* You should feel the vacuum help bring in the rod
|-
| [[File:JEOL 7800F loading 4.png | 275px]]
|
* Once the rod is almost fully inserted, you will feel an increased resistance. This is due to the two braces (FIXME) meeting, and is normal. Push a little harder, until you overcome the resistance.
* When the rod is fully inserted, a dialog box will pop up in PC-SEM, asking which sample holder was inserted. ''It is absolutely imperative that you select the correct one from the menu. Not doing so may lead to catastrophic damage to the instrument.''
* Leave the sample surface offset at 0 mm for now.
|-
| [[File:JEOL 7800F loading 5.png | 275px]]
|
* Pull the rod all the way out, until you see the gray plastic stopper pop up, which prevents the rod from being pulled back in. You should hear a clicking noise.
|-
| [[File:JEOL 7800F loading 6.png | 275px]]
|
* Pivot the rod back into the vertical standby position.
|}

== Measuring sample surface offset ==

The SEM uses the sample surface offset value along with the geometry of the sample holder used, to set the allowed ranges for tilt, vertical position, etc. If not set correctly, you will risk running the sample holder into the pole-piece, from which the focused electron beam emerges. A secondary purpose of setting the offset, is that when the focus is linked to the z-coordinate, changing the working distance will automatically set the correct value of z, giving you a good starting focus.

Let's start by defining a few concepts:

[[File:JEOL7800F offset.png|right|200px]]
* The distance form the edge of the pole-piece to the point at which the electron beam is focused is known as the working distance (WD).
* The ''z'' coordinate is the distance from the edge of the pole-piece to the edge of the sample holder
* The sample surface offset (''o'') is the the distance

Thus, it is clear that for the electron beam to be in focus at the sample surface, the condition WD + ''o'' = ''z'' must be true.

To measure the offset, do as follows:
# Make sure the ZFC button is enabled
# Move the sample holder closer to the pole-piece, but keep a safe distance from it; set WD to e.g. 10 or 15 mm, by clicking on WD in the micrograph datazone. The z will be adjusted automatically.
# Set the acceleration voltage to a reasonable value (say 10 kV).
# Once the stage has stopped moving, find something on the surface of your sample to focus on, and zoom in on it
# Now, slowly rotate the ring around the track-ball until you get a reasonably good focus.
# Increase magnification if appropriate, and refine the focus.
# Once you’re happy, the difference between the z and WD gives the offset: ''o'' = ''z'' - WD
# Click on the image of the sample holder in the lower-right quadrant of PC-SEM, and enter the offset value into the field at the bottom of the dialog.

Please note: The offset should always be measured with respect to the highest point on the sample or sample holder. For example, if you are using a sample holder with retraining pins that are held in place with a screw, the head of the screw is now the highest point and should be used to measure the offset.

== Navigating to your region of interest ==
Move to your region of interest. You have several options for stage navigation:
* Dragging and dropping with the mouse in the image area
* Right-clicking on objects in the image area or stage navigation image
* The trackball
* The x/y buttons on the stage console

If you have difficulties locating your structure, you can enable the LDF mode. It will give you a larger field of view and a larger depth of focus, at the expense of imaging resolution. Please note, the LDF mode works by switching off one of the focusing lenses, so if you have LDF mode on for extended periods, you may experience drift after it is turned off. This is due to the lens heating back as current passes through its focusing coils.

== Imaging ==

=== Choice of acceleration voltage, working distance, detector, etc. ===

The choice of acceleration voltage depends on what you want to observe. That being said, the higher the acceleration voltage, the deeper into your sample the electron beam will penetrate, which can be useful e.g. for imaging through oxide layers, etc. On the other hand, if you want to perform surface imaging, you will typically want a low acceleration voltage. As a very general rule of thumb (with lots of exceptions), the working distance should match the acceleration voltage; the faster the electrons are travelling, the more difficult it is to focus them to a point over short distances away from the pole-piece.

The choice of detector depends on your working distance, tilt, etc:

* If you are using a high acceleration voltage, and thus a high working distance, or need to tilt your sample, use the LED. It is great for getting a quick image with minimal hassle, for overview images, etc.
* If you are using a low acceleration voltage, and a low working distance, use the UED; the lower the working distance, the more the pole-piece will shadow the LED, reducing the signal strength. The UED in invariably used in GB mode, which enhances the signal strength by accelerating secondary electrons away from the sample and towards the detector. The maximum GB bias is 2 kV. Note: when using the UED, there is no benefit in going closer than 3 mm; the sample holder will start interacting with the EM field from the pole-piece.
* Especially useful when you have samples composed of materials of contrasting atomic mass. It is typically used in conjunction with a working distance between 4 and 10 mm. Note: When using the BSD, you need a relatively slow scan speed with no frame averaging. More on that later.
* You can combine the signals from multiple detectors by selecting ADD in the detector drop down menu. For instance, you can combine the image from the BSD illustrating the material contrast of the sample, with a surface image from either the LED or UED.

=== Beam conditioning ===

Before you can image your structure, you will need to condition the electron beam. This involves

* focusing
* aligning the aperture (wobble)
* stigmating

You can focus using either
* the focus knob on the beam control console, or
* clicking-and-holding on the focus button above the imaging area (see below), then dragging the mouse.
:: [[File:JEOL 7800F mouse focus.png|672px]]

If the imaged moved while focusing, you'll need to align the aperture. Press the wobble button; this will move the focus up and down, and cause the image to shift back and forth. Adjust the ''x'' and ''y'' knobs to minimize the wobbling – here ''x'' affects the x-movement, etc (in contrast to other systems). Once you’re satisfied, hit the wobble button again to disable it.

Fine-tune the focus. If you notice that adjusting the focus causes the image to be stretched in one direction, and then another, it is astigmated. This distortion is a result of a non-circular beam cross-section at the sample surface, and will need to be corrected using the x and y stigmators. Using mouse-focusing: move the focus back and forth from one extreme (heavily astigmated in one direction) to another ((a) and (b) in the figure below), and find the central point where the image seems equally defocused in all directions (c). Once at this point, adjust the ''x'' or ''y'' stigmator until the focus is optimized, and then repeat the procedure for the other. This should result in an improved image (d). Fine-tune the focus again, and repeat the procedure if necessary.

[[File:JEOL 7800F stigmation.png|center|850px|Steps for improving an astigmated image.]]

=== Scan speeds and the photo button ===

In the top-left of the beam-control console, you’ll find two buttons (quick, fine), that toggle the scan speed of the beam. Alternately, you can use the two buttons in the software menu. There are four speed settings available (quick1, quick2, fine1, fine2), the exact speed of which depends on your particular user settings. To change them, open the “Operation settings” dialog in the “Settings” menu (shown below).

[[File:JEOL 7800F operation settings.png|center|650px|Operation settings dialog box.]]

Here, the quick1 and quick2 are set to fast scan speeds, with 16 frame averages. The lower the scan speed number, the shorter the beam dwell-time at each pixel. The scan speed number follows a logarithmic scale, as shown below.

[[File:JEOL 7800F scan speed chart.png|center|450px|Pixel dwell time v.s. scan speed number.]]

The "Operation settings" dialog box also dictates what happens when you hit the "Freeze" button. It can either integrate for a certain number of frames depending on whether the scan speed is "Quick" or "Fine", or it can simply freeze the frame after scanning it. In the latter case, the beam will be deflected away from the sample, so carbon will not build up on the surface while the frame is frozen. For imaging at greater resolutions than the default addressing grid of 1280 x 960 pixels, the photo button must be used, and the desired resolution chosen in the "Operation settings" dialog. Alternatively, if you're fine with the default resolution, you can freeze the frame, and then press the photo button to save the image. The software will give an estimated time required to take an image, but in general, you should use the fastest scan speed which gives you an acceptable level of noise in your image, in order to avoid distortion of your image due to drift, as well as carbon contamination, etc.

