Main Page

2025-11-05T09:10:55Z

Martin:

'''Welcome to the NBI cleanroom wiki!'''

This site contains public information for the users of the cleanroom and related facilities. All items are available '''without login'''. Internal information that should not be disclosed can be posted at the password protected [https://wiki.nbi.ku.dk/qdevwiki/Main_Page QDev wiki].

{| style="width: 80%;" align="center"
|- style="text-align:center;"
|[[File:Tools_button.png|100px|link=Tools|Tools]] || [[File:Safety_button.png|100px|link=Safety|Safety]] || [[File:Fabrication_button.png|100px|link=Fabrication|Fabrication]] || [[File:Calendar_button.png|100px|link=http://cleanroom.brickhost.com/|Calendar]] || [[File:Training ico.png|100px|link=Training|Training]]|| [[File:Info_button.png|100px|link=About|About]] ||
[[File:MBE.png|90px|link=MBE|MBE]] || [[File:sustain.png|90px|link=Sustainability|Sustainability]]
|- style="text-align:center;"
| Tools || Safety || Fabrication || Booking || Training|| About|| MBE || Sustainability
|}

==Current tool status==

{| cellspacing=0px style="text-align: left;"
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|Heidelberg LED writer]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|Raith eLine 30 kV]]
| style="background-color: #ff9f9f" | Tool down. Stage controller is being received next week [reassembling the tool on week 45]
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_7000|Elionix 7000 100 kV]]
| style="background-color: #FFD700" | Waiting for a quotation for new Dovetails on multipiece stage holder. [estimated service: Week 45]
|-
| style="text-align:right; padding-right:6px;" | [[Elionix_F-125|Elionix F-125 125 kV]]
| style="background-color: #ff9f9f" | Annual service & gun fillament exchange. [down time: Weeks 45 and 46]
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (e-gun)]]
| style="background-color: #ff9f9f" | The bellow of the e-gun has a vacuum leak (verified with He test). Has been sent to the US for repair [estimated return: Week 50]
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA1 (milling and sputtering)]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[AJA systems|AJA2]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Plassys Evaporator]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD1]]
| style="background-color: #FFD700" | Waiting for a new venting MAC valve from buch & holm [estimated service: Week 45]. System can be used but ask Harry to help you with loading if you have issues.
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD2]]
| style="background-color: #c6e0b4" | All good! [Scheduled servicing of the scroll pump: Week 47]
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[FS bonder]]
| style="background-color: #c6e0b4" | All good! ''' Please return the hex Wera screwdrivers'''. The primary bondhead (SN:004) is in the factory for servicing [estimated return: Week 46]. Once we receive it back, we will set up a bondhead with Au wire!
|-
| style="text-align:right; padding-right:6px;" | [[K&S bonder]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #FFD700" | Dual PC is not working, the tool is okay to use with a single operating PC
|-
| style="text-align:right; padding-right:6px;" | [[Dicing saw]]
| style="background-color: #c6e0b4" | All good!
|-
| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #ff9f9f" | System down. Troubleshooting in progress.
|}

''List updated: Friday 31 Oct 2025''

File:Sustain.png

2025-11-05T09:09:39Z

Martin: sustainability

== Summary ==
sustainability

2024-05-08T11:57:44Z

Martin: /* Currently loaded materials */

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Smitha
|secondary = Martin
}}
There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular 2" DC sputtering target, one 2" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side. Oxidation chamber on the loadlock.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2023January 02):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Al
| Intermetallic
|-
| 2
| Ti1
| Fabmate
|-
| 3
| Au1
| Tungsten
|-
| 4
| Au2
| Tungsten
|-
| 5
| Ti2
| Fabmate
|-
| 6
| SiO2
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| Tungsten
|-
| 2
| Titanium
| FabMate
|-
| 3
| Al
| Intermetallic
|-
| 4
| Pd
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| V
| --
|-
| RF2
| V3Si
| --
|-
| RF3
| NbTi
| --
|-
|}
|-
|}

=== Other available materials ===
'''Evaporation''': SiO2, MgB2, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb2Ti1, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si3N4, Ta, Nb4Ti1, Nb

There is a big compatibility chart next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

The chart is also available [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm online].

