cleanroom - User contributions [en-gb]

Resists

2022-05-20T13:48:13Z

Karolis: /* SigmaAldrich/Merck */ added link to amber bottles

This is a list of resists stocked at the [[Main Page|NBI cleanroom]].

There is a separate page for experimentally determined [[Doses|doses]].
== Stocked resists ==

=== Photoresists ===

* [[AZ 1505]] ([https://www.microchemicals.com/micro/tds_az_1500_series.pdf technical data sheet])
* AZ 4500 series ([https://www.microchemicals.com/micro/tds_az_4500_series.pdf data sheet])
* AZ 5214 E ([https://www.microchemicals.com/micro/tds_az_5214e_photoresist.pdf data sheet])
* AZ nLOF 2000 ([https://www.microchemicals.com/micro/tds_az_nlof2000_series.pdf data sheet])
* MR ma-N 400 & 1400 ([https://www.microresist.de/en/?jet_download=2437 data sheet])
* [[AR-N 7520]] NEW (high sensitivity) ([https://www.allresist.com/wp-content/uploads/sites/2/2020/03/AR-N7520new_english_Allresist_product-information.pdf data sheet])
* [[AR-N 7520]] ORIG. (low sensitivity)
* SU-8 ([https://kayakuam.com/wp-content/uploads/2020/09/KAM-SU-8-2-25-Datasheet-9.3.20-final.pdf data sheet])

=== Electron beam resists ===

* PMMA A-series ([https://kayakuam.com/wp-content/uploads/2021/07/KAM-PMMA-Datasheet-4.12.21-final.pdf data sheet])
* AR-P 6200 (CSAR) ([https://www.allresist.com/wp-content/uploads/sites/2/2020/03/AR-P6200_CSAR62english_Allresist_product-information.pdf data sheet])
* ZEP 520A
* MMA copolymer EL-series ([https://kayakuam.com/wp-content/uploads/2021/07/KAM-PMMA-Datasheet-4.12.21-final.pdf data sheet], [https://wiki.nbi.ku.dk/qdevwiki/CSAR_resist_(AR-P_6200) page on the internal QDev wiki])

== What's in a name? ==

Some product names are straightforward, like PMMA 950K A4.

PMMA: polymethylmethacrylate

950K: molecular weight

A4: solvent and solids wt%, in this case anisole 4%

NBI cleanroom uses this convention. E.g. A4, EL6 (PMMA 950K ethyl lactate 6%), CSAR9 (CSAR 9%).

Some product names are vendor specific, like AR-P 672.045.

AR: vendor AllResist

P: positive resist

672: product series, in this case PMMA 950K in anisole

045: 4.5% solids in wt%

== Purchasing ==

=== micro resist ===

MicroChem was bought by Kayaku. micro resist is the European distributor.

Slow lead time (3-6 weeks), short shelf life (11 months), large minimum (500 ml), expensive.

Always ask for expiration date of the batch you're ordering, might be as short as 3 months.

Only source for copolymer EL-series (MMA (8.5) MAA in ethyl lactate).

Sales [mailto:sales@microresist.de sales@microresist.de]

PMMA A-series: PMMA 950K AX

Copolymer EL-series: MMA MAA ELX

Negative resist: ma-N 2403

=== AllResist ===

Has PMMA substitutes, short lead time, cheaper, small minimum (30 ml), longer shelf life.

Only source for CSAR.

Sales [mailto:order@allresist.de order@allresist.de]

[[Media:AR-Price-list-2020-eng.pdf|Price list]]

PMMA 950K in anisole: AR-P 672.XXX

CSAR in anisole: AR-P 6200.XX (lowest is 4%, but can successfully dilute with anisole)

Negative resist: AR-N 7520.XX

=== Zeon ===

ZEP 520A

== Ancillaries ==

=== AllResist ===

PMMA developer: AR 600-56

Adhesion promoter: AR 300-80 ([https://wiki.nbi.ku.dk/qdevwiki/Adhesion_promoter_AR_300-80 info on internal QDev wiki])

=== micro resist ===

ma-N developer: ma-D 525

=== SigmaAldrich/Merck ===

Wheaton wide-mouth bottle: capacity 30 mL, amber, white polypropylene cap, PTFE flat liner [https://www.sigmaaldrich.com/DK/en/product/aldrich/z250155]

[[Category:Fabrication]]

AJA systems

2022-05-18T11:09:55Z

Karolis: /* Troubleshooting */ added Claus/Fabio suggestion for poor matching fix

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Karolis
|secondary = Martin
}}
There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, <del>heater in sample mount</del> and Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular 2" DC sputtering target, one 2" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side. Oxidation chamber on the loadlock.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2022 March 11):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Si
| FabMate
|-
| 2
| Cr
| intermetallic
|-
| 3
| Au2 (40 g)
| W
|-
| 4
| Au1 (80 g)
| W
|-
| 5
| Al1
| intermetallic
|-
| 6
| Ti
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| W
|-
| 2
| V
| FabMate
|-
| 3
| Ti
| FabMate
|-
| 4
| Al
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

=== Other available materials ===
'''Evaporation''': SiO2, MgB2, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb2Ti1, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si3N4, Ta, Nb4Ti1, Nb

There is a big compatibility chart next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

The chart is also available [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm online].

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* <del>Examine the sample holder. There are three small pins. These pins, via a similar mechanism lock onto the stage inside the main chamber.</del>
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
*; Important note for AJA2:
*: If your entire process ends with Au deposition, use the dedicated Au sample holder. If your process ends with anything else, use the generic sample holder. This ensures that the surface on the Au sample holder remains consistent. This is important for RF substrate milling.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample. <del>The mechanism which locks the sample holder on to the stage in the main chamber, also simultaneously unlocks it from the loading arm.</del>
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the power stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo gate valve. Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool)
# Open nitrogen vent valve on the back left of the cryo
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close backing pump to cryo (screw valve under the loadlock turbo)
#* Might need to crack open the valve a bit. Setting turbo controller <code>012: EnableVent: off</code> doesn't help.
# Open backing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo gate valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2022-05-12T13:06:54Z

Karolis: /* Manual */ removed power source ambiguity

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Karolis
|secondary = Martin
}}
There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, <del>heater in sample mount</del> and Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular 2" DC sputtering target, one 2" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side. Oxidation chamber on the loadlock.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2022 March 11):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Si
| FabMate
|-
| 2
| Cr
| intermetallic
|-
| 3
| Au2 (40 g)
| W
|-
| 4
| Au1 (80 g)
| W
|-
| 5
| Al1
| intermetallic
|-
| 6
| Ti
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| W
|-
| 2
| V
| FabMate
|-
| 3
| Ti
| FabMate
|-
| 4
| Al
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

=== Other available materials ===
'''Evaporation''': SiO2, MgB2, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb2Ti1, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si3N4, Ta, Nb4Ti1, Nb

There is a big compatibility chart next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

The chart is also available [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm online].

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* <del>Examine the sample holder. There are three small pins. These pins, via a similar mechanism lock onto the stage inside the main chamber.</del>
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
*; Important note for AJA2:
*: If your entire process ends with Au deposition, use the dedicated Au sample holder. If your process ends with anything else, use the generic sample holder. This ensures that the surface on the Au sample holder remains consistent. This is important for RF substrate milling.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample. <del>The mechanism which locks the sample holder on to the stage in the main chamber, also simultaneously unlocks it from the loading arm.</del>
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the power stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick. Try turning on the power without ramping it.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo gate valve. Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool)
# Open nitrogen vent valve on the back left of the cryo
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close backing pump to cryo (screw valve under the loadlock turbo)
#* Might need to crack open the valve a bit. Setting turbo controller <code>012: EnableVent: off</code> doesn't help.
# Open backing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo gate valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2022-05-12T13:02:22Z

Karolis: /* Other available materials */ added link to online chart

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Karolis
|secondary = Martin
}}
There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, <del>heater in sample mount</del> and Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular 2" DC sputtering target, one 2" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side. Oxidation chamber on the loadlock.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2022 March 11):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Si
| FabMate
|-
| 2
| Cr
| intermetallic
|-
| 3
| Au2 (40 g)
| W
|-
| 4
| Au1 (80 g)
| W
|-
| 5
| Al1
| intermetallic
|-
| 6
| Ti
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| W
|-
| 2
| V
| FabMate
|-
| 3
| Ti
| FabMate
|-
| 4
| Al
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

=== Other available materials ===
'''Evaporation''': SiO2, MgB2, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb2Ti1, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si3N4, Ta, Nb4Ti1, Nb

There is a big compatibility chart next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

The chart is also available [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm online].