=== Contrast and brightness ===

In addition to manually adjusting the contrast and brightness knobs on the beam-control console, the system also has a automatic contrast and brightness button (ACB). It generally does a reasonable job of correctly setting the contrast and brightness, but if the image is completely underexposed (black) or overexposed (white), or completely out of focus, it might fail.

[[File:JEOL 7800F histogram.png|right|350px]] Clicking the button with the triangle symbol above the LUT button will bring up a histogram of the pixel values of the current frame (shown). You can use this histogram to correctly expose your image: the brightness controls the position of the signal, the contrast controls the width of the signal, and you should aim to use the entire dynamic range of the detector, i.e. the signal should be as wide as possible while still fitting in the histogram range.

== Unloading ==

When you're done with the SEM, turn off the beam, and retract the BSD if applicable, and then press the "Spec. Exchange" button. It will move the stage to the loading/unloading position (X,Y,R,T = 0, Z = 40 mm). Once it's done, the button will become green [[File:JEOL 7800F specimen exchange.png]] and it is safe to transfer the sample holder from the chamber to the loadlock using the loading rod as described above. Once in the loadlock, you can vent the loadlock to retrieve your sample. '''Leave the loadlock pumped down'''. Fill in the log-book, and transfer your files from the SEM PC to e.g. the ZDrive.

== Tips and tricks ==

=== Stepping and sample alignment ===

Under the "Step Control" tab in the upper right corner of PC-SEM, you can find tools for stepping predefined distances in the X, Y directions, as well as rotation. The stepping can be defined as either a physical distance, or a percentage of the frame width. Furthermore, you can align the sample to a given axis clicking on either the horizontal or vertical ruler tools, and drawing a line along the preferred horizontal/vertical axis on the imaging area. This will rotate the stage to match your input. Furthermore, under "Step control" you can save a stage position by clicking the "Addition" button. If you later want to return to this position, you can select the position from the list, and then click on "Move".

=== Restoring stage and beam conditions from previously taken image ===

In the "Image File" tab in the lower-left corner of PC-SEM, there is a dialog box which allows you to restore beam, stage, and detector conditions, acceleration voltage, magnification etc. from a previously taken image. Press browse to select the directory in which your images (as well as the sidecar .txt files). Once the images have been loaded, right click on an given image to restore the conditions it was taken under.

=== Dynamic focus ===

When imaging samples at a high tilt, you may find that the depth of focus is not sufficient. You can compensate for this by checking the "Dynamic Focus" box in the lower middle of PC-SEM, and using the tool in the drop-menu below to set the focus in two regions of your sample surface. When scanning, the SEM will use interpolation to attempt to keep the beam focused along the sample surface.

=== Refocusing after inserting the BSD ===

At some point, you will run into a situation where you want to view your sample using the BSD, but inserting it causes your focus and beam conditions to become degraded. This is due to the fact that the BSD sits very snugly against the pole-piece, and disrupts the balance between the electrostatic and magnetic focusing. In order to restore your focus, use the "Focus Correct" slider at the bottom of the software to restore the balance between the two focusing mechanisms. Note that there is a slight hysteresis in the slider, and that the optimal focus may lie somewhere between two steps.

=== Probe current ===

The probe current can be set using the spin box below the imaging area. The lower the probe current, the smaller the spot-size of the electron beam, and thus, the smaller the features you should be able to resolve. However, decreasing the probe current comes at the cost of a reduced signal-to-noise ratio, and thus there exists a trade-off relationship between signal and resolution. You can mitigate this to an extent by decreasing the scan-speed, but then drift may become an issue. In general, use the following to guide your choice of probe current:

# ultra high resolution: 3-5 (usually only with gentle beam on)
# high resolution: 6
# standard: 8
# overview: 10

The probe current number relates logarithmically to the actual current as shown in the following graph:

[[File:JEOL 7800F probe current chart.png|center|450px|Probe current v.s. probe current number.]]

=== Focus ranges ===

There are two focusing regimes in the SEM; At working distances below ~5.5 mm, the beam will be focused with both an electrostatic and magnetic lens system. Above this working distance, the electrostatic lens is switched off. There is thus a discontinuity at this switching point, and is clearly visible as a "jump" in the image, and you should thus avoid positioning your sample surface there.

== Troubleshooting ==
; Photo button doesn't work?
: Restart PC.
; Drifty image?
: Chiller water needs to be topped up. Contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].

== Remote access ==
* TeamViewer: JEOL7800F
* LogMeIn: JEOL7800F_XFER_PC (BASEMENT)

== Resources ==

[[media:Invitation_to_the_SEM_World.pdf|Invitation to the SEM world]]

[[media:JEOL_Guide_to_SMO.pdf|A guide to scanning microscope observation (JEOL)]]

[[media:Hitachi_SEM_user_guide.pdf|Hitachi SEM user guide (2007)]]

[[Category:Tools]]
[[Category:Characterization]]

MBE

2025-11-07T19:57:50Z

Zhe:

{{Infobox tool
|image = Tool MBE.jpg
|toolfullname = Varian GEN II
|company = Custom
|description = Molecular beam epitaxy system
|location = MBE lab (03.2.213A, 03.2.217, 03.2.217A)
|primary = Martin
|secondary = Harry
}}
== General information ==

The MBE system is a materials research and development facility located at HCØ, owned by NBI/KU.

Our MBE lab is located on the 2nd floor in rooms 3-2-213A, 3-2-217 and 3-2-217A.

The system is a Varian GEN II with a 3" substrate capability. The III-V growth chamber has eight sources with the following materials.

{| style="width: 85%;"
|- style="text-align:left;"
! Group V !! Group III !! Dopants !! Other
|- valign="top"
| style="width: 20%;" |
As and Sb

| style="width: 20%;" |
Ga, Al and In

| style="width: 20%;" |
Si and Be

| style="width: 20%;" |
Au

|}

The system also has a UHV metallization chamber attached equipped with a 6-pocket e-gun and a RF sputter source.

The principal investigator (PI) in charge of the NBI facility is Prof. [http://www.nbi.ku.dk/english/staff/?pure=en/persons/67039 Jesper Nygård].

[http://www.nbi.ku.dk/ansatte/?pure=da/persons/79214 Claus B. Sørensen] is technical head of the lab.

== MBE activities meetings ==
MBE activities and changes of procedures are discussed at open group meetings (typically the weekly MBE/Materials subgroup meeting at QDev) where the technical head is often present.

== Access to the system ==

New users should be approved by the local management and must receive basic training by the technical head or a person appointed by the technical head before working on the system. Further, new users must have completed the cleanroom safety course before signing up for MBE training and gaining access to the MBE lab. The number of persons trained and allowed to use the MBE is limited in nature due to the complexity of operation.

Requests for cleanroom training must be mailed to [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]

== Training ==

Requests for MBE training must be addressed to:

Jesper Nygård: [mailto:nygard@nbi.ku.dk nygard@nbi.ku.dk]

Martin Saurbrey Bjergfelt: [mailto:martin.bjergfelt@nbi.ku.dk martin.bjergfelt@nbi.ku.dk]

== Access to room ==

Following completion of cleanroom and MBE training, access to the lab is granted by mailing your KU access card number and your contact details (mobile phone number and email) to:

Jesper Nygård: [mailto:nygard@nbi.ku.dk nygard@nbi.ku.dk]

Martin Saurbrey Bjergfelt: [mailto:martin.bjergfelt@nbi.ku.dk martin.bjergfelt@nbi.ku.dk]

== Scheduling-Booking the system ==

All use of the system must be booked using the cleanroom [http://cleanroom.brickhost.com/ tool booking page].

A system for handling project (alias) and planned growths (materials) may become effective in 2018 to facilitate planning and invoicing.

== Cleanroom attire ==

'''Entering the MBE lab.'''

Please make sure that only one door in the airlock is open at a time to keep the room clean. The MBE room is an ISO 6/7 room and the prep-room is ISO 5/6.