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
*; Important note for AJA2:
*: If your entire process ends with Au deposition, use the dedicated Au sample holder. If your process ends with anything else, use the generic sample holder. This ensures that the surface on the Au sample holder remains consistent. This is important for RF substrate milling.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample.
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the power stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo VAT valve ( Adaptive pressure controller ) .
# Open the loadloack valve.
# Open Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool). Just press and release switch .
# Open nitrogen vent valve on the back left of the cryo.
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close roughing pump to turbo (screw valve under the loadlock turbo)
# Open roughing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo ( wall switch) . Please check compressor as well .
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo VAT valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

General rules for working in the cleanroom

2024-03-25T07:52:01Z

Martin: /* How to behave */

New users must complete the Cleanroom safety course before gaining access to the Cleanroom.

Send a [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk] to join a course. Please provide information on which group or PI you are affiliated with.

The safety of you and coworkers in the lab is of utmost importance. Although we encourage constructive feedback on safety procedures, and how to improve them, you must accept that safety is not a democratic process. The rules must be followed.

In case of an accident, you must also accept that your coworkers or [[About|cleanroom staff]] takes over and instructs you in order to help in the best possible way. You may not think rationally in such a situation!

= How to behave =
* Always think of [[Safety|safety]] first!
* Always wear the required cleanroom attire
* Respect a comfort safety zone around people working in the cleanroom
* The maximum number of people in each of the two cleanrooms is 8, providing that people are distibuted at different fumehoods and tools
* When you work at the fume hoods:
** Use slow movements (to avoid turbulence)
** Reduce the amount of equipment and bottles in the bench
** Operate with sash as low as possible (always below arrow marking max sash height)
** Keep the worksurface tidy
** Clean up after use
** If you must leave a process unattended, please limit the time and attach a note with name, contact info, and return time
* Wash labware after use with Milli-Q water and hang to dry on rack
* No food or drinks allowed in the cleanroom
* Broken glass must be cleaned and disposed of in the glass bins
* No earphones! You must be able to hear and see to act safely

= How to dress =

When working in the cleanroom, you must always wear cleanroom attire, and when working with acids or dangerous chemicals, you must also wear personal protective equipment (PPE). Cleanroom attire and PPE have different purposes. Clean room attire is not PPE. You wear cleanroom attire to protect samples from dust generated by you, and you wear PPE to protect you from chemicals.

To minimize particle generation your personal clothes and hair must be totally covered from the lower edge of the clean room coat and up. Long hair must be tucked under the hood and neither headscarves nor hair must stick out or block your vision.

Oversized trousers or floor long dresses pose a safety risk as you may trip while handling chemicals and is thus not allowed. Clothing that contains excessive fringe or even overly loose-fitting clothing may be ruled to be unsafe. Open toed shoes are accepted.

The use of contact lenses is not recommended in the lab. Contact lenses make it difficult to wash the eyes in case of splashes. If you choose to wear them you should alert other cleanroom users. Other users need to know that lenses will need to be removed if you do get something in your eye.

Please note that you are required to strip your clothes when using the safety shower. Not removing contaminated clothes will make the situation worse. If you are not comfortable with this, you should not enter the lab.

== Cleanroom attire ==
[[File:Required cleanroom attire.png|320px|right|Required cleanroom attire]]
The required cleanroom attire is:

* Hair cover
* Safety glasses, even over normal glasses. They may only be removed when using the microscopes.
* Beard cover if you have a beard or stubble over 3 mm long
* Cleanroom gown
* Gloves
* Cleanroom colgs

== Personal protective equipment ==

Further required PPE when working with dangerous chemicals:

* Apron
* General chemical work: Nitrile gloves
* Strong acids/chemicals: Nitrile + sleeve covers + tri-polymer protective sleeves
* Fumehood sash kept low

= Practical information =
* All staff members are covered by the insurance provisions of the Occupational Injuries Act. In this relation a staff member is someone receiving a salary for the work done
* Students are not usually covered by the insurance provisions of the Occupational Injuries Act. We recommend that you have an accident policy, and that you make sure it also applies when you are studying and when you are working in the lab.
* Please familiarize yourself with the [https://kunet.ku.dk/faculty-and-department/nbi/health-and-safety/Documents/Beredskabsplaner%20for%20Niels%20Bohr%20Institutet_ENG_febr2019.pdf Emergency plan]
* Please familiarize yourself with the [https://kunet.ku.dk/employee-guide/Pages/Safety-and-Emergency-Preparedness/Evacuation.aspx general evacuation concept of KU]
* Information about the NBI Occupational Health and Safety Committee can be found [https://kunet.ku.dk/faculty-and-department/nbi/health-and-safety/Pages/default.aspx here]. This webpage also has links to other relevant Occupational Health and Safety sites at KU.
* A very thorough [https://kunet.ku.dk/faculty-and-department/nbi/health-and-safety/Documents/Health%20and%20Safety%20in%20Laboratory%20Teaching%20in%20Physics%20NBI%2014.pdf general lab safety manual for physics students] at NBI.
* KU provides First Aid courses. Keep an eye out for [https://kunet.ku.dk/employee-guide/Pages/Course-Catalogue/Ucphcourses.aspx courses] given in English (Generally offered a couple of times a year).