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* <del>Examine the sample holder. There are three small pins. These pins, via a similar mechanism lock onto the stage inside the main chamber.</del>
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
*; Important note for AJA2:
*: If your entire process ends with Au deposition, use the dedicated Au sample holder. If your process ends with anything else, use the generic sample holder. This ensures that the surface on the Au sample holder remains consistent. This is important for RF substrate milling.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample. <del>The mechanism which locks the sample holder on to the stage in the main chamber, also simultaneously unlocks it from the loading arm.</del>
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the RF2 (sputtering target) stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick. Try turning on the power without ramping it.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo gate valve. Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool)
# Open nitrogen vent valve on the back left of the cryo
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close backing pump to cryo (screw valve under the loadlock turbo)
#* Might need to crack open the valve a bit. Setting turbo controller <code>012: EnableVent: off</code> doesn't help.
# Open backing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo gate valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2022-05-12T12:49:58Z

Karolis: /* Overview */ added approx base pressure

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Karolis
|secondary = Martin
}}
There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, <del>heater in sample mount</del> and Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular 2" DC sputtering target, one 2" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side. Oxidation chamber on the loadlock.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2022 March 11):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Si
| FabMate
|-
| 2
| Cr
| intermetallic
|-
| 3
| Au2 (40 g)
| W
|-
| 4
| Au1 (80 g)
| W
|-
| 5
| Al1
| intermetallic
|-
| 6
| Ti
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| W
|-
| 2
| V
| FabMate
|-
| 3
| Ti
| FabMate
|-
| 4
| Al
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

=== Other available materials ===
'''Evaporation''': SiO2, MgB2, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb2Ti1, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si3N4, Ta, Nb4Ti1, Nb

There is a big compatibility chart next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* <del>Examine the sample holder. There are three small pins. These pins, via a similar mechanism lock onto the stage inside the main chamber.</del>
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
*; Important note for AJA2:
*: If your entire process ends with Au deposition, use the dedicated Au sample holder. If your process ends with anything else, use the generic sample holder. This ensures that the surface on the Au sample holder remains consistent. This is important for RF substrate milling.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample. <del>The mechanism which locks the sample holder on to the stage in the main chamber, also simultaneously unlocks it from the loading arm.</del>
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the RF2 (sputtering target) stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick. Try turning on the power without ramping it.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo gate valve. Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool)
# Open nitrogen vent valve on the back left of the cryo
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close backing pump to cryo (screw valve under the loadlock turbo)
#* Might need to crack open the valve a bit. Setting turbo controller <code>012: EnableVent: off</code> doesn't help.
# Open backing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo gate valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2022-05-12T12:48:51Z

Karolis: /* Other available materials */

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Karolis
|secondary = Martin
}}
There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, <del>heater in sample mount</del> and Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular 2" DC sputtering target, one 2" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.
Oxidation chamber on the loadlock.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2022 March 11):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Si
| FabMate
|-
| 2
| Cr
| intermetallic
|-
| 3
| Au2 (40 g)
| W
|-
| 4
| Au1 (80 g)
| W
|-
| 5
| Al1
| intermetallic
|-
| 6
| Ti
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| W
|-
| 2
| V
| FabMate
|-
| 3
| Ti
| FabMate
|-
| 4
| Al
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

=== Other available materials ===
'''Evaporation''': SiO2, MgB2, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb2Ti1, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si3N4, Ta, Nb4Ti1, Nb

There is a big compatibility chart next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* <del>Examine the sample holder. There are three small pins. These pins, via a similar mechanism lock onto the stage inside the main chamber.</del>
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
*; Important note for AJA2:
*: If your entire process ends with Au deposition, use the dedicated Au sample holder. If your process ends with anything else, use the generic sample holder. This ensures that the surface on the Au sample holder remains consistent. This is important for RF substrate milling.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample. <del>The mechanism which locks the sample holder on to the stage in the main chamber, also simultaneously unlocks it from the loading arm.</del>
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the RF2 (sputtering target) stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick. Try turning on the power without ramping it.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo gate valve. Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool)
# Open nitrogen vent valve on the back left of the cryo
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close backing pump to cryo (screw valve under the loadlock turbo)
#* Might need to crack open the valve a bit. Setting turbo controller <code>012: EnableVent: off</code> doesn't help.
# Open backing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo gate valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2022-05-12T12:09:25Z

Karolis: /* Overview */ added temperature info

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Karolis
|secondary = Martin
}}
There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, <del>heater in sample mount</del> and Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular 2" DC sputtering target, one 2" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.
Oxidation chamber on the loadlock.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2022 March 11):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Si
| FabMate
|-
| 2
| Cr
| intermetallic
|-
| 3
| Au2 (40 g)
| W
|-
| 4
| Au1 (80 g)
| W
|-
| 5
| Al1
| intermetallic
|-
| 6
| Ti
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| W
|-
| 2
| V
| FabMate
|-
| 3
| Ti
| FabMate
|-
| 4
| Al
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr after pumping for 24 hours on main chamber, respectively.

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* <del>Examine the sample holder. There are three small pins. These pins, via a similar mechanism lock onto the stage inside the main chamber.</del>
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
*; Important note for AJA2:
*: If your entire process ends with Au deposition, use the dedicated Au sample holder. If your process ends with anything else, use the generic sample holder. This ensures that the surface on the Au sample holder remains consistent. This is important for RF substrate milling.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample. <del>The mechanism which locks the sample holder on to the stage in the main chamber, also simultaneously unlocks it from the loading arm.</del>
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the RF2 (sputtering target) stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick. Try turning on the power without ramping it.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo gate valve. Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool)
# Open nitrogen vent valve on the back left of the cryo
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close backing pump to cryo (screw valve under the loadlock turbo)
#* Might need to crack open the valve a bit. Setting turbo controller <code>012: EnableVent: off</code> doesn't help.
# Open backing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo gate valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2022-05-12T11:56:21Z

Karolis: /* Loading your sample */ added information about different holders on AJA2

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Karolis
|secondary = Martin
}}
There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, <del>heater in sample mount</del> and Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular 2" DC sputtering target, one 2" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling. Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.
Oxidation chamber on the loadlock.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2022 March 11):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Si
| FabMate
|-
| 2
| Cr
| intermetallic
|-
| 3
| Au2 (40 g)
| W
|-
| 4
| Au1 (80 g)
| W
|-
| 5
| Al1
| intermetallic
|-
| 6
| Ti
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| W
|-
| 2
| V
| FabMate
|-
| 3
| Ti
| FabMate
|-
| 4
| Al
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr after pumping for 24 hours on main chamber, respectively.

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* <del>Examine the sample holder. There are three small pins. These pins, via a similar mechanism lock onto the stage inside the main chamber.</del>
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
*; Important note for AJA2:
*: If your entire process ends with Au deposition, use the dedicated Au sample holder. If your process ends with anything else, use the generic sample holder. This ensures that the surface on the Au sample holder remains consistent. This is important for RF substrate milling.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample. <del>The mechanism which locks the sample holder on to the stage in the main chamber, also simultaneously unlocks it from the loading arm.</del>
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the RF2 (sputtering target) stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick. Try turning on the power without ramping it.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo gate valve. Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool)
# Open nitrogen vent valve on the back left of the cryo
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close backing pump to cryo (screw valve under the loadlock turbo)
#* Might need to crack open the valve a bit. Setting turbo controller <code>012: EnableVent: off</code> doesn't help.
# Open backing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo gate valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

Tools

2022-05-11T14:23:04Z

Karolis: /* Tool list */ fixed link to Olympus microscopes

A prerequisite for using the cleanroom tools is that a cleanroom staff member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the [[Training|training]] page and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].]
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system]. However, after a certain period of inactivity on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Tool list ==
{| style="width: 85%;"
|- style="text-align:left;"
! Lithography !! Thin film & III-Vs !! Characterization !! Other
|- valign="top"
| style="width: 20%;" |
* [[Heidelberg µPG 501|Heidelberg LED writer]]
* [[Süss mask aligner]]
* [[Raith eLine|Raith eLine 30 kV EBL/SEM]]
* [[Elionix_7000|Elionix 7000 100 kV EBL]]
* [[Elionix_F-125|Elionix F-125 125kV EBL]] (QuanTech)
| style="width: 20%;" |
* [[AJA systems]]
* [[E-Gun evaporator]]
* [[Edwards evaporator|Edwards thermal evaporator]]
* [[Laurell spinners]]
* [[Cambridge ALD]]
* [[Leica sputter coater]]
* [[MBE]]
| style="width: 20%;" |
* [[JEOL 6320F|JEOL JSM-6320F]]
* [[JEOL 7800F|JEOL JSM-7800F]]
* [[Raith eLine]]
* [[Philips TEM]]
* [[Tencor profilometer]]
* [[Alpha-SE ellipsometer]]

* [[Olympus microscopes]]
* [[Lynx EVO stereomicroscope]]
* [[Bruker Dimension Icon AFM]]
* [[Filmetrics reflectometer]]
* [[Probe station]]
| style="width: 20%;" |
* [[Süss scriber|Manual Süss scriber]]
* [[Loomis scriber|Automatic Loomis scriber]]
* [[Dicing saw]]
* [[AccuThermo RTA]]
* [[Plasma-Preen asher]]
* [[Diener plasma asher]]
* [[Tergeo plasma asher]]
* [[FS bonder]]