# '''Before''' entering the gowning area: ''wear clogs''
# '''Inside''' the gowning area you must put on the following:
## ''A cleanroom lab gown or a full cleanroom suit ''
## ''Hairnet''
## ''Beard cover (if applicable)''

'''Entering the preparation room'''

'''Before''' entering the preparation room, you must additionally: ''put on nitrile gloves''

== Safety ==

'''Oxygen depletion hazard'''

The MBE system is cooled by a closed loop liquid nitrogen system with a direct connection to the storage tank on the street. As nitrogen act as an asphyxiant, the oxygen level in the room is monitored to ensure that no risk of oxygen depletion can occur.

Should the oxygen level drop below the alarm value, the alarm will sound and flash.

You must evacuate the room immediately and notify Science Campus Service and one of the named staff members below.

Ensure that no one enters the room, block access!

If the alarm is active when you arrive, do not enter.

If needed, an emergency self-contained breathing apparatus is available on the 2nd floor on the wall across from room 03-2-214

'''Fire alarm'''

The MBE lab also has an early fire warning system if smoke is detected in the corridor on the second floor.

Should smoke be detected in the corridor, the alarm will sound and flash.

You must evacuate the room immediately and notify Science Campus Service and one of the named staff members below.

{| style="width: 85%;"
|- style="text-align:left;"
! Martin Saurbrey Bjergfelt !! Nader Payami !! Science Campus Service helpdesk
|- valign="top"
| style="width: 20%;" |
Phone: 2875 0449

Mail: [mailto:martin.bjergfelt@nbi.ku.dk martin.bjergfelt@nbi.ku.dk]

| style="width: 20%;" |
Phone: 23 81 08 93

Mail: [mailto:nap@nbi.ku.dk nap@nbi.ku.dk]
| style="width: 20%;" |
Phone: 3533 1333

Mail: [mailto:scshelpdesk@science.ku.dk scshelpdesk@science.ku.dk]
|}

== Chemical and materials safety ==

All safety procedures in the cleanroom also applies in the MBE-lab. It is mandatory for users to familiarize themselves with the Materials Safety Data Sheets (MSDS) and observe good laboratory praxis.

''Double gloving''

Before starting to handle wafers, substrate holders or chemicals a second pair of nitrile gloves must be put on.

''Wafers''

Arsenic containing substrates must be handled using clean tweezers and kept in suitable wafer trays or boxes when taken out of the MBE lab. Wafer and sample storage outside of the cleanroom or MBE must be kept locked.

Full wafers and ready cut pieces are generally safe to handle when As containing dust particles are not generated.

When mounting and handling substrate holders the local point exhaust must be turned on and placed as close to the workplace as possible.

''Fumehood''

The fumehood must be used at all times when processing substrates (solvent cleaning, etching etch)

''Contaminated and solid waste''

All gloves, wipes, substrate pieces etc that are suspected to be contaminated or known to contain hazardous materials must be disposed of in the special risk waste bins.

''Chemicals''

Waste chemicals must be handled in a similar way as in the cleanroom using designated waste cans.

== Logbook and system-traceability ==

As meticulous traceability is vital, all users must complete the MBE logs and store growth recipes on the dedicated data storage units. Further, a system for storing post-growth characterization data is under development (2018).

# Growth recipes should be stored in the MBE Molly control system
# Each growth is entered in the dedicated excel sheet on the MBE PC and the sheet is stored in a designated Dropbox

== Materials ==

As MBE growth of semiconductors depends heavily on the cleanliness of the system, extreme caution must be paid to keeping the system clean.

Only materials and cleaning procedures approved must be used on substrates that are intended for use in the MBE system.

Prior to using any new materials or cleaning procedures on substrates these must be approved by the technical head.

The following substrates are approved in an Epi ready state:

GaAs, InAs, GaSb, InSb, InP and Si.

All substrates much be acquired from an approved, well-known source in high quality.

Processed substrates must be free of any organic contaminants and thoroughly cleaned by oxygen plasma ashing and HF dipping prior to loading. During degassing of processed substrates the massspectrum of the residual gasses must be observed both in the load lock and subsequent in the buffer chamber. If any sign of organic or other unwanted contaminants show up, degassing must be stopped immediately and the substrate unloaded.

Substrates have a long lead-time so please pay attention to the stock and give a heads up in good time before stock becomes low.

== Operating the system ==

Cleanliness and vacuum integrity are key parameters for growing clean epi layers and attention must be paid to this at all times. Do not rush a sample through but wait for the chambers to reach the threshold vacuum values before transfer between chambers.

== Service and maintenance ==

The users are no allowed to perform any maintenance or service on the system unless approved by the technical head.

The only chamber that users are allowed to vent is the Load lock chamber.

== Problems and incidents ==

We encourage users to report all problems or incidents. Using a complex system like the MBE, will from time to time result in mistakes and unintentional incidents. We all learn from this and the best way to keep the system in a good operational state is to ask for help when needed!

Thus, should you experience any problems with the system, these must be reported to the technical head immediately.

In case of incidents including dropped or "hanging" sample holders please do not attempt to fix this but try to leave the system in a best possible safe state and report to the technical head.

Last revision: July 2018.

[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2025-11-07T19:55:21Z

Zhe:

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Harry
|secondary = Martin
}}
There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular 2" DC sputtering target, one 2" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side. Oxidation chamber on the loadlock.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2024 July 2):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
! Thickness limit
|-
| 1
| Al
| Intermetallic
|
|-
| 2
| Ti1
| Fabmate
|
|-
| 3
| Au1
| Tungsten
|
|-
| 4
| Au2
| Tungsten
|
|-
| 5
| Ti2
| Fabmate
|
|-
| 6
| Pt
| FabMate
| 200 nm*
|
|-
| DC1
| W
| --
|
|-
| DC2
| Nb2Ti1
| --
|-
|
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
! Thickness limit
|-
| 1
| Au
| Tungsten
|
|-
| 2
| Titanium
| FabMate
|
|-
| 3
| Al
| Intermetallic
|
|-
| 4
| Pd
| intermetallic
|
|-
| 5
| Ge
| FabMate
|
|-
| 6
| Pt
| FabMate
| 200 nm*
|-
| DC1
| V
| --
|
|-
| RF2
| V3Si
| --
|
|-
| RF3
| Nb2Ti1
| --
|
|-
|}
|-
|}

*If you need to deposit a thicker layer, you need to book enough time for the cryo pump to reach base temperature before continuing with a second layer.

=== Other available materials ===
'''Evaporation''': SiO2, MgB2, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb2Ti1, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si3N4, Ta, Nb4Ti1, Nb

There is a big compatibility chart next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

The chart is also available [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm online].

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
*; Important note for AJA2:
*: If your entire process ends with Au deposition, use the dedicated Au sample holder. If your process ends with anything else, use the generic sample holder. This ensures that the surface on the Au sample holder remains consistent. This is important for RF substrate milling.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample.
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the power stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo VAT valve ( Adaptive pressure controller ) .
# Open the loadloack valve.
# Open Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool). Just press and release switch .
# Open nitrogen vent valve on the back left of the cryo.
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close roughing pump to turbo (screw valve under the loadlock turbo)
# Open roughing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo ( wall switch) . Please check compressor as well .
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo VAT valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

Heidelberg µPG 501

2025-11-07T19:53:33Z

Zhe:

{{Infobox tool
|image = Tool Heidelberg.jpg
|toolfullname = Heidelberg µPG 501
|website = http://www.himt.de
|company = Heidelberg Instruments
|description = Table-top maskless aligner
|location = Cleanroom 2
|primary = Nader
|secondary = Harry
|manual = Digital copies on instrument PC desktop
}}

The Heidelberg μPG 501 is a tabletop maskless (i.e. direct-write) ultra-violet photolithography system.
It utilizes a 10 W light emitting diode operating at 390 nm, a 600×800 pixel [https://en.wikipedia.org/wiki/Digital_micromirror_device digital micromirror device], and motorized stage to expose patterns on resist-coated substrates.
The system has a writing speed of 50 mm2/min for the resist [[AZ 1505]] on silicon with a resolution limit of 1 µm, and is therefore well suited for rapid prototyping, as well as for writing large structures that are otherwise too time consuming for [[Lithography glossary|EBL]].
The Heidelberg is compatible with [https://en.wikipedia.org/wiki/AutoCAD_DXF DXF], [https://en.wikipedia.org/wiki/GDSII GDSII], and [https://en.wikipedia.org/wiki/Caltech_Intermediate_Form CIF] [[Lithography glossary|CAD]] files.
The main instrument PC is offline, but it's connected on an online design PC.
The two share a screen, mouse, and keyboard, but you can switch between the two PCs by pressing <code>ctrl, ctrl, enter</code>.