[[Category:Safety]]

Main Page

2024-03-25T07:51:19Z

Martin:

2022-03-15T12:59:03Z

Martin:

Filled out chemical risk assessment forms

2022-03-15T12:46:14Z

Martin:

Filled out chemical risk assessment forms

2022-03-15T12:43:38Z

Martin: Created page with "[https://groups.ku.dk/groups/d-4986/Document%20library/Risk%20assessments/APV%20-%20Buffered%20Tartaric%20Acid%20for%20Anodic%20Oxidation%20-%20NBI.docx Risk assessment for ha..."

[https://groups.ku.dk/groups/d-4986/Document%20library/Risk%20assessments/APV%20-%20Buffered%20Tartaric%20Acid%20for%20Anodic%20Oxidation%20-%20NBI.docx Risk assessment for handling Buffered Tantaric Acid for Anodic Oxidation]

Training

2022-03-09T08:57:44Z

Martin: /* Bruker Dimension ICON Atomic Force Microscope (AFM) */

A prerequisite for using the cleanroom tools is that a cleanroom staff member has given the necessary instruction or training. This includes basic instruments such as hotplates and microscopes. For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]. A cleanroom staff member will typically respond within one workday. Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system]. However, after a certain period of inactivity on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Bruker Dimension Icon Atomic Force Microscope (AFM) ==
* Have a sample ready that you want to characterise. Think about what you want to learn about the sample; step heights, roughness, etc.
* Only ask for training if you plan on using the tool regularly.
* Training is usually 2-3 sessions of 1.5 hours.

== Elionix 7000 (100 kV) ==
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** enter the cleanroom;
** use the microscope, spinner, asher;
** use any other tool you might need to prepare chips for the training. This could be the micromanipulator or the Heidelberg.
* You'll need 1+3 sessions of about 2.5 hrs each on the tool to get trained on this tool.
** Session 0 teaches you how to load/unload the sample and how to condition the beam.
** Session 1 involves exposing alignment marks and one half of the overlay test pattern on a blank chip.
*** After exposure you need to develop the pattern in PMMA developer. Once you can determine the relative position of the lower left alignment mark with respect to the lower left chip corner, you are ready for session 2.
** Session 2 involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 3 involves exposing a "real" pattern on a "real" chip on your own.
* Before any training slots are booked on the tool you'll need all of the following prepared:
** Shadow someone on the tool 2-3 times before starting the prep.
** Si chip (5-20 mm square) spin coated with A4 and baked at 185C/2mins. This chip will be used for sessions 1 & 2. This has to be a dummy chip.
** A chip for your 3rd session. This is a "real" chip. Plan this internally within your group.
** A design (GDS is preferred, DXF ''might'' work) for sessions 1 & 2 with:
*** 4 alignment crosses (find out what marks work on the tool from your group). The crosses should be a few millimeters apart. Make sure each cross is within one writefield when converting the design in WeCaS.
*** Something to break the symmetry so you can tell chip orientation with your bare eye after the 1st exposure.
*** A pattern that you will use to test overlay quality (alignment precision between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions.
*** Something creative, something fun :) This is an exercise in learning CAD as well.
** A design for the "real" chip to be exposed in session 3.
* You'll also need a software session of about 0.5 hrs -- arrange this with an Elionix superuser within your group.
* Then follow workflow 0 at [https://wiki.nbi.ku.dk/qdevwiki/ElionixCheatSheet Qdev wiki] to convert your design files into the Elionix exposure format .co7. Make dedicated folders for each exposure. Make sure neither exposure will take longer than 15 minutes at 500 pA current and dose of 1000 uC/cm2. Prepare and test schedule files.
** Note: Do not use Beamer to prep the Elionix .con files for sessions 1 & 2.
* Contact the cleanroom staff with answers to this checklist '''only after you are done with all of the above'''.
* Here's a final checklist:
** Have you shadowed someone on the tool? If yes, who? How many times?
** Do you have a silicon chip with A4 resist? What are its dimensions +-0.1 mm? How did you measure this?
** Do you have .con and .sch files prepared? Where on Z drive are they?
** How long do the 1st and 2nd exposures take? Is it under 15 minutes?
** Do you have a real chip + design planned with your group?
** What is your project alias? If unsure, contact your supervisor first.