* [[Micromanipulator]]
* [[Präzitherm hotplates]]
* [[Critical point dryer]]
|}

== Tool access requirement guidelines ==

{| cellspacing=0px style="text-align: center;"
! scope="col" width="20%" align="right" |
! scope="col" width="20%" | Bachelor
! scope="col" width="20%" | Master
! scope="col" width="20%" | PhD
! scope="col" width="20%" | Postdoc
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|eLine]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Elionix]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|LED writer]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Süss mask aligner|Mask aligner]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA Systems|AJAs]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator|E-gun]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Edwards evaporator|Edwards]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Leica sputter coater|Leica sputter]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 6320F]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Philips TEM|TEM]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Tencor profilometer|Profilometer]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Alpha-SE Ellipsometer|Ellipsometer]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-

| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Filmetrics reflectometer|Filmetrics]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Süss scriber|Manual scriber]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #ff9f9f" | No
| style="background-color: #ff9f9f" | No
| style="background-color: #ff9f9f" | No
| style="background-color: #ff9f9f" | No
|-
| style="text-align:right; padding-right:6px;" | [[AccuThermo RTA|RTA]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Biorad]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Plasma-Preen asher|Microwave asher]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Diener plasma asher|Diener asher]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Tergeo Plasma Asher|Tergeo asher]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Laurell spinners|Spinners]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|}

[[Category:Tools]]

AJA systems

2022-05-09T14:42:11Z

Karolis: /* Standard oxidation procedure */ fixed Baratron value

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Karolis
|secondary = Martin
}}
There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, <del>heater in sample mount</del> and Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular 2" DC sputtering target, one 2" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling. Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.
Oxidation chamber on the loadlock.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2022 March 11):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Si
| FabMate
|-
| 2
| Cr
| intermetallic
|-
| 3
| Au2 (40 g)
| W
|-
| 4
| Au1 (80 g)
| W
|-
| 5
| Al1
| intermetallic
|-
| 6
| Ti
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| W
|-
| 2
| V
| FabMate
|-
| 3
| Ti
| FabMate
|-
| 4
| Al
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr after pumping for 24 hours on main chamber, respectively.

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* <del>Examine the sample holder. There are three small pins. These pins, via a similar mechanism lock onto the stage inside the main chamber.</del>
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample. <del>The mechanism which locks the sample holder on to the stage in the main chamber, also simultaneously unlocks it from the loading arm.</del>
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the RF2 (sputtering target) stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick. Try turning on the power without ramping it.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo gate valve. Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool)
# Open nitrogen vent valve on the back left of the cryo
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close backing pump to cryo (screw valve under the loadlock turbo)
#* Might need to crack open the valve a bit. Setting turbo controller <code>012: EnableVent: off</code> doesn't help.
# Open backing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo gate valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

Olympus microscopes

2022-05-09T12:48:35Z

Karolis: added link to Nikon scope

{{Infobox tool
|image = Tool Olympus BX51M.jpg
|toolfullname = Olympus BX51M Olympus BX53M
|website = http://www.olympus-ims.com/en/
|company = Olympus IMS
|description = Optical microscope
|location = Cleanroom 1 (03.2.209A) Cleanroom 2 (03.2.203B)
|primary = Nader
|secondary = Karolis
}}
There are Olympus BX metrology microscopes both in CR1 (BX51M) and CR2 (BX53M).
They have feature parity and are equipped with 4K cameras and motorized Märzhäuser Wetzlar Tango stages.
Objectives are 5x, 10x, 20x, 50x, 100x.
Ultimate optical resolution (Rayleigh limit) of the 100x objective should be ~400 nm (at 550 nm wavelength).

There is also a [[Nikon microscope]] with a similar feature set in CR1.

If you want to resolve smaller features, you can use:
* [[JEOL 7800F|JEOL JSM-7800F]] SEM
* [[Raith eLine]] SEM
* [[Philips TEM]]

If you want to resolve topographical features, you can use:
* [[Tencor profilometer]]
* [[Bruker Dimension Icon AFM]]

If you want to observe [[Resists|photoresist]], insert the green filter at the back of the microscope body.
Otherwise white light will expose your resist.

== Usage rules ==
No booking is required, but please be flexible with regard to needs of other users.

The microscopes should be left with the light turned off or all the way down using the controls on the microscope body.

Do not leave samples on the stage or elsewhere in the working area, they might get discarded.

Save images you want to keep to Z drive, local files might get discarded.

== How to: take an overview image ==
<gallery>
File:Olympus-define-overview-area.png|''Stage Navigator'' toolbar should be at the top left of the ''Stream Motion'' software, above the overview image.
File:Olympus-stage-navigator-menu.png|To enable ''Stage Navigator'' toolbar: ''View > Tool Windows > Stage Navigator''.
</gallery>

=== Scanning the area ===
# Make sure the ''Stage Navigator'' toolbar is open.
# Click the left-most icon ''Define Overview Area''.
# Follow the instructions on screen:
## Find the top-left of your area, press ''OK''.
## Find the bottom-right of your area, press ''OK''.
# The microscope will now automatically take and tile the images of the entire area defined by the two corners.
It is now possible to navigate the area by clicking on the overview image.

=== Saving the image ===
If you want to save the overview image:
# ''Right click on the overview image on the left > Open Overview Image''
# ''File > Save As... (Ctrl+Shift+S)''
# Select a filetype that suits your needs:
#* Lossy (recommended for overview images):
#** Recommended 85% quality JPEG (JFIF).
#** High quality compression is imperceptible by human eye.
#** Filesize can be some tens of megabytes.
#** JPEG2000 provides 5-10x smaller filesizes but is not a universally compatible image format.
#* Lossless:
#** Recommended PNG or uncompressed TIFF.
#** The filesize can easily be several hundred megabytes.
#** LZW TIFF compression can reduce the size in half, but the microscope PC struggles with it.
#** JPEG2000 provides lossless compression, but is not a universally compatible image format.
# Save directly into Z drive.

== Troubleshooting ==
; The corners of the image are dark (vignetting)!
: There is a mechanical spring that holds the microscope components together. It needs to be tightened by service. Please notify CR staff.
: For a temporary fix make a flatfield correction: ''Acquire > Devices > Device Settings > camera (UC90) > Shading Correction > Flatfield''
; Everything is green!
: There is a green filter at the back of the microscope body. It is used to observe photoresist without exposing it.
; The image is completely black!
: Switch from eyepiece mode to camera mode (or vice versa) using a rod at the top of the microscope body.
; The overview image is all jumbled up!
: The axes of the motorized stage got inverted by the software gremlins. You can try to fix this or simply ask the CR staff.
: Try: reverse X/Y axes in ''Acquire > Device Settings > Marzhauser Tango''
; The image is completely frozen!
: Turn on live imaging with the big button on the right side of the ''Stream Motion'' software.
; I can see a projection of the cleanroom lab in the image!
: Turn down the exposure/gain in the software and increase the light using the knob on the microscope body.
; The hand controller is not moving the stage!
: Verify that the install Märzhäuser Tango control software is installed.
== Remote access ==
* TeamViewer: SCOPE1, SCOPE2
* LogMeIn: Scope 1 (CR1) [OSIS-CR1Olympus], SCOPE2 (CR2)
[[Category:Tools]]
[[Category:Characterization]]

Nikon microscope

2022-05-09T12:47:58Z

Karolis: added link to Olympus scopes

{{Infobox tool
|image = Tool Nikon.jpg
|toolfullname = Nikon Eclipse LV150NA
|website = https://www.nikonmetrology.com/en-us/industrial-microscopes/upright-microscopes-eclipse-lv150na
|company = Nikon
|description = Optical microscope
|location = Cleanroom 1 (03.2.209A)
|primary = Nader
|secondary = Karolis
}}
There is a Nikon metrology microscope in CR1.
It is equipped with a DS-Ri2 digital camera and a motorized Märzhäuser Wetzlar Tango stage.
Objectives are 5x, 10x, 20x, 50x, 100x.
Ultimate optical resolution (Rayleigh limit) of the 100x objective should be ~400 nm (at 550 nm wavelength).

There are also two [[Olympus microscopes]] with a similar feature set.

If you want to resolve smaller features, you can use:
* [[JEOL 7800F|JEOL JSM-7800F]] SEM
* [[Raith eLine]] SEM
* [[Philips TEM]]

If you want to resolve topographical features, you can use:
* [[Tencor profilometer]]
* [[Bruker Dimension Icon AFM]]

If you want to observe [[Resists|photoresist]], insert the green filter at the back of the microscope body.
Otherwise white light will expose your resist.

== Usage rules ==
No booking is required, but please be flexible with regard to needs of other users.

The microscope should be left with the light turned off in the ''NIS-Elements'' software.

Do not leave samples on the stage or elsewhere in the working area, they might get discarded.

Save images you want to keep to Z drive, local files might get discarded.

== How to: take an overview image ==

=== Scanning the area ===
# Navigate to (outermost) points of interest, e.g. top left and bottom right corners of your chip. Consider turning off continuous autoexposure (''Continuous AE'').
# For each point: ''right click feature > Add this Point to ND Acquisition''
# After all features have been added, scan the image:
#* ''Acquire > Scan Large Image...''
#* or ''right click overview image area > Large Image: Scan Large Image...''
# The ''Scan Large Image'' window will open. Click the button with three green dots.
# The microscope will now automatically take and tile the images of the area defined by the points.