== Specifications ==

* LED emission wavelength: 390 nm
* LED power: 10 W
* Exposure range: 4 ms to 90 s
* Maximum substrate size: 6 × 6 inches2 (152.5 × 152.5 mm2)
* Minimum substrate size: 6 × 6 mm2
* Maximum writing area: 125 × 125 mm2
* Substrate thickness: 0 to 6 mm
* Substrates with thickness variations of below ± 20 µm are recommended

== Operating instructions ==
Video on how to operate the Heidelberg μPG 501:

[[File:UPG501.mp4|500px]]

[https://www.youtube.com/watch?v=v4h6W5l18i0 Click here to watch the video on YouTube]

You can read an extensive guide in this [https://wiki.nbi.ku.dk/w/cleanroom/images/7/70/Manual_upg.pdf pdf].
=== Measure the diode intensity ===
# Make sure the stage is empty.
# From the 'µPG 501 menu', select 'Tools', and then 'Intens. diode'.
# Follow the on-screen instructions. The intensity of the diode will be measured at 40°C. '''Enter the measured value into the logbook on the design PC.'''

=== Load your chip ===
# Press 'Load substrate' in the software menu. The stage will be moved into the loading position, and a software dialog box will open.
# Open the dust cover.
# Place your chip or substrate on the center of the stage, over the four small vacuum holes. Please note the orientation of the coordinate system; the ''x'' direction points outwards from the front of the instrument.
# Enable the vacuum, by toggling the vacuum switch. Make sure your sample is firmly fixed in place. For larger substrates (e.g. 2 inch wafers or larger), you may need to enable suction on additional vacuum regions. Talk to a [[About|cleanroom staff]] member if that is the case.
# Close the dust cover.
# Press OK in the software dialog box. The stage will be moved to it's home position, and another dialog box will open.
# Make sure that the substrate is below the writehead (metallic disc with red light emanating from the center). Not doing so may cause the writehead to be driven into the sample during the next step, potentially severely damaging the system.
# Press 'yes' in the dialog box for pneumatic focusing (recommended, but requires a distance of approx. 3 mm to the edge of the sample), or 'no' for optical focusing (use for small samples, or when writing close the sample edges).

=== Design conversion ===

# Copy your design file to the design PC.
# On the instrument PC, copy to the design file to the correct path depending on the design format (e.g. C:\HIMT\designs\dxf, etc).
# Select 'Start Conversion Interface' in the 'µPG 501 menu'
# Create a new job file, by selecting 'File' and 'New' in the conversion interface. Use job file name along the lines of NAME_DATE.
# Work through the conversion interface. If you plan on performing an alignment exposure, remember to uncheck 'Automatic Centering', and press the 'Reset' button.
# Finish converting your design by clicking 'Complete Tasks' and then 'Complete Expose Jobs'.

=== Exposure ===
# Click 'Select Design' in the 'µPG 501 menu', and select your converted file (e.g. C:\HIMT\LICSource\<<Your job name>>\expose.cfg).
# In the right panel of the 'µPG 501 menu', under 'Exposure mode', select the type of exposure you want.
## 'Standard Exposure': For blank chips
## 'Alignment': For aligning exposures to e.g. chip edges, crosses, etc.
## 'Target Mode': Allows users to draw squares to be exposed.
# Press 'Next'
# Set your exposure time and defocus (e.g. obtained from a dose test). For an alignment exposure, locate the features (e.g. crosses) that you wish to align to, and enter their corresponding design coordinates.
# Start the exposure. A progress bar will be shown along with the time remaining.
# Fill out the log book.

== Preparing a dose test ==
The 'µPG 501 menu' software makes it easy to perform a dose test for a given combination of e.g. resist, substrate, developer, bake-out time and temperature. Two parameters can be varied; the exposure time and the defocusing. If you vary both of them, you'll end up with a two-dimensional grid pattern, where the exposure time increases from top to bottom, and the defocusing increases from left to right. Depending on your design pattern, consider inserting a dummy structure to help you identify the orientation of your dose test later on.
# Start by selecting the design pattern (press 'Select Design' in the menu).
# Then select 'Control Panel' from the 'Tool' menu. This brings up a separate window with the title 'Panel'.
# Select the 'Series' tab.
# Enter your desired dose test parameters, and the step size of the dose test grid. The step size must be larger than your pattern dimensions.
# Press 'Start Exposure Series'.
# After developing your dose test, find the best combination of exposure time and defocusing for your particular design pattern.

== Improving the overlay accuracy ==

The Heidelberg's stage is not calibrated to an absolute length (e.g. NIST) scale. As a result, when performing overlay exposures over patterns written with other instruments, such as the Elionix, the design pattern must be scaled in both the ''x'' and ''y'' dimensions for the length scales to match. This can be easily done in the conversion interface. For some use cases, this will yield an acceptable overlay accuracy, but for more demanding scenarios, further corrections must be made.

The stage's ''x'' and ''y'' axes are not perfectly orthogonal to each other, but rather the angle between the two is approx. 89.996°. This leads to a skewing of the written pattern, and the larger its size, the greater the overlay error becomes. This problem can be circumvented by 'pre-distorting' the design file, so that when written, it will yield the intended design. This can be done using the following steps:

# Open your design in CleWin.
# Make sure the full design is in a single hierarchical cell (i.e. is flat). If not, flatten it.
# Save it as a DXF file.
# Open the program 'Coordinate Adjustment' on the desktop of the design PC.
# Open your newly created DXF file.
# Select a name for the converted file.
# Start the conversion. The pattern will be 'pre-distorted' using the measured parameters shown below. These need to be periodically measured.
# Perform an overlay exposure as per usual, using the pre-distorted file. However, the coordinates of your reference structures (e.g. crosses) should be the ones from your original design file.

== Troubleshooting ==
; Alignment doesn't work?
: Perhaps the configuration file randomly disappeared. Follow the guide on the desktop in order to restore it.
== Remote access ==
* TeamViewer: uPG_501
* LogMeIn: HEIDELBERG TRANSFER (CR2)
[[Category:Tools]]
[[Category:Lithography]]

Raith eLine

2025-11-07T19:51:49Z

Zhe:

{{Infobox tool
|image = Tool eline.jpg
|toolfullname = Raith eLine
|website = https://www.raith.com/
|company = Raith Nanofabrication
|description = Electron beam lithography and microscopy system
|location = Cleanroom (03.2.209C)
|primary = Zhe
|secondary = Nader
}}
Raith eLine is a variable acceleration voltage (up to 30 kV) scanning electron microscope/lithography tool.
Nowadays most e-beam lithography needs are covered by [[Elionix 7000]] and [[Elionix F-125]], so this machine is primarily used for imaging.
It is very convenient to set up automated image acquisition using imaging scripts inside of a position list with coordinates.
You can also import your device design (GDS) and use it as a map.
There is an automatic height sensing (AHS) upgrade installed.