== Elionix F-125 (125 kV at QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Heidelberg upg501 ==
* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]]

== Raith e-Line ==
* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F ==
* Training takes about 2-3 sessions.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F prime (QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== AJA metallization, sputtering or ion milling ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process steps do you want to run?
** Either the recipe name for automatic recipes or all required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]

== ALD 1 & 2 ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s) and read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

== F&S autobonder ==
* You must have a chip for bonding.
* Figure out which daughterboard is it that your team/fridge needs.
* Have a team member show your how to glue the chip to the daughterboard with silver paint, PMMA or whatever is specific to your measurement.
* What is your project alias? If unsure, contact your supervisor first.
* Request a training session at this point.

== Filmetrics reflectometer ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Micromanipulator ==
* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.

Training

2022-03-09T08:57:29Z

Martin: /* Atomic Force Microscope (Bruker Dimension ICON AFM) */

A prerequisite for using the cleanroom tools is that a cleanroom staff member has given the necessary instruction or training. This includes basic instruments such as hotplates and microscopes. For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]. A cleanroom staff member will typically respond within one workday. Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system]. However, after a certain period of inactivity on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Bruker Dimension ICON Atomic Force Microscope (AFM) ==
* Have a sample ready that you want to characterise. Think about what you want to learn about the sample; step heights, roughness, etc.
* Only ask for training if you plan on using the tool regularly.
* Training is usually 2-3 sessions of 1.5 hours.

== Elionix 7000 (100 kV) ==
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** enter the cleanroom;
** use the microscope, spinner, asher;
** use any other tool you might need to prepare chips for the training. This could be the micromanipulator or the Heidelberg.
* You'll need 1+3 sessions of about 2.5 hrs each on the tool to get trained on this tool.
** Session 0 teaches you how to load/unload the sample and how to condition the beam.
** Session 1 involves exposing alignment marks and one half of the overlay test pattern on a blank chip.
*** After exposure you need to develop the pattern in PMMA developer. Once you can determine the relative position of the lower left alignment mark with respect to the lower left chip corner, you are ready for session 2.
** Session 2 involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 3 involves exposing a "real" pattern on a "real" chip on your own.
* Before any training slots are booked on the tool you'll need all of the following prepared:
** Shadow someone on the tool 2-3 times before starting the prep.
** Si chip (5-20 mm square) spin coated with A4 and baked at 185C/2mins. This chip will be used for sessions 1 & 2. This has to be a dummy chip.
** A chip for your 3rd session. This is a "real" chip. Plan this internally within your group.
** A design (GDS is preferred, DXF ''might'' work) for sessions 1 & 2 with:
*** 4 alignment crosses (find out what marks work on the tool from your group). The crosses should be a few millimeters apart. Make sure each cross is within one writefield when converting the design in WeCaS.
*** Something to break the symmetry so you can tell chip orientation with your bare eye after the 1st exposure.
*** A pattern that you will use to test overlay quality (alignment precision between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions.
*** Something creative, something fun :) This is an exercise in learning CAD as well.
** A design for the "real" chip to be exposed in session 3.
* You'll also need a software session of about 0.5 hrs -- arrange this with an Elionix superuser within your group.
* Then follow workflow 0 at [https://wiki.nbi.ku.dk/qdevwiki/ElionixCheatSheet Qdev wiki] to convert your design files into the Elionix exposure format .co7. Make dedicated folders for each exposure. Make sure neither exposure will take longer than 15 minutes at 500 pA current and dose of 1000 uC/cm2. Prepare and test schedule files.
** Note: Do not use Beamer to prep the Elionix .con files for sessions 1 & 2.
* Contact the cleanroom staff with answers to this checklist '''only after you are done with all of the above'''.
* Here's a final checklist:
** Have you shadowed someone on the tool? If yes, who? How many times?
** Do you have a silicon chip with A4 resist? What are its dimensions +-0.1 mm? How did you measure this?
** Do you have .con and .sch files prepared? Where on Z drive are they?
** How long do the 1st and 2nd exposures take? Is it under 15 minutes?
** Do you have a real chip + design planned with your group?
** What is your project alias? If unsure, contact your supervisor first.