=== Saving the image ===
# Select a filetype that suits your needs:
#* Lossy (recommended for overview images):
#** Recommended lowest compression JPEG.
#** Low compression (high quality) images are indistinguishable from lossless images by human eye.
#** Filesize can be some tens of megabytes.
#* Lossless:
#** Recommended PNG or TIFF.
#** The filesize can easily be several hundred megabytes.
#** LZW TIFF compression can reduce the size in half.
#** PNG would be a quarter of the size, but only 8 bits per color instead of 16.
# Save directly into Z drive.

== Troubleshooting ==
; The corners of the image are dark (vignetting)!
: There is a mechanical spring that holds the microscope components together. It needs to be tightened by service. Please notify CR staff.
== Remote access ==
* TeamViewer: Scope3-Nikon
* LogMeIn: Scope 3 (CR1) [CR1-NikonScope]

[[Category:Tools]]
[[Category:Characterization]]

File:Tool Nikon.jpg

2022-05-09T12:45:22Z

Karolis:

AJA systems

2022-05-09T08:45:28Z

Karolis: added general info

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Karolis
|secondary = Martin
}}
There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, <del>heater in sample mount</del> and Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular 2" DC sputtering target, one 2" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling. Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.
Oxidation chamber on the loadlock.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2022 March 11):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Si
| FabMate
|-
| 2
| Cr
| intermetallic
|-
| 3
| Au2 (40 g)
| W
|-
| 4
| Au1 (80 g)
| W
|-
| 5
| Al1
| intermetallic
|-
| 6
| Ti
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| W
|-
| 2
| V
| FabMate
|-
| 3
| Ti
| FabMate
|-
| 4
| Al
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr after pumping for 24 hours on main chamber, respectively.

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* <del>Examine the sample holder. There are three small pins. These pins, via a similar mechanism lock onto the stage inside the main chamber.</del>
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample. <del>The mechanism which locks the sample holder on to the stage in the main chamber, also simultaneously unlocks it from the loading arm.</del>
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the RF2 (sputtering target) stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.148 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick. Try turning on the power without ramping it.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo gate valve. Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool)
# Open nitrogen vent valve on the back left of the cryo
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close backing pump to cryo (screw valve under the loadlock turbo)
#* Might need to crack open the valve a bit. Setting turbo controller <code>012: EnableVent: off</code> doesn't help.
# Open backing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo gate valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

Nikon microscope

2022-05-09T08:14:51Z

Karolis: created using Olympus as a template

{{Infobox tool
|image = Tool Nikon.jpg
|toolfullname = Nikon Eclipse LV150NA
|website = https://www.nikonmetrology.com/en-us/industrial-microscopes/upright-microscopes-eclipse-lv150na
|company = Nikon
|description = Optical microscope
|location = Cleanroom 1 (03.2.209A)
|primary = Nader
|secondary = Karolis
}}
There is a Nikon metrology microscope in CR1.
It is equipped with a DS-Ri2 digital camera and a motorized Märzhäuser Wetzlar Tango stage.
Objectives are 5x, 10x, 20x, 50x, 100x.
Ultimate optical resolution (Rayleigh limit) of the 100x objective should be ~400 nm (at 550 nm wavelength).

If you want to resolve smaller features, you can use:
* [[JEOL 7800F|JEOL JSM-7800F]] SEM
* [[Raith eLine]] SEM
* [[Philips TEM]]

If you want to resolve topographical features, you can use:
* [[Tencor profilometer]]
* [[Bruker Dimension Icon AFM]]

If you want to observe [[Resists|photoresist]], insert the green filter at the back of the microscope body.
Otherwise white light will expose your resist.

== Usage rules ==
No booking is required, but please be flexible with regard to needs of other users.

The microscope should be left with the light turned off in the ''NIS-Elements'' software.

Do not leave samples on the stage or elsewhere in the working area, they might get discarded.

Save images you want to keep to Z drive, local files might get discarded.

== How to: take an overview image ==

=== Scanning the area ===
# Navigate to (outermost) points of interest, e.g. top left and bottom right corners of your chip. Consider turning off continuous autoexposure (''Continuous AE'').
# For each point: ''right click feature > Add this Point to ND Acquisition''
# After all features have been added, scan the image:
#* ''Acquire > Scan Large Image...''
#* or ''right click overview image area > Large Image: Scan Large Image...''
# The ''Scan Large Image'' window will open. Click the button with three green dots.
# The microscope will now automatically take and tile the images of the area defined by the points.

=== Saving the image ===
# Select a filetype that suits your needs:
#* Lossy (recommended for overview images):
#** Recommended lowest compression JPEG.
#** Low compression (high quality) images are indistinguishable from lossless images by human eye.
#** Filesize can be some tens of megabytes.
#* Lossless:
#** Recommended PNG or TIFF.
#** The filesize can easily be several hundred megabytes.
#** LZW TIFF compression can reduce the size in half.
#** PNG would be a quarter of the size, but only 8 bits per color instead of 16.
# Save directly into Z drive.

== Troubleshooting ==
; The corners of the image are dark (vignetting)!
: There is a mechanical spring that holds the microscope components together. It needs to be tightened by service. Please notify CR staff.
== Remote access ==
* TeamViewer: Scope3-Nikon
* LogMeIn: Scope 3 (CR1) [CR1-NikonScope]

[[Category:Tools]]
[[Category:Characterization]]

Olympus microscopes

2022-05-09T07:41:14Z

Karolis: added link to resists

{{Infobox tool
|image = Tool Olympus BX51M.jpg
|toolfullname = Olympus BX51M Olympus BX53M
|website = http://www.olympus-ims.com/en/
|company = Olympus IMS
|description = Optical microscope
|location = Cleanroom 1 (03.2.209A) Cleanroom 2 (03.2.203B)
|primary = Nader
|secondary = Karolis
}}
There are Olympus BX metrology microscopes both in CR1 (BX51M) and CR2 (BX53M).
They have feature parity and are equipped with 4K cameras and motorized Märzhäuser Wetzlar Tango stages.
Objectives are 5x, 10x, 20x, 50x, 100x.
Ultimate optical resolution (Rayleigh limit) of the 100x objective should be ~400 nm (at 550 nm wavelength).

If you want to resolve smaller features, you can use:
* [[JEOL 7800F|JEOL JSM-7800F]] SEM
* [[Raith eLine]] SEM
* [[Philips TEM]]

If you want to resolve topographical features, you can use:
* [[Tencor profilometer]]
* [[Bruker Dimension Icon AFM]]

If you want to observe [[Resists|photoresist]], insert the green filter at the back of the microscope body.
Otherwise white light will expose your resist.

== Usage rules ==
No booking is required, but please be flexible with regard to needs of other users.

The microscopes should be left with the light turned off or all the way down using the controls on the microscope body.

Do not leave samples on the stage or elsewhere in the working area, they might get discarded.

Save images you want to keep to Z drive, local files might get discarded.

== How to: take an overview image ==
<gallery>
File:Olympus-define-overview-area.png|''Stage Navigator'' toolbar should be at the top left of the ''Stream Motion'' software, above the overview image.
File:Olympus-stage-navigator-menu.png|To enable ''Stage Navigator'' toolbar: ''View > Tool Windows > Stage Navigator''.
</gallery>

=== Scanning the area ===
# Make sure the ''Stage Navigator'' toolbar is open.
# Click the left-most icon ''Define Overview Area''.
# Follow the instructions on screen:
## Find the top-left of your area, press ''OK''.
## Find the bottom-right of your area, press ''OK''.
# The microscope will now automatically take and tile the images of the entire area defined by the two corners.
It is now possible to navigate the area by clicking on the overview image.

=== Saving the image ===
If you want to save the overview image:
# ''Right click on the overview image on the left > Open Overview Image''
# ''File > Save As... (Ctrl+Shift+S)''
# Select a filetype that suits your needs:
#* Lossy (recommended for overview images):
#** Recommended 85% quality JPEG (JFIF).
#** High quality compression is imperceptible by human eye.
#** Filesize can be some tens of megabytes.
#** JPEG2000 provides 5-10x smaller filesizes but is not a universally compatible image format.
#* Lossless:
#** Recommended PNG or uncompressed TIFF.
#** The filesize can easily be several hundred megabytes.
#** LZW TIFF compression can reduce the size in half, but the microscope PC struggles with it.
#** JPEG2000 provides lossless compression, but is not a universally compatible image format.
# Save directly into Z drive.