Other lithography tools at the [[Main Page|NBI cleanroom]]:
* [[Elionix 7000]], 100 kV EBL
* [[Elionix F-125]], 125 kV EBL at QuanTech
* [[Heidelberg µPG 501]] LED writer
* [[Süss mask aligner]]

Other SEM imaging tools:
* [[JEOL 7800F]]
* [[JEOL 7800F prime]] at QuanTech

== eLine usage and reservation guidelines ==
* To book time on the machine go to the [http://cleanroom.brickhost.com/Web/schedule.php web schedule]. You should make a booking in the system, even if the machine is available and not booked by others.
* Late cancellations of sessions that you’ve signed up should only happen when unforeseen conflicts or unexpected fab difficulties occur. Please do not sign up to use equipment unless you are prepared and have every intention of using the time.
<blockquote style="background-color: #F0F0F0; border: dashed thin grey;">
If you don't have an account write to the cleanroom staff ([mailto:cleanroom@nbi.dk cleanroom@nbi.dk]) and we will provide you with username and password.
</blockquote>
* Use the dedicated SEM (JEOL) for microscopy, unless the e_Line is really needed. Ask for SEM training if needed.
* Between the hours of 9 am and 6 pm on weekdays, you should:
** not reserve more than 3 hours. See (*)
** not book a 2nd slot, before the 1st one is done. See (*)
** delete booking only before the starting time.
** write to the experiment mailing list that the machine is free, if you finish earlier.
(*) Some NW wafer exposures take longer and exceptions to these rules are made to accommodate these tasks. A special account '''NW-MBE''' is used in the booking system to indicate these jobs.
* Please talk to a [[About|staff member]] if you have fab jobs that are not compatible with the rules above

== Troubleshooting ==

; Error regarding failed 5V supply during EM server software startup?
: Normal and harmless.

== Maintenance ==
=== Beam stability test ===
# Gun monitor software: start, change interval to 5-15 s
# SEM software: EHT ON
# WD 10 mm
# View > SEM status, save screenshot of this window
# ELINE software: move to Faraday cup
# 5w
# Start script ''beamstability.js'' (user ''Administrator'' folder ''Scripts'')

=== Closing the CCV ===
Needed when preparing for CDA or power shutdown.

SEM software > open right hand menu > Airlock > Close CCV

== Remote access ==
* TeamViewer: ELINE
* LogMeIn: ELINE

[[Category:Tools]]
[[Category:Lithography]]
[[Category:Characterization]]

Main Page

2025-11-07T19:50:57Z

Zhe:

'''Welcome to the NBI Cleanroom wiki!'''

This site contains public information for the users of the cleanroom and related facilities. All items are available '''without login'''. Internal information that should not be disclosed can be posted at the password protected [https://wiki.nbi.ku.dk/qdevwiki/Main_Page QDev wiki].

{| style="width: 60%;" align="center"
|- style="text-align:center;"
|[[File:Tools_button.png|100px|link=Tools|Tools]] || [[File:Safety_button.png|100px|link=Safety|Safety]] || [[File:Fabrication_button.png|100px|link=Fabrication|Fabrication]] || [[File:Calendar_button.png|100px|link=http://cleanroom.brickhost.com/|Calendar]] || [[File:Training ico.png|100px|link=Training|Training]] || [[File:Info_button.png|100px|link=About|About]] || [[File:MBE.png|90px|link=MBE|MBE]] || [[File:sustain.png|90px|link=Sustainability|Sustainability]]
|- style="text-align:center;"
| Tools || Safety || Fabrication || Booking || Training || About || MBE || Sustainability
|}

==Current tool status==

{| cellspacing=0px style="text-align: left;"
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|Heidelberg LED writer]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|Raith eLine 30 kV]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_7000|Elionix 7000 100 kV]]
| style="background-color: #FFD700" | Waiting for a quotation for new Dovetails on multipiece stage holder. [estimated service: Week 45]
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_F-125|Elionix F-125 125 kV]]
| style="background-color: #ff9f9f" | Annual service & gun fillament exchange. [down time: Weeks 45 and 46]
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (e-gun)]]
| style="background-color: #ff9f9f" | The bellow of the e-gun has a vacuum leak (verified with He test). Has been sent to the US for repair. Scheduled for evaluation in factory: Week 45.[estimated return: Week 50]
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (milling and sputtering)]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Plassys Evaporator]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator]]
| style="background-color: #c6e0b4" | All good! Available materials In (x2), SiOx
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD1]]
| style="background-color: #FFD700" | Waiting for a new venting MAC valve from buch & holm [estimated service: Week 45]. System can be used but ask Harry to help you with loading if you have issues.
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD2]]
| style="background-color: #c6e0b4" | All good! [Scheduled servicing of the scroll pump: Week 47]
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[FS bonder]]
| style="background-color: #c6e0b4" | All good! ''' Please return the hex Wera screwdrivers'''. The primary bondhead (SN:004) is in the factory for servicing [estimated return: end of Week 46]. Once we receive it back, we will set up a bondhead with Au wire!
|-
| style="text-align:right; padding-right:6px;" | [[K&S bonder]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #FFD700" | Dual PC is not working, the tool is okay to use with a single operating PC
|-
| style="text-align:right; padding-right:6px;" | [[Dicing saw]]
| style="background-color: #c6e0b4" | All good!
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #ff9f9f" | System down. Planning to send parts for repair. Estimated lead time: min. 4 weeks.
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F|JEOL JSM-7800F prime]]
| style="background-color: #c6e0b4" | All good!
|}

''List updated: Wed 5 Nov 2025''

About

2023-09-29T08:09:19Z

Zhe: /* Staff */

== Cleanroom meetings ==

The [[Main Page|cleanroom]] staff and stake holders usually meet on Fridays at 12:30pm (HCØ 1st floor, room 03-1-114).
Users who have special requests or would like to discuss a cleanroom issue can join such a meeting; contact staff or drop by.

== Staff ==

{| class="wikitable"
|-
! Name
! Position
! Office
! Phone
! Email
|-
| Claus B. Sørensen
| Technical head
| 03.02.216
| 28 75 04 49
| [mailto:cbs@nbi.ku.dk cbs@nbi.ku.dk]
|-
| Martin Saurbrey Bjergfelt
| Cleanroom Manager
| 03.2.212
| 23 81 08 93
| [mailto:martin.bjergfelt@nbi.ku.dk martin.bjergfelt@nbi.ku.dk]
|-
| Nader Payami
| Chemical process engineer
| 03.2.214
| 28 75 04 50
| [mailto:nap@nbi.ku.dk nap@nbi.ku.dk]
|-
| Smitha Nair Themadath
| Process Specialist
| 03.2.212
| 50 38 07 12
| [mailto:smitha.nair@nbi.ku.dk smitha.nair@nbi.ku.dk]
|-
| Zhe Liu
| Process Specialist
| 03.2.214
| 52 82 55 55
| [mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk]
|-
| Marianne Lund Jensen
| Laborant
| 03.3.
| 40 49 90 37
| [mailto:mljensen@nbi.ku.dk mljensen@nbi.ku.dk]
|-
| Henriette Lerche
| safety coordinator
| Blegdamsvej 17, Ka1
| 51 29 83 37
| [mailto:hlerche@nbi.ku.dk hlerche@nbi.ku.dk]
|-
| Charles Marcus
| Professor
| 03.4.406
| 20 34 11 81
| [mailto:marcus@nbi.ku.dk marcus@nbi.ku.dk]
|-
| Jesper Nygård
| Professor
| 03.4.410
| 24 62 61 20
| [mailto:nygard@nbi.ku.dk nygard@nbi.ku.dk]
|}

== Pricing ==
Current price lists as of 2022 April 1:
* [[Media:NBI cleanroom price list 1st April 2023.pdf|NBI-owned tools]]
* [[Media:Quantech pricing information January 2023.pdf|QuanTech-owned tools]]

About

2023-09-29T08:08:39Z

Zhe: /* Staff */

== Cleanroom meetings ==

The [[Main Page|cleanroom]] staff and stake holders usually meet on Fridays at 12:30pm (HCØ 1st floor, room 03-1-114).
Users who have special requests or would like to discuss a cleanroom issue can join such a meeting; contact staff or drop by.