== Elionix F-125 (125 kV at QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Heidelberg upg501 ==
* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]]

== Raith e-Line ==
* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F ==
* Training takes about 2-3 sessions.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F prime (QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== AJA metallization, sputtering or ion milling ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process steps do you want to run?
** Either the recipe name for automatic recipes or all required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]

== ALD 1 & 2 ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s) and read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

== F&S autobonder ==
* You must have a chip for bonding.
* Figure out which daughterboard is it that your team/fridge needs.
* Have a team member show your how to glue the chip to the daughterboard with silver paint, PMMA or whatever is specific to your measurement.
* What is your project alias? If unsure, contact your supervisor first.
* Request a training session at this point.

== Filmetrics reflectometer ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Micromanipulator ==
* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.

Training

2022-03-09T08:56:42Z

Martin:

A prerequisite for using the cleanroom tools is that a cleanroom staff member has given the necessary instruction or training. This includes basic instruments such as hotplates and microscopes. For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]. A cleanroom staff member will typically respond within one workday. Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system]. However, after a certain period of inactivity on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Atomic Force Microscope (Bruker Dimension ICON AFM) ==
* Have a sample ready that you want to characterise. Think about what you want to learn about the sample; step heights, roughness, etc.
* Only ask for training if you plan on using the tool regularly.
* Training is usually 2-3 sessions of 1.5 hours.

== Elionix 7000 (100 kV) ==
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** enter the cleanroom;
** use the microscope, spinner, asher;
** use any other tool you might need to prepare chips for the training. This could be the micromanipulator or the Heidelberg.
* You'll need 1+3 sessions of about 2.5 hrs each on the tool to get trained on this tool.
** Session 0 teaches you how to load/unload the sample and how to condition the beam.
** Session 1 involves exposing alignment marks and one half of the overlay test pattern on a blank chip.
*** After exposure you need to develop the pattern in PMMA developer. Once you can determine the relative position of the lower left alignment mark with respect to the lower left chip corner, you are ready for session 2.
** Session 2 involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 3 involves exposing a "real" pattern on a "real" chip on your own.
* Before any training slots are booked on the tool you'll need all of the following prepared:
** Shadow someone on the tool 2-3 times before starting the prep.
** Si chip (5-20 mm square) spin coated with A4 and baked at 185C/2mins. This chip will be used for sessions 1 & 2. This has to be a dummy chip.
** A chip for your 3rd session. This is a "real" chip. Plan this internally within your group.
** A design (GDS is preferred, DXF ''might'' work) for sessions 1 & 2 with:
*** 4 alignment crosses (find out what marks work on the tool from your group). The crosses should be a few millimeters apart. Make sure each cross is within one writefield when converting the design in WeCaS.
*** Something to break the symmetry so you can tell chip orientation with your bare eye after the 1st exposure.
*** A pattern that you will use to test overlay quality (alignment precision between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions.
*** Something creative, something fun :) This is an exercise in learning CAD as well.
** A design for the "real" chip to be exposed in session 3.
* You'll also need a software session of about 0.5 hrs -- arrange this with an Elionix superuser within your group.
* Then follow workflow 0 at [https://wiki.nbi.ku.dk/qdevwiki/ElionixCheatSheet Qdev wiki] to convert your design files into the Elionix exposure format .co7. Make dedicated folders for each exposure. Make sure neither exposure will take longer than 15 minutes at 500 pA current and dose of 1000 uC/cm2. Prepare and test schedule files.
** Note: Do not use Beamer to prep the Elionix .con files for sessions 1 & 2.
* Contact the cleanroom staff with answers to this checklist '''only after you are done with all of the above'''.
* Here's a final checklist:
** Have you shadowed someone on the tool? If yes, who? How many times?
** Do you have a silicon chip with A4 resist? What are its dimensions +-0.1 mm? How did you measure this?
** Do you have .con and .sch files prepared? Where on Z drive are they?
** How long do the 1st and 2nd exposures take? Is it under 15 minutes?
** Do you have a real chip + design planned with your group?
** What is your project alias? If unsure, contact your supervisor first.