== Troubleshooting ==
; The corners of the image are dark (vignetting)!
: There is a mechanical spring that holds the microscope components together. It needs to be tightened by service. Please notify CR staff.
: For a temporary fix make a flatfield correction: ''Acquire > Devices > Device Settings > camera (UC90) > Shading Correction > Flatfield''
; Everything is green!
: There is a green filter at the back of the microscope body. It is used to observe photoresist without exposing it.
; The image is completely black!
: Switch from eyepiece mode to camera mode (or vice versa) using a rod at the top of the microscope body.
; The overview image is all jumbled up!
: The axes of the motorized stage got inverted by the software gremlins. You can try to fix this or simply ask the CR staff.
: Try: reverse X/Y axes in ''Acquire > Device Settings > Marzhauser Tango''
; The image is completely frozen!
: Turn on live imaging with the big button on the right side of the ''Stream Motion'' software.
; I can see a projection of the cleanroom lab in the image!
: Turn down the exposure/gain in the software and increase the light using the knob on the microscope body.
; The hand controller is not moving the stage!
: Verify that the install Märzhäuser Tango control software is installed.
== Remote access ==
* TeamViewer: SCOPE1, SCOPE2
* LogMeIn: Scope 1 (CR1) [OSIS-CR1Olympus], SCOPE2 (CR2)
[[Category:Tools]]
[[Category:Characterization]]

About

2022-05-09T07:17:03Z

Karolis: added price lists

== Cleanroom meetings ==

The [[Main Page|cleanroom]] staff and stake holders usually meet on Fridays at 12:30pm (HCØ 1st floor, room 03-1-114).
Users who have special requests or would like to discuss a cleanroom issue can join such a meeting; contact staff or drop by.

== Staff ==

{| class="wikitable"
|-
! Name
! Position
! Office
! Phone
! Email
|-
| Claus B. Sørensen
| technical head
| 03.02.216
| 28 75 04 49
| [mailto:cbs@nbi.ku.dk cbs@nbi.ku.dk]
|-
| Charles Marcus
| professor
| 03.4.406
| 20 34 11 81
| [mailto:marcus@nbi.ku.dk marcus@nbi.ku.dk]
|-
| Jesper Nygård
| professor
| 03.4.410
| 24 62 61 20
| [mailto:nygard@nbi.ku.dk nygard@nbi.ku.dk]
|-
| Nader Payami
| Chemical process engineer
| 03.2.214
| 28 75 04 50
| [mailto:nap@nbi.ku.dk nap@nbi.ku.dk]
|-
| Inger Jensen
| laborant
| 03.2.212
| 28 75 04 66
| [mailto:ijensen@nbi.ku.dk ijensen@nbi.ku.dk]
|-
| Henriette Lerche
| safety coordinator
| Blegdamsvej 17, Ka1
| 51 29 83 37
| [mailto:hlerche@nbi.ku.dk hlerche@nbi.ku.dk]

|-
| Karolis Parfeniukas
| nanolithography specialist
| 03.2.212
| 50 31 40 55
| [mailto:karolis.parfeniukas@nbi.ku.dk karolis.parfeniukas@nbi.ku.dk]
|-
| Martin Bjergfelt
| process specialist
| 03.2.212
| 21 16 13 65
| [mailto:martin.bjergfelt@nbi.ku.dk martin.bjergfelt@nbi.ku.dk]
|}
== Pricing ==
Current price lists as of 2022 January 1:
* [[Media:NBI cleanroom price list 1st January 2022.pdf|NBI-owned tools]]
* [[Media:Quantech pricing information 2022.pdf|QuanTech-owned tools]]

File:NBI cleanroom price list 1st January 2022.pdf

2022-05-09T07:11:20Z

Karolis:

File:Quantech pricing information 2022.pdf

2022-05-09T07:11:08Z

Karolis:

AJA systems

2022-05-04T15:25:51Z

Karolis: /* Troubleshooting */ expanded reflected power fix

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Karolis
|secondary = Martin
}}
<del>For the tools' maintenance log, click [[AJA Systems maintenance log|here]].</del>

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two DC sputtering targets, <del>heater in sample mount</del> and Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular DC sputtering target, one DC sputtering target with adjustable working distance, one RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling. Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.
Oxidation chamber on the loadlock.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2022 March 11):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Si
| FabMate
|-
| 2
| Cr
| intermetallic
|-
| 3
| Au2 (40 g)
| W
|-
| 4
| Au1 (80 g)
| W
|-
| 5
| Al1
| intermetallic
|-
| 6
| Ti
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| W
|-
| 2
| V
| FabMate
|-
| 3
| Ti
| FabMate
|-
| 4
| Al
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr after pumping for 24 hours on main chamber, respectively.

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* <del>Examine the sample holder. There are three small pins. These pins, via a similar mechanism lock onto the stage inside the main chamber.</del>
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample. <del>The mechanism which locks the sample holder on to the stage in the main chamber, also simultaneously unlocks it from the loading arm.</del>
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the RF2 (sputtering target) stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.148 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick. Try turning on the power without ramping it.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo gate valve. Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool)
# Open nitrogen vent valve on the back left of the cryo
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close backing pump to cryo (screw valve under the loadlock turbo)
#* Might need to crack open the valve a bit. Setting turbo controller <code>012: EnableVent: off</code> doesn't help.
# Open backing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo gate valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

FS bonder

2022-05-03T11:11:01Z

Karolis: /* Common Issues */

{{Infobox tool
|image = Tools FS bonder.jpg
|toolfullname = F&S Bondtec 5630
|website = https://www.fsbondtec.at/?lang=en
|company = F&S Bondtec
|description = Semi-automatic bonder
|location = 1st floor lab (03.1.111)
|primary = Nader
|secondary = Karolis
}}
F/S Bondtec 5630 is a semi-automatic bonder.
Users typically use it to bond semiconductor substrates to PCB daughterboards.
It uses a 25 um aluminum wire, bonded at room temperature.

The bonder shares the flow hood and PC monitor with the [[Lynx EVO stereomicroscope]].
The source PC can be switched by pressing <code>Scroll Lock, Scroll Lock, Enter</code> on the keyboard.
== Standard operating procedure ==
''adapted from an original SOP by Masoomeh''

This is a standard operating procedure (SOP) describing the use of F&S 5630 bonder on the first floor Lab.

=== Preparation ===
* Turn on the light on top of the laminar air flow bench. Set flow between 2-5.
* Open the sash.
* Start the 5630 program [red]
** Do you want to move home?: Yes
** Do you want to open the last bonding program?: No
* Load the appropriate block for your daughterboard. There are three different blocks corresponding to different daughterboards/PCBs:
** Copenhagen
** Sydney
** transmon
* Remove the dummy daughterboard from the block.
* Screw your PCB (with a chip glued onto it) onto the block.
** In case of the transmon block, you can further secure your board to the block:
*** Turn on the vacuum pump located in the left behind the bonder
*** Click on "device clamp" in ribbon.

=== First-time setup ===
* <code>File > New</code>
** "Create Program Dialog" box appears.
*** Data source: Create from default value
**** 25 um
* Use the joystick to move to the bonding pads on the daughterboard (not your chip)
** It should be at least 5 mm away from any screws or connectors.
* "Global Camera setting": Adjust Gain and Shutter to make the daughter board visible.
* Adjust head height to see the PCB in focus
** press button on joystick, tilt joystick down slowly
* <code>Next</code>
* <code>Store trace - 6</code> to set "Workheight1"
* <code>Store trace - 6</code> to set "Workheight2"
* Bring the bonding head halfway down (no closer than 5 mm above the highest point of any screws)
* <code>Store trace - 6</code> to set "Joystick Limit"
* <code>Store trace - 6</code> to set "max z position"
** The head will touch down on the PCB and adjust the height. Note that the head might leave a small mark where it touches down.
** In all of these four states you don’t need to move the stage or change the height of the head (except height for "joystick limit").
* <code>Next</code>
* Bonding parameter suggestions:
** Bond force: 25
** US power: 80
** Total bond time: 25
** Other parameters default
*** You can change these parameters later ant any point before/during/after bonding.
*** You are encouraged to look up parameters that previous users have used on similar surfaces.
**** The easiest way to gain access to other software at this point is to press <code>Windows key</code>.
* <code>File > Save as...</code> to save your bonding program.
** Please make a folder for yourself in the users folder.

=== Bonding ===
* <code>File</code> to load your program.
* <code>F1</code> to bring up the bonding dialog.

* In <code>Bond1</code>:
** Move the stage near the bonding pads of your PCB, at least 5 mm away from connectors or screws.
** Adjust light settings and focus on the PCB.
** <code>Store trace - 6</code> to store PCB height.
* Press <code>Right - 2</code> or click on <code>Bond2</code>. Note that the head might leave a small mark where it touches down.

* In <code>Bond2</code>:
** Move the stage near the bonding pads of your chip.
** Adjust light settings and focus on the chip.
** <code>Store trace - 6</code> to store chip height. Note that the head might leave a small mark where it touches down.

* Now you are ready to bond! Drag and drop Bond1 and Bond2 on the desired positions and then press <code>F1</code> to bond.