== Staff ==

{| class="wikitable"
|-
! Name
! Position
! Office
! Phone
! Email
|-
| Claus B. Sørensen
| Technical head
| 03.02.216
| 28 75 04 49
| [mailto:cbs@nbi.ku.dk cbs@nbi.ku.dk]
|-
| Martin Saurbrey Bjergfelt
| Cleanroom Manager
| 03.2.212
| 23 81 08 93
| [mailto:martin.bjergfelt@nbi.ku.dk martin.bjergfelt@nbi.ku.dk]
|-
| Nader Payami
| Chemical process engineer
| 03.2.214
| 28 75 04 50
| [mailto:nap@nbi.ku.dk nap@nbi.ku.dk]
|-
| Smitha Nair Themadath
| Senior Research Associate
| 03.2.212
| 50 38 07 12
| [mailto:smitha.nair@nbi.ku.dk smitha.nair@nbi.ku.dk]
|-
| Zhe Liu
| Process Specialist
| 03.2.214
| 52 82 55 55
| [mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk]
|-
| Marianne Lund Jensen
| Laborant
| 03.3.
| 40 49 90 37
| [mailto:mljensen@nbi.ku.dk mljensen@nbi.ku.dk]
|-
| Henriette Lerche
| safety coordinator
| Blegdamsvej 17, Ka1
| 51 29 83 37
| [mailto:hlerche@nbi.ku.dk hlerche@nbi.ku.dk]
|-
| Charles Marcus
| Professor
| 03.4.406
| 20 34 11 81
| [mailto:marcus@nbi.ku.dk marcus@nbi.ku.dk]
|-
| Jesper Nygård
| Professor
| 03.4.410
| 24 62 61 20
| [mailto:nygard@nbi.ku.dk nygard@nbi.ku.dk]
|}

== Pricing ==
Current price lists as of 2022 April 1:
* [[Media:NBI cleanroom price list 1st April 2023.pdf|NBI-owned tools]]
* [[Media:Quantech pricing information January 2023.pdf|QuanTech-owned tools]]

AJA systems

2023-07-28T09:44:44Z

Zhe: /* Cryo pump regeneration */

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Smitha
|secondary = Martin
}}
There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular 2" DC sputtering target, one 2" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side. Oxidation chamber on the loadlock.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2023January 02):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Al
| Intermetallic
|-
| 2
| Ti1
| Fabmate
|-
| 3
| Au1
| Tungsten
|-
| 4
| Au2
| Tungsten
|-
| 5
| Ti2
| Fabmate
|-
| 6
| SiO2
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| Tungsten
|-
| 2
| Titanium
| FabMate
|-
| 3
| Al
| Intermetallic
|-
| 4
| Pd
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

=== Other available materials ===
'''Evaporation''': SiO2, MgB2, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb2Ti1, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si3N4, Ta, Nb4Ti1, Nb

There is a big compatibility chart next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

The chart is also available [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm online].

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
*; Important note for AJA2:
*: If your entire process ends with Au deposition, use the dedicated Au sample holder. If your process ends with anything else, use the generic sample holder. This ensures that the surface on the Au sample holder remains consistent. This is important for RF substrate milling.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample.
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the power stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo VAT valve ( Adaptive pressure controller ) .
# Open the loadloack valve.
# Open Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool). Just press and release switch .
# Open nitrogen vent valve on the back left of the cryo.
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close roughing pump to turbo (screw valve under the loadlock turbo)
# Open roughing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo ( wall switch) . Please check compressor as well .
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo VAT valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

Plassys Evaporator

2023-06-20T09:16:00Z

Zhe: /* Overview */

== Overview ==

Physical vapor deposition tool of aluminum via e-beam evaporation for Josephson junction fabrication.
It also provides an ion gun for surface preparation and etching purposes.
The system has the capability of in-situ oxidation .

Film Quality : Surface roughness - 1.6 nm for 100nm thick film ( scan area 2 um /AFM Analysis ( June 2023)

== Currently loaded materials ==

{|
|-
|
{| class="wikitable"
|-
! Crucible position
! Material
! Comment
|-
| 1
| Ti
| Plassys ( currently In Use)
|-
| 2
| Al
| Plassys ( Material consumed)
|-
| 3
| Al
| Melted. Currently In Use
|-
| 4
| Al
| new pellets. Not melted
|}

== Substrates allowed ==

Silicon and Sapphire only

Plassys Evaporator

2023-06-20T09:15:08Z

Zhe: /* Overview */

== Overview ==

Physical vapor deposition tool of aluminum via e-beam evaporation for Josephson junction fabrication.
It also provides an ion gun for surface preparation and etching purposes.
The system has the capability of in-situ oxidation .

Film Quality : AFM Analysis ( June 2023) for surface roughness is 1.6 nm for 100nm thick film ( scan area 2 um)

== Currently loaded materials ==

{|
|-
|
{| class="wikitable"
|-
! Crucible position
! Material
! Comment
|-
| 1
| Ti
| Plassys ( currently In Use)
|-
| 2
| Al
| Plassys ( Material consumed)
|-
| 3
| Al
| Melted. Currently In Use
|-
| 4
| Al
| new pellets. Not melted
|}

== Substrates allowed ==

Silicon and Sapphire only

Plassys Evaporator

2023-06-20T09:14:39Z

Zhe: /* Overview */

== Overview ==

Physical vapor deposition tool of aluminum via e-beam evaporation for Josephson junction fabrication.
It also provides an ion gun for surface preparation and etching purposes.
The system has the capability of in-situ oxidation .

Film Quality : AFM Analysis for surface roughness is 1.6 nm for 100nm thickness film ( scan area 2 um)

== Currently loaded materials ==

{|
|-
|
{| class="wikitable"
|-
! Crucible position
! Material
! Comment
|-
| 1
| Ti
| Plassys ( currently In Use)
|-
| 2
| Al
| Plassys ( Material consumed)
|-
| 3
| Al
| Melted. Currently In Use
|-
| 4
| Al
| new pellets. Not melted
|}

== Substrates allowed ==

Silicon and Sapphire only

Plassys Evaporator

2023-06-20T09:07:36Z

Zhe: /* Currently loaded materials */

== Overview ==

Plassys system is for thin film deposition by electron beam evaporation. It also provides an ion gun for surface preparation and etching purposes.
The system has the capability of in-situ oxidation .

== Currently loaded materials ==

{|
|-
|
{| class="wikitable"
|-
! Crucible position
! Material
! Comment
|-
| 1
| Ti
| Plassys ( currently In Use)
|-
| 2
| Al
| Plassys ( Material consumed)
|-
| 3
| Al
| Melted. Currently In Use
|-
| 4
| Al
| new pellets. Not melted
|}

== Substrates allowed ==

Silicon and Sapphire only

Plassys Evaporator

2023-06-20T09:07:14Z

Zhe: /* Currently loaded materials */

== Overview ==

Plassys system is for thin film deposition by electron beam evaporation. It also provides an ion gun for surface preparation and etching purposes.
The system has the capability of in-situ oxidation .

== Currently loaded materials ==

The materials currently available for deposition are :
Ti ( crucible 1 ) and Al ( crucible 2)

{|
|-
|
{| class="wikitable"
|-
! Crucible position
! Material
! Comment
|-
| 1
| Ti
| Plassys ( currently In Use)
|-
| 2
| Al
| Plassys ( Material consumed)
|-
| 3
| Al
| Melted. Currently In Use
|-
| 4
| Al
| new pellets. Not melted
|}

== Substrates allowed ==

Silicon and Sapphire only

Plassys Evaporator

2023-05-30T09:32:58Z

Zhe:

Plassys Evaporator

2023-05-23T13:25:39Z

Zhe: /* Currently loaded materials */

Plassys Evaporator

2023-05-23T13:24:26Z

Zhe: /* Overview */

== Overview ==

Plassys system is for thin film deposition by electron beam evaporation. It also provides an ion gun for surface preparation and etching purposes.
The system has the capability of in-situ oxidation .