== Elionix F-125 (125 kV at QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Heidelberg upg501 ==
* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]]

== Raith e-Line ==
* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F ==
* Training takes about 2-3 sessions.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F prime (QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== AJA metallization, sputtering or ion milling ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process steps do you want to run?
** Either the recipe name for automatic recipes or all required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]

== ALD 1 & 2 ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s) and read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

== F&S autobonder ==
* You must have a chip for bonding.
* Figure out which daughterboard is it that your team/fridge needs.
* Have a team member show your how to glue the chip to the daughterboard with silver paint, PMMA or whatever is specific to your measurement.
* What is your project alias? If unsure, contact your supervisor first.
* Request a training session at this point.

== Filmetrics reflectometer ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Micromanipulator ==
* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.

Training

2022-02-03T09:41:27Z

Martin: /* AJA metallization, sputtering or ion milling */

A prerequisite for using the cleanroom tools is that a cleanroom staff member has given the necessary instruction or training. This includes basic instruments such as hotplates and microscopes. For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]. A cleanroom staff member will typically respond within one workday. Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system]. However, after a certain period of inactivity on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Elionix 7000 (100 kV) ==
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** enter the cleanroom;
** use the microscope, spinner, asher;
** use any other tool you might need to prepare chips for the training. This could be the micromanipulator or the Heidelberg.
* You'll need 1+3 sessions of about 2.5 hrs each on the tool to get trained on this tool.
** Session 0 teaches you how to load/unload the sample and how to condition the beam.
** Session 1 involves exposing alignment marks and one half of the overlay test pattern on a blank chip.
*** After exposure you need to develop the pattern in PMMA developer. Once you can determine the relative position of the lower left alignment mark with respect to the lower left chip corner, you are ready for session 2.
** Session 2 involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 3 involves exposing a "real" pattern on a "real" chip on your own.
* Before any training slots are booked on the tool you'll need all of the following prepared:
** Shadow someone on the tool 2-3 times before starting the prep.
** Si chip (5-20 mm square) spin coated with A4 and baked at 185C/2mins. This chip will be used for sessions 1 & 2. This has to be a dummy chip.
** A chip for your 3rd session. This is a "real" chip. Plan this internally within your group.
** A design (GDS is preferred, DXF ''might'' work) for sessions 1 & 2 with:
*** 4 alignment crosses (find out what marks work on the tool from your group). The crosses should be a few millimeters apart. Make sure each cross is within one writefield when converting the design in WeCaS.
*** Something to break the symmetry so you can tell chip orientation with your bare eye after the 1st exposure.
*** A pattern that you will use to test overlay quality (alignment precision between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions.
*** Something creative, something fun :) This is an exercise in learning CAD as well.
** A design for the "real" chip to be exposed in session 3.
* You'll also need a software session of about 0.5 hrs -- arrange this with an Elionix superuser within your group.
* Then follow workflow 0 at [https://wiki.nbi.ku.dk/qdevwiki/ElionixCheatSheet Qdev wiki] to convert your design files into the Elionix exposure format .co7. Make dedicated folders for each exposure. Make sure neither exposure will take longer than 15 minutes at 500 pA current and dose of 1000 uC/cm2. Prepare and test schedule files.
** Note: Do not use Beamer to prep the Elionix .con files for sessions 1 & 2.
* Contact the cleanroom staff with answers to this checklist '''only after you are done with all of the above'''.
* Here's a final checklist:
** Have you shadowed someone on the tool? If yes, who? How many times?
** Do you have a silicon chip with A4 resist? What are its dimensions +-0.1 mm? How did you measure this?
** Do you have .con and .sch files prepared? Where on Z drive are they?
** How long do the 1st and 2nd exposures take? Is it under 15 minutes?
** Do you have a real chip + design planned with your group?
** What is your project alias? If unsure, contact your supervisor first.

== Elionix F-125 (125 kV at QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Heidelberg upg501 ==
* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]]

== Raith e-Line ==
* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F ==
* Training takes about 2-3 sessions.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.

== JEOL 7800-F prime (QuanTech) ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== AJA metallization, sputtering or ion milling ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process steps do you want to run?
** Either the recipe name for automatic recipes or all required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]

== ALD 1 & 2 ==
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s) and read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

== F&S autobonder ==
* You must have a chip for bonding.
* Figure out which daughterboard is it that your team/fridge needs.
* Have a team member show your how to glue the chip to the daughterboard with silver paint, PMMA or whatever is specific to your measurement.
* What is your project alias? If unsure, contact your supervisor first.
* Request a training session at this point.

== Filmetrics reflectometer ==
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])

== Micromanipulator ==
* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.