Notes:
* Arrows left/right move between Bond1 and Bond2
* Pressing <code>F1</code> bond on Bond1 moves to Bond2 position
* Pressing <code>F1</code> bond on Bond2 bonds
* Pressing <code>0 home | escape</code> homes the stage, turns off light, turns off camera

=== Clean-up ===
* Check the thread
** <code>Feed #</code> feeds a bit of the wire. If the wire does not come out of the wedge you need to rethread the wire.
* Close the bonding window. Save the bond program by selecting <code>File > Save</code> if you would like to save your changes.
* Close the 5630 program.
* Wait until the sample stage move to its home position.
* Unscrew your PCB.
* Check that all of the fuzz buttons are present. If not, replace.
* Screw on the protector plate.
* Fill in the log. Requires fields are name, date and comments/problems if there are any.
* Turn off the vacuum pump if you were using it during bonding.
* Close the sash.
* Turn down the air flow to 1.
* Turn off the light.

== How to: reuse a program (single wire mode) ==
''adapted from instructions written by Rob McNeil''

# Turn on air flow. Open the sash.
# Start 5630 program and click "yes" at the "Do you want to move home?" dialog box.
# Mount your PCB with sample on brass sample holder so that sample and PCB is securely held down (glue/resist/vacuum). Load brass sample holder onto bonder stage if not already mounted.
#: Load selected program "File > Open"
#; Warning:
#: It is usually safe to load any program written for the specific sample holder you are using (standard thickness brass block is 10mm). If you have a PCB with additional features e.g. capacitors or extra tall connectors beware when loading programs, the last bond position (to which the bonder will drive directly when you open the bonding dialog) may be INSIDE one of your tall features. It is safest to load the program first, open the bonding dialog, and check the bond head position and height and then go to "Home position" to load your sample/PCB. If in doubt ask an experienced user or a member of staff.
# If required select "Single Wire" mode.
# Press <code>Bond - F1</code> to bring up the Bonding Dialog...
#:It is very strongly recommended that you perform a touch down to verify the height of your chip and PCB before you start bonding. If you don't and you are unlucky you may damage your chip and/or bend the bondhead! You have been warned!
#:# Adjust Bond1 focus and light settings until you can see the PC in reasonably sharp focus.
#:# Drag and drop the Bond1 position to a suitable touchdown location (e.g. Bond pad at least 5mm away from any connectors - remember the rear of the wedge.)
#:# Click to place the cursor in the "Height" box
#:# Press <code>Store Trace - 6</code>, bondhead will now touch down and update both the bond height and the focus height for Bond1.
#:# Switch to Bond2 tab and repeat steps 2-4. Note the touch down will probably leave a small mark so select a location (e.g. Off-mesa/blank space) where you do not actually want to bond.
# Drag and drop the bond end points and <code>Bond - F1</code> as normal.

== Common issues ==

''adapted from Rob McNeil''

; The bond is in the wrong place, even though the Bond1 Bond2 positions were correctly set
: If you use <code>Bond - F1</code> to switch between the tabs "Bond1 > Bond2 > BOND" make sure the stage has finished moving before pressing <code>F1</code> to advance.
: The bonder appears to read the stage instantaneous position as you switch tabs, rather than use the stored bond position.

; DLC flatline
If you see a DLC curve flatline near 0 (usually accompanied by a failed bond) it is likely the bond wire has come out of the wedge or clamp and needs rethreading. Try <code>Wire Feed -#</code> to check if you can see the wire tail first.
hardware tention delected

; Z motor error
: Can happen "randomly" but most common after a failed bond.
:# Check to see if the red sensor light on the left-hand side of the bond head is ON.
:# If it is on, gently rotate the mushroom shaped wheel clockwise until the red light goes off.
:# Restart 5630 software (save? Yes) and carry on bonding as before.

; After power loss, if the ultrasound generator lights are red:
: Check the blue ultrasound generator software and reset the errors in each tab

; Other errors
: Most other problems can be resolved by saving and restarting the 5630 program. But please take a screenshot and report the problem to the [[About|cleanroom staff]]: [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].

== Weight calibration ==

''adapted from an original SOP by Masoomeh''

=== Procedure ===
* Place a digital weighing scale on the bonder sample holder. You will need a scale with a range over 200 g.
* Make a new bond program for the height of the scale.
* Bonder software: <code>Mode > Head calibration</code>
* In BW-Calib tab:
** Weight point 1: <code>Store trace - 6</code>
*** Needle comes down and presses on the scale.
*** Update weight point 1.
** Weight point 2: <code>Store trace - 6</code>
*** Needle comes down and presses on the scale.
*** Update weight point 2.
** Repeat until both weights are accurate within 1 g.

=== Calibration test ===
* Open the bond program for the scale.
* <code>F1</code> to open the bonding window.
* Click on <code>Bond1</code>.
* Set the bonding force to e.g. 25 g and US power to 0.
* Change to step mode with <code>F2</code>.
* <code>F1</code> to go through the bonding steps until the head presses on the scale.
* Verify that the weight is within 1 g, otherwise repeat the procedure.

[[Category:Tools]]

FS bonder

2022-05-03T11:10:43Z

Karolis: /* How to: reuse a Program (SingleWire mode) */ capitalization

{{Infobox tool
|image = Tools FS bonder.jpg
|toolfullname = F&S Bondtec 5630
|website = https://www.fsbondtec.at/?lang=en
|company = F&S Bondtec
|description = Semi-automatic bonder
|location = 1st floor lab (03.1.111)
|primary = Nader
|secondary = Karolis
}}
F/S Bondtec 5630 is a semi-automatic bonder.
Users typically use it to bond semiconductor substrates to PCB daughterboards.
It uses a 25 um aluminum wire, bonded at room temperature.

The bonder shares the flow hood and PC monitor with the [[Lynx EVO stereomicroscope]].
The source PC can be switched by pressing <code>Scroll Lock, Scroll Lock, Enter</code> on the keyboard.
== Standard operating procedure ==
''adapted from an original SOP by Masoomeh''

This is a standard operating procedure (SOP) describing the use of F&S 5630 bonder on the first floor Lab.

=== Preparation ===
* Turn on the light on top of the laminar air flow bench. Set flow between 2-5.
* Open the sash.
* Start the 5630 program [red]
** Do you want to move home?: Yes
** Do you want to open the last bonding program?: No
* Load the appropriate block for your daughterboard. There are three different blocks corresponding to different daughterboards/PCBs:
** Copenhagen
** Sydney
** transmon
* Remove the dummy daughterboard from the block.
* Screw your PCB (with a chip glued onto it) onto the block.
** In case of the transmon block, you can further secure your board to the block:
*** Turn on the vacuum pump located in the left behind the bonder
*** Click on "device clamp" in ribbon.

=== First-time setup ===
* <code>File > New</code>
** "Create Program Dialog" box appears.
*** Data source: Create from default value
**** 25 um
* Use the joystick to move to the bonding pads on the daughterboard (not your chip)
** It should be at least 5 mm away from any screws or connectors.
* "Global Camera setting": Adjust Gain and Shutter to make the daughter board visible.
* Adjust head height to see the PCB in focus
** press button on joystick, tilt joystick down slowly
* <code>Next</code>
* <code>Store trace - 6</code> to set "Workheight1"
* <code>Store trace - 6</code> to set "Workheight2"
* Bring the bonding head halfway down (no closer than 5 mm above the highest point of any screws)
* <code>Store trace - 6</code> to set "Joystick Limit"
* <code>Store trace - 6</code> to set "max z position"
** The head will touch down on the PCB and adjust the height. Note that the head might leave a small mark where it touches down.
** In all of these four states you don’t need to move the stage or change the height of the head (except height for "joystick limit").
* <code>Next</code>
* Bonding parameter suggestions:
** Bond force: 25
** US power: 80
** Total bond time: 25
** Other parameters default
*** You can change these parameters later ant any point before/during/after bonding.
*** You are encouraged to look up parameters that previous users have used on similar surfaces.
**** The easiest way to gain access to other software at this point is to press <code>Windows key</code>.
* <code>File > Save as...</code> to save your bonding program.
** Please make a folder for yourself in the users folder.

=== Bonding ===
* <code>File</code> to load your program.
* <code>F1</code> to bring up the bonding dialog.

* In <code>Bond1</code>:
** Move the stage near the bonding pads of your PCB, at least 5 mm away from connectors or screws.
** Adjust light settings and focus on the PCB.
** <code>Store trace - 6</code> to store PCB height.
* Press <code>Right - 2</code> or click on <code>Bond2</code>. Note that the head might leave a small mark where it touches down.

* In <code>Bond2</code>:
** Move the stage near the bonding pads of your chip.
** Adjust light settings and focus on the chip.
** <code>Store trace - 6</code> to store chip height. Note that the head might leave a small mark where it touches down.

* Now you are ready to bond! Drag and drop Bond1 and Bond2 on the desired positions and then press <code>F1</code> to bond.