== Currently loaded materials ==

The materials currently available for deposition are :

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Al
| Intermetallic
|-
| 2
| Ti1
| Fabmate
|-
| 3
| Au1
| Tungsten
|-
| 4
| Au2
| Tungsten
|-
| 5
| Ti2
| Fabmate
|-
| 6
| SiO2
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| Tungsten
|-
| 2
| Titanium
| FabMate
|-
| 3
| Al
| Intermetallic
|-
| 4
| Pd
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

Plassys Evaporator

2023-05-23T13:22:53Z

Zhe: Created page with "== Overview == Plassys system is for thin film deposition by electron beam evaporation. It also provides an ion gun for surface preparation and etching purposes. The system..."

Tools

2023-05-23T13:09:15Z

Zhe: /* Tool list */

A prerequisite for using the cleanroom tools is that a cleanroom staff member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the [[Training|training]] page and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].]
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system]. However, after a certain period of inactivity on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Tool list ==
{| style="width: 85%;"
|- style="text-align:left;"
! Lithography !! Thin film & III-Vs !! Characterization !! Other
|- valign="top"
| style="width: 20%;" |
* [[Heidelberg µPG 501|Heidelberg LED writer]]
* [[Süss mask aligner]]
* [[Raith eLine|Raith eLine 30 kV EBL/SEM]]
* [[Elionix_7000|Elionix 7000 100 kV EBL]]
* [[Elionix_F-125|Elionix F-125 125kV EBL]] (QuanTech)
| style="width: 20%;" |
* [[AJA systems]]
* [[Plassys Evaporator]]
* [[E-Gun evaporator]]
* [[Edwards evaporator|Edwards thermal evaporator]]
* [[Laurell spinners]]
* [[Cambridge ALD]]
* [[Leica sputter coater]]
* [[MBE]]
| style="width: 20%;" |
* [[JEOL 6320F|JEOL JSM-6320F]]
* [[JEOL 7800F|JEOL JSM-7800F]]
* [[Raith eLine]]
* [[Philips TEM]]
* [[Tencor profilometer]]
* [[Alpha-SE ellipsometer]]

* [[Olympus microscopes]]
* [[Lynx EVO stereomicroscope]]
* [[Bruker Dimension Icon AFM]]
* [[Filmetrics reflectometer]]
* [[Probe station]]
| style="width: 20%;" |
* [[Süss scriber|Manual Süss scriber]]
* [[Loomis scriber|Automatic Loomis scriber]]
* [[Dicing saw]]
* [[AccuThermo RTA]]
* [[Plasma-Preen asher]]
* [[Diener plasma asher]]
* [[Tergeo plasma asher]]
* [[FS bonder]]

* [[Micromanipulator]]
* [[Präzitherm hotplates]]
* [[Critical point dryer]]
|}

== Tool access requirement guidelines ==

{| cellspacing=0px style="text-align: center;"
! scope="col" width="20%" align="right" |
! scope="col" width="20%" | Bachelor
! scope="col" width="20%" | Master
! scope="col" width="20%" | PhD
! scope="col" width="20%" | Postdoc
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|eLine]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Elionix]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|LED writer]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Süss mask aligner|Mask aligner]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA Systems|AJAs]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator|E-gun]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Edwards evaporator|Edwards]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Leica sputter coater|Leica sputter]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 6320F]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Philips TEM|TEM]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Tencor profilometer|Profilometer]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Alpha-SE Ellipsometer|Ellipsometer]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-

| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Filmetrics reflectometer|Filmetrics]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Süss scriber|Manual scriber]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #ff9f9f" | No
| style="background-color: #ff9f9f" | No
| style="background-color: #ff9f9f" | No
| style="background-color: #ff9f9f" | No
|-
| style="text-align:right; padding-right:6px;" | [[AccuThermo RTA|RTA]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Biorad]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Plasma-Preen asher|Microwave asher]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Diener plasma asher|Diener asher]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Tergeo Plasma Asher|Tergeo asher]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Laurell spinners|Spinners]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|}

[[Category:Tools]]

Tools

2023-05-23T13:08:30Z

Zhe: /* Tool list */

A prerequisite for using the cleanroom tools is that a cleanroom staff member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the [[Training|training]] page and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].]
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system]. However, after a certain period of inactivity on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Tool list ==
{| style="width: 85%;"
|- style="text-align:left;"
! Lithography !! Thin film & III-Vs !! Characterization !! Other
|- valign="top"
| style="width: 20%;" |
* [[Heidelberg µPG 501|Heidelberg LED writer]]
* [[Süss mask aligner]]
* [[Raith eLine|Raith eLine 30 kV EBL/SEM]]
* [[Elionix_7000|Elionix 7000 100 kV EBL]]
* [[Elionix_F-125|Elionix F-125 125kV EBL]] (QuanTech)
| style="width: 20%;" |
* [[AJA systems]]
* [[PLASSYS EVAPORATOR]]
* [[E-Gun evaporator]]
* [[Edwards evaporator|Edwards thermal evaporator]]
* [[Laurell spinners]]
* [[Cambridge ALD]]
* [[Leica sputter coater]]
* [[MBE]]
| style="width: 20%;" |
* [[JEOL 6320F|JEOL JSM-6320F]]
* [[JEOL 7800F|JEOL JSM-7800F]]
* [[Raith eLine]]
* [[Philips TEM]]
* [[Tencor profilometer]]
* [[Alpha-SE ellipsometer]]

* [[Olympus microscopes]]
* [[Lynx EVO stereomicroscope]]
* [[Bruker Dimension Icon AFM]]
* [[Filmetrics reflectometer]]
* [[Probe station]]
| style="width: 20%;" |
* [[Süss scriber|Manual Süss scriber]]
* [[Loomis scriber|Automatic Loomis scriber]]
* [[Dicing saw]]
* [[AccuThermo RTA]]
* [[Plasma-Preen asher]]
* [[Diener plasma asher]]
* [[Tergeo plasma asher]]
* [[FS bonder]]

* [[Micromanipulator]]
* [[Präzitherm hotplates]]
* [[Critical point dryer]]
|}

== Tool access requirement guidelines ==

{| cellspacing=0px style="text-align: center;"
! scope="col" width="20%" align="right" |
! scope="col" width="20%" | Bachelor
! scope="col" width="20%" | Master
! scope="col" width="20%" | PhD
! scope="col" width="20%" | Postdoc
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|eLine]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Elionix]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|LED writer]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Süss mask aligner|Mask aligner]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA Systems|AJAs]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator|E-gun]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Edwards evaporator|Edwards]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Leica sputter coater|Leica sputter]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 6320F]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Philips TEM|TEM]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Tencor profilometer|Profilometer]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Alpha-SE Ellipsometer|Ellipsometer]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-

| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Filmetrics reflectometer|Filmetrics]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Süss scriber|Manual scriber]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #ff9f9f" | No
| style="background-color: #ff9f9f" | No
| style="background-color: #ff9f9f" | No
| style="background-color: #ff9f9f" | No
|-
| style="text-align:right; padding-right:6px;" | [[AccuThermo RTA|RTA]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Biorad]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Plasma-Preen asher|Microwave asher]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Diener plasma asher|Diener asher]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Tergeo Plasma Asher|Tergeo asher]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Laurell spinners|Spinners]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|}

[[Category:Tools]]

Training

2023-05-23T13:07:43Z

Zhe:

A prerequisite for using the cleanroom [[Tools|tools]] is that a [[About|cleanroom staff]] member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system].
However, after a certain period of inactivity (typically 90 days) on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Bruker Dimension Icon Atomic Force Microscope (AFM) ==
* Have a sample ready that you want to characterise. Think about what you want to learn about the sample; step heights, roughness, etc.
* Only ask for training if you plan on using the tool regularly.
* Training is usually 2-3 sessions of 1.5 hours.

== Elionix 7000 (100 kV) ==
=== Prerequisites ===
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** enter the cleanroom;
** use the microscope, spinner, asher;
** SEM training is mandatory

=== Training ===
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

=== Preparation ===
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Get access to SEM tool
* Chip (comfortable to handle) spin coated with resist .This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions.
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 15 minutes at 500 pA current and dose of 1000 uC/cm2.