Notes:
* Arrows left/right move between Bond1 and Bond2
* Pressing <code>F1</code> bond on Bond1 moves to Bond2 position
* Pressing <code>F1</code> bond on Bond2 bonds
* Pressing <code>0 home | escape</code> homes the stage, turns off light, turns off camera

=== Clean-up ===
* Check the thread
** <code>Feed #</code> feeds a bit of the wire. If the wire does not come out of the wedge you need to rethread the wire.
* Close the bonding window. Save the bond program by selecting <code>File > Save</code> if you would like to save your changes.
* Close the 5630 program.
* Wait until the sample stage move to its home position.
* Unscrew your PCB.
* Check that all of the fuzz buttons are present. If not, replace.
* Screw on the protector plate.
* Fill in the log. Requires fields are name, date and comments/problems if there are any.
* Turn off the vacuum pump if you were using it during bonding.
* Close the sash.
* Turn down the air flow to 1.
* Turn off the light.

== How to: reuse a program (single wire mode) ==
''adapted from instructions written by Rob McNeil''

# Turn on air flow. Open the sash.
# Start 5630 program and click "yes" at the "Do you want to move home?" dialog box.
# Mount your PCB with sample on brass sample holder so that sample and PCB is securely held down (glue/resist/vacuum). Load brass sample holder onto bonder stage if not already mounted.
#: Load selected program "File > Open"
#; Warning:
#: It is usually safe to load any program written for the specific sample holder you are using (standard thickness brass block is 10mm). If you have a PCB with additional features e.g. capacitors or extra tall connectors beware when loading programs, the last bond position (to which the bonder will drive directly when you open the bonding dialog) may be INSIDE one of your tall features. It is safest to load the program first, open the bonding dialog, and check the bond head position and height and then go to "Home position" to load your sample/PCB. If in doubt ask an experienced user or a member of staff.
# If required select "Single Wire" mode.
# Press <code>Bond - F1</code> to bring up the Bonding Dialog...
#:It is very strongly recommended that you perform a touch down to verify the height of your chip and PCB before you start bonding. If you don't and you are unlucky you may damage your chip and/or bend the bondhead! You have been warned!
#:# Adjust Bond1 focus and light settings until you can see the PC in reasonably sharp focus.
#:# Drag and drop the Bond1 position to a suitable touchdown location (e.g. Bond pad at least 5mm away from any connectors - remember the rear of the wedge.)
#:# Click to place the cursor in the "Height" box
#:# Press <code>Store Trace - 6</code>, bondhead will now touch down and update both the bond height and the focus height for Bond1.
#:# Switch to Bond2 tab and repeat steps 2-4. Note the touch down will probably leave a small mark so select a location (e.g. Off-mesa/blank space) where you do not actually want to bond.
# Drag and drop the bond end points and <code>Bond - F1</code> as normal.

== Common Issues ==

''adapted from Rob McNeil''

; The bond is in the wrong place, even though the Bond1 Bond2 positions were correctly set
: If you use <code>Bond - F1</code> to switch between the tabs "Bond1 > Bond2 > BOND" make sure the stage has finished moving before pressing <code>F1</code> to advance.
: The bonder appears to read the stage instantaneous position as you switch tabs, rather than use the stored bond position.

; DLC flatline
If you see a DLC curve flatline near 0 (usually accompanied by a failed bond) it is likely the bond wire has come out of the wedge or clamp and needs rethreading. Try <code>Wire Feed -#</code> to check if you can see the wire tail first.
hardware tention delected

; Z motor error
: Can happen "randomly" but most common after a failed bond.
:# Check to see if the red sensor light on the left-hand side of the bond head is ON.
:# If it is on, gently rotate the mushroom shaped wheel clockwise until the red light goes off.
:# Restart 5630 software (save? Yes) and carry on bonding as before.

; After power loss, if the ultrasound generator lights are red:
: Check the blue ultrasound generator software and reset the errors in each tab

; Other errors
: Most other problems can be resolved by saving and restarting the 5630 program. But please take a screenshot and report the problem to the [[About|cleanroom staff]]: [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].

== Weight calibration ==

''adapted from an original SOP by Masoomeh''

=== Procedure ===
* Place a digital weighing scale on the bonder sample holder. You will need a scale with a range over 200 g.
* Make a new bond program for the height of the scale.
* Bonder software: <code>Mode > Head calibration</code>
* In BW-Calib tab:
** Weight point 1: <code>Store trace - 6</code>
*** Needle comes down and presses on the scale.
*** Update weight point 1.
** Weight point 2: <code>Store trace - 6</code>
*** Needle comes down and presses on the scale.
*** Update weight point 2.
** Repeat until both weights are accurate within 1 g.

=== Calibration test ===
* Open the bond program for the scale.
* <code>F1</code> to open the bonding window.
* Click on <code>Bond1</code>.
* Set the bonding force to e.g. 25 g and US power to 0.
* Change to step mode with <code>F2</code>.
* <code>F1</code> to go through the bonding steps until the head presses on the scale.
* Verify that the weight is within 1 g, otherwise repeat the procedure.

[[Category:Tools]]

Alpha-SE ellipsometer

2022-05-03T11:07:22Z

Karolis: /* Remote access */ fixed PC names

{{Infobox tool
|image = Tools alpha-SE ellipsometer.jpg
|toolfullname = J.A. Woollam alpha-SE Ellipsometer
|website = https://www.jawoollam.com/products/alpha-se-ellipsometer
|company = J.A. Woollam
|description = Ellipsometer
|location = 2nd floor lab (03.2.213)
|primary = Karolis
}}
The Woollam alpha-SE ellipsometer is a characterization tool for transparent thin film thickness and roughness measurements by evaluating change in reflected/transmitted light polarization.
Getting an accurate result relies on your substrate knowledge.
Therefore, it is best to measure your samples before and after film deposition using the same model.

Most users at NBI use it to measure:
* [[Resists|resist]]
* films deposited by [[Cambridge ALD|ALD]]
* in some cases, films deposited by [[AJA systems|PVD]]
* oxide on semiconductor chips

Other alternatives to measure film thickness at the [[Main Page|NBI cleanroom]] facilities:
* [[Bruker Dimension Icon AFM]]
* [[Tencor profilometer]]
* [[Filmetrics reflectometer]]
* in some cases, [[JEOL 7800F]] SEM
== Quick-start guide ==
Video on how to operate the alpha-SE Ellipsometer:

[[File:Ellipsometer.mp4|500px]]

[https://youtu.be/8NP7sFV3vzo Click here to watch the video on YouTube]
# Prepare for measurement:
#* Turn on using the green button on the top left of the tool.
#* Turn on the small orange pump behind the ellipsometer.
#* Place your sample on the slit in the middle of the instrument. Make sure the two small holes are covered.
#* Flip the ''Sample Vacuum'' switch on the front right of the tool.
# On the PC, open the ''Complete EASE'' software:
#* Mode: Standard
#* Angles: 65°, 70°, 75°
#* Model: choose from list
#* Save Data after Measurement: user choice
#* <code>Measure</code>
# Perform the measurement by following the prompts in the software:
#* Pull out the spring lock and move the laser arm to the requested angle. Make sure the spring locks into the slot.
#* Repeat for the other side.
#* <code>OK</code>
#* Wait until the first part of the measurement finishes.
#* Repeat for all requested angles.
# Read out film thickness value, uncertainty, mean squared error (MSE).
# Finish up:
#* Switch off vacuum
#* Unload sample
#* Turn off pump
#* Turn off tool
# Done!
== Remote access ==
* TeamViewer: WOOLLAM
* LogMeIn: WOOLLAM (213)
[[Category:Tools]]
[[Category:Characterization]]

Micromanipulator

2022-05-03T11:06:55Z

Karolis: /* Remote access */

{{Infobox tool
|image = Tools_Micromanipulator.jpg
|toolfullname = Micromanipulator
|company = Leica/Zaber/Eppendorf
|description = Optical microscope + motorized stage + manipulator arm
|location = Basement, Elionix room 03.01.K03
|primary = Karolis
|secondary = Martin
}}

Micromanipulator is a setup meant for nanowire transfer from a source substrate to a target substrate.
This is done using a transfer arm that can move with sub-micrometer precision.
The substrates can be moved with a motorized stage in x, y, z, and rotated around the z axis.
The action can be observed through a microscope/camera.
== Usage rules ==
Do not place used probes back into the box. If you want to reuse a probe in the future, put it in your own box and clearly label the box. Unknown boxes will be disposed of.

Put used probes into the sharps bin. Do not close the sharps bin fully but leave a small gap to put probes.

Wipe all surfaces both before and after using the tool.
Nanowires can be [[Working with nanowires and nanotubes|very toxic]].
They are small enough to get into human cells and damage their DNA.
The length of the DNA molecule is ~5 um, and most nanowires used at this tool are small enough to damage this molecule.

III-V semiconductors that the nanowires can include can also be very toxic.
Take care of your own [[Safety|safety]] and also the safety of your colleagues.

Try your best not to crash the microscope objectives into the substrate or stage.
Let the [[About|staff]] know if this happens -- send a short message to [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].

== Usage guide ==
Most users have a specific use case for the manipulator.
Therefore this short guide should only act as a guideline.
There is no wrong way to use the tool!

The following instructions use the paradigm of fixing the focal plane and only changing the z position of the stage and the probe.
It is entirely a matter of preference as it can be equally efficient to constantly change the focal plane to e.g. follow the probe movements.