== Elionix F-125 (125 kV at QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Heidelberg upg501 ==
* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]]

== Raith e-Line ==
* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F ==
* Training takes about 2-3 sessions.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F prime (QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== AJA metallization, sputtering or ion milling ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]

== ALD 1 & 2 ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s) and read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

== PLASSYS Evaporator ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Specify the required process parameters( material, thickness, tilt etc)
* What is your project alias? If unsure, contact your supervisor first.
=== Training ===
* You'll need 3 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - how to create your own recipe and run the process.
** Session 3 ( 3 hr.) - sign off session

== F&S autobonder ==
* Shadow colleagues using the tool 2-3 times.
* You must have a chip for bonding.
* Figure out which daughterboard is it that your team/fridge needs.
* Have a colleague show your how to glue the chip to the daughterboard with silver paint, PMMA or whatever is specific to your measurement.
* What is your project alias? If unsure, contact your supervisor first.
* Request a training session at this point.

== Filmetrics reflectometer ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Micromanipulator ==
* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.

== Tool responsible ==

[[Category:Tools]]

Training

2023-05-23T12:52:50Z

Zhe: /* Preparation */

A prerequisite for using the cleanroom [[Tools|tools]] is that a [[About|cleanroom staff]] member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system].
However, after a certain period of inactivity (typically 90 days) on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Bruker Dimension Icon Atomic Force Microscope (AFM) ==
* Have a sample ready that you want to characterise. Think about what you want to learn about the sample; step heights, roughness, etc.
* Only ask for training if you plan on using the tool regularly.
* Training is usually 2-3 sessions of 1.5 hours.

== Elionix 7000 (100 kV) ==
=== Prerequisites ===
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** enter the cleanroom;
** use the microscope, spinner, asher;
** SEM training is mandatory

=== Training ===
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own.

=== Preparation ===
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Get access to SEM tool
* Chip (comfortable to handle) spin coated with resist .This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions.
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 15 minutes at 500 pA current and dose of 1000 uC/cm2.

== Elionix F-125 (125 kV at QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Heidelberg upg501 ==
* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]]

== Raith e-Line ==
* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F ==
* Training takes about 2-3 sessions.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F prime (QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== AJA metallization, sputtering or ion milling ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]

== ALD 1 & 2 ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s) and read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

== F&S autobonder ==
* Shadow colleagues using the tool 2-3 times.
* You must have a chip for bonding.
* Figure out which daughterboard is it that your team/fridge needs.
* Have a colleague show your how to glue the chip to the daughterboard with silver paint, PMMA or whatever is specific to your measurement.
* What is your project alias? If unsure, contact your supervisor first.
* Request a training session at this point.

== Filmetrics reflectometer ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Micromanipulator ==
* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.

== Tool responsible ==

[[Category:Tools]]

Training

2023-05-23T12:49:16Z

Zhe: /* Prerequisites */

A prerequisite for using the cleanroom [[Tools|tools]] is that a [[About|cleanroom staff]] member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system].
However, after a certain period of inactivity (typically 90 days) on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Bruker Dimension Icon Atomic Force Microscope (AFM) ==
* Have a sample ready that you want to characterise. Think about what you want to learn about the sample; step heights, roughness, etc.
* Only ask for training if you plan on using the tool regularly.
* Training is usually 2-3 sessions of 1.5 hours.

== Elionix 7000 (100 kV) ==
=== Prerequisites ===
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** enter the cleanroom;
** use the microscope, spinner, asher;
** SEM training is mandatory

=== Training ===
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own.

=== Preparation ===
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow someone on the tool 2-3 times.
* Any chip (comfortable to handle) spin coated with resist .This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions.
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 15 minutes at 500 pA current and dose of 1000 uC/cm2.

== Elionix F-125 (125 kV at QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Heidelberg upg501 ==
* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]]

== Raith e-Line ==
* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F ==
* Training takes about 2-3 sessions.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F prime (QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== AJA metallization, sputtering or ion milling ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]

== ALD 1 & 2 ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s) and read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

== F&S autobonder ==
* Shadow colleagues using the tool 2-3 times.
* You must have a chip for bonding.
* Figure out which daughterboard is it that your team/fridge needs.
* Have a colleague show your how to glue the chip to the daughterboard with silver paint, PMMA or whatever is specific to your measurement.
* What is your project alias? If unsure, contact your supervisor first.
* Request a training session at this point.

== Filmetrics reflectometer ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Micromanipulator ==
* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.

== Tool responsible ==

[[Category:Tools]]

File:Tool Responsible.jpg

2023-03-15T15:18:25Z

Zhe:

NBI Cleanroom Tool incharge

Training

2023-03-15T15:15:11Z

Zhe:

A prerequisite for using the cleanroom [[Tools|tools]] is that a [[About|cleanroom staff]] member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system].
However, after a certain period of inactivity (typically 90 days) on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Bruker Dimension Icon Atomic Force Microscope (AFM) ==
* Have a sample ready that you want to characterise. Think about what you want to learn about the sample; step heights, roughness, etc.
* Only ask for training if you plan on using the tool regularly.
* Training is usually 2-3 sessions of 1.5 hours.

== Elionix 7000 (100 kV) ==
=== Prerequisites ===
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** enter the cleanroom;
** use the microscope, spinner, asher;
** SEM training is preferred but not mandatory

=== Training ===
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own.

=== Preparation ===
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow someone on the tool 2-3 times.
* Any chip (comfortable to handle) spin coated with resist .This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions.
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 15 minutes at 500 pA current and dose of 1000 uC/cm2.

== Elionix F-125 (125 kV at QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Heidelberg upg501 ==
* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]]

== Raith e-Line ==
* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F ==
* Training takes about 2-3 sessions.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F prime (QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== AJA metallization, sputtering or ion milling ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]

== ALD 1 & 2 ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s) and read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

== F&S autobonder ==
* Shadow colleagues using the tool 2-3 times.
* You must have a chip for bonding.
* Figure out which daughterboard is it that your team/fridge needs.
* Have a colleague show your how to glue the chip to the daughterboard with silver paint, PMMA or whatever is specific to your measurement.
* What is your project alias? If unsure, contact your supervisor first.
* Request a training session at this point.

== Filmetrics reflectometer ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Micromanipulator ==
* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.

== Tool responsible ==

[[Category:Tools]]

File:ToolResponsible.jpg

2023-03-15T15:07:49Z

Zhe:

Contact personnel for NBI cleanroom tools

Training

2023-03-15T14:35:33Z

Zhe: /* Preparation */

A prerequisite for using the cleanroom [[Tools|tools]] is that a [[About|cleanroom staff]] member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system].
However, after a certain period of inactivity (typically 90 days) on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Bruker Dimension Icon Atomic Force Microscope (AFM) ==
* Have a sample ready that you want to characterise. Think about what you want to learn about the sample; step heights, roughness, etc.
* Only ask for training if you plan on using the tool regularly.
* Training is usually 2-3 sessions of 1.5 hours.

== Elionix 7000 (100 kV) ==
=== Prerequisites ===
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** enter the cleanroom;
** use the microscope, spinner, asher;
** SEM training is preferred but not mandatory

=== Training ===
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own.

=== Preparation ===
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow someone on the tool 2-3 times.
* Any chip (comfortable to handle) spin coated with resist .This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions.
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 15 minutes at 500 pA current and dose of 1000 uC/cm2.

== Elionix F-125 (125 kV at QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Heidelberg upg501 ==
* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]]

== Raith e-Line ==
* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F ==
* Training takes about 2-3 sessions.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F prime (QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== AJA metallization, sputtering or ion milling ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]

== ALD 1 & 2 ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s) and read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

== F&S autobonder ==
* Shadow colleagues using the tool 2-3 times.
* You must have a chip for bonding.
* Figure out which daughterboard is it that your team/fridge needs.
* Have a colleague show your how to glue the chip to the daughterboard with silver paint, PMMA or whatever is specific to your measurement.
* What is your project alias? If unsure, contact your supervisor first.
* Request a training session at this point.

== Filmetrics reflectometer ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Micromanipulator ==
* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.

[[Category:Tools]]