=== Prepare for work ===
# Put on gloves and wipe down all surfaces that you might touch: handrest, joysticks, stage, knobs.
# Make sure the PC is working and the LAS software is running. If not, reboot and launch the software.
# On the stage joystick: <code>Long press 1</code> to home all axes.
# Make sure the stage is at the lowest vertical position and then move it up at least two steps.
# Place your source and target chips on the stage.
# Turn on the light: only the green button on the right.
# Increase the light intensity: turn the knob clockwise. The more light, the faster the camera can produce visible images.
=== Find the target and source locations ===
# Use the knobs on the linear drives to quickly position the target chip under the microscope light.
# Use the joystick to find the target location for the transfer. Place it in the center of the field of view.
# Adjust the working distance of the microscope using the knob on the right.
# Change to a higher magnification objective. Only touch the big ridged ring and not the objectives themselves. Adjust focus again. Repeat until the image is in focus with the highest magnification.
# <code>Long press 5</code> to save the stage position. This is the ''target position''. To prevent accidents caused by unintended button presses, save it to 3 & 4 as well.
# '''Do not touch the microscope focus from this point on.''' All further movements assume we know where the focal plane is at all times.
# Repeat the procedure for the source chip. Instead of moving the microscope focus, move the stage vertically. You can do this by twisting the joystick.
# <code>Long press 3</code> to save the stage position. This is the ''source position''.
# <code>Short press 5</code> to verify the target position. Adjust z if needed and save again. The stage repeatability in z is not exact, so there might be small inaccuracies.
# <code>Short press 3</code> to verify the source position. Adjust z if needed and save again.
=== Get the probe ready ===
# <code>Short press 5</code> to return to the target position.
# Swing the transfer arm out and take out the probe holder.
# Place a desired probe in the probe holder. The visible shank length should be comparable to the wire.
# Adjust the probe holder to the desired angle.
# Set the probe controller to <code>coarse</code>.
# While watching the probe wire, carefully swing the arm back in. The wire should not touch the substrate. The arm/probe should not touch the objective. Move the arm with the controller if needed.
# Change to the lowest magnification.
# Use the controller to move the wire in the xy plane until you can see it in the field of view.
# Move it down until the tip starts to move into focus. Then change to higher magnification and <code>fine</code> movement speed.
# Change to <code>x-fine</code> and repeat the process until you are at the highest magnification and the probe is nearly touching the surface.
# Lightly touch the surface with the probe.
# Look at the controller and move '''up''' 30 um.
# <code>Long press Pos 1</code> to save the probe position. This is the ''probe approach position''.
# Move up 300 um more (or more if you have a large difference in substrate thicknesses). <code>Long press Pos 2</code> to save the probe position. This is the ''transfer position''. Save it to <code>Pos 3</code> as well, just in case.
=== Ready ===
# Now you are ready to transfer!
#* <code>Short press 3</code> moves the stage to ''source position''.
#* <code>Short press 5</code> moves the stage to ''target position''.
#* <code>Short press Pos 1</code> lowers the probe to ''approach position''.
#* <code>Short press Pos 2</code> raises the probe to ''transfer position''.
=== Done ===
When you are done transferring:
# <code>Short press Pos 2</code> to raise the probe and swing out the arm.
# Take out the probe and put it in the yellow sharps bin.
# <code>Long press 1</code> to home the stage and take your substrates.
# Log your work and any issues you noticed. Notify the staff if there's anything wrong with the setup or you're using probes from the last silver pouch.
# Wipe down all surfaces that you might have touched: handrest, joysticks, stage, knobs.
# Done!

== Instrumentation ==
=== Manipulator arm ===
[[File:Micromanipulator_Transferman_4r_controller.jpg|thumb|Transferman 4r controller]]
* Eppendorf TransferMan 4r system
* or a custom manual arm

Regardless of which arm is used, there are markings on the optical table denoting where it should be fixed.

The Transferman 4r offers 3 programmable positions and 3 programmable movement speeds.
You should be very careful and only use the two faster movement speeds at low microscope magnification, and only when far away from the substrate vertically.
Be conservative with selecting the saved positions, since crashing the probe into the substrate can ruin your work very easily.
Both short instructions and full operating manual can be found [https://www.eppendorf.com/dk-en/eShop-Products/Cell-Manipulation/Micromanipulation/TransferMan-4r-p-PF-26484 online].

The optimal angle for the probe depends on the nanowire stiffness, substrate geometry and substrate surface properties.
A good starting point is 15°.
=== Stage ===
[[File:Micromanipulator_stage_joystick.jpg|thumb|Zaber stage joystick]]
The stage is a stack of Zaber motion modules:
{| class="wikitable"
|-
|[https://www.zaber.com/manuals/X-JOY3 X-JOY3]
|Programmable 3-axis joystick
|-
|[https://www.zaber.com/manuals/X-LSM X-LSM100A] x2
|2 linear stages, <3 um repeatability
|-
|[https://www.zaber.com/manuals/X-RSW-E X-RSW60C-E03]
|Motorized rotary stage
|-
|[https://www.zaber.com/manuals/X-VSR X-VSR20A]
|Vertical lift stage, <1 um repeatability
|-
|}
The modules can be moved directly using the knobs on each module.
For the x/y stages the knobs increase/decrease velocity, single press decelerates, double press instantly stops.
Rotation/z stages are moved one step per knob position.

The joystick should have these functions:
{| class="wikitable"
! Key || Short Press || Long Press
|-
| 1 || Stop all axes || Home all axes
|-
| 2 || Send alerts* 1, 2 || Send alerts* 1, 3, 4
|-
| 3 || Move to saved position || Save current position
|-
| 4 || Move to saved position || Save current position
|-
| 5 || Move to saved position || Save current position
|-
| 6 || Axis x low speed || Axis x high speed
|-
| 7 || Axis y low speed || Axis y high speed
|-
| 8 || Rotation low speed || Rotation high speed
|-
|}
The joystick functions can be changed through the ''[https://www.zaber.com/software Zaber console] - 1'' software.

=== Microscope ===
This is currently a Leica DM2500 MH microscope body, Leica [https://www.leica-microsystems.com/products/microscope-cameras/p/leica-mc170-hd/downloads/ MC170 HD] camera and Leica acquisition software setup.

The field of view/depth of field/resolution of this setup is somewhat limited, but should be good enough for most users.

In fact, short depth of field lets you judge the relative vertical position between the probe and the substrate.

=== Probes ===
[[File:72X_dim.png|thumb|Probe dimensions in inches]]
Also known as needles.
These are thin tungsten wire on a thicker nickel shank.
We use 72X-G2/01 (0.1 um tip radius) and 72X-G2/025 (0.25 um) from [https://www.americanprobe.com/72x-tungsten-wire-3-mil-probe.html American Probe].
The taper model can be found in this handy chart: [[Media:American-Probe-taper-model.pdf|.pdf]].

== Troubleshooting ==
; I can't get any light through the microscope!
<gallery>
File:Micromanipulator_lamp_off.jpg|Lamp turned off
File:Micromanipulator_lamp_on.jpg|Lamp turned on. Notice that the left button remains in the same position.
</gallery>
: Someone probably switched the light source to back lighting. The microscope does not support this. Simply flip the up-down arrow button on the light source. Double check that the green power button is lit, and the knob is not at the minimum position.
; The camera output is completely frozen!
: Turn on live capture mode.
; I would like to save an image of what I see but I don't know how!
: Press ''Acquire image'' in the bottom left of the Leica software window.
; Everything on the PC is frozen, I can't move the mouse cursor!
: The PC has crashed. Find the power button on the PC under the optical table and hold it for several seconds until the PC restarts.
; The image is very strange!
: Maybe someone crashed the lens into the stage and did not tell anyone. Move the stage and the manipulator out of the way, carefully unscrew the questionable objective, blow away any dust with the nitrogen gun, and very gently wipe the lens with mild solvent. Original cleaning instructions from the manufacturer can be found [https://www.leica-microsystems.com/products/light-microscopes/p/leica-dm2500-mh/downloads/ online].
; The image on the screen updates only every few seconds!
: The automatic exposure function in the software collects enough light to see a good signal. Try to increase the light intensity by turning the knob on the power supply clockwise.
; The image is too bright/dark!
: There are two options:
<gallery>
File:Micromanipulator_auto_exposure.png|Auto exposure
</gallery>
:# The automatic exposure fuction in the software is turned off. The iris button in the top left of the Leica Acquisition Suite window should be red: ''Acquire > Camera > Automatic exposure''.
:# If it is already active and at the exposure limit, try adjusting the light intensity.

== Ordering probes & service ==
This information is on the [https://wiki.nbi.ku.dk/qdevwiki/Micromanipulator internal QDev wiki].
== Remote access ==
* TeamViewer: uManipulator
* LogMeIn: uMANIPULATOR (K03A)
[[Category:Tools]]

Lynx EVO stereomicroscope

2022-05-03T11:04:45Z

Karolis: /* Remote access */ removed LogMeIn (not installed on PC)

{{Infobox tool
|image = Tools Lynx EVO.jpg
|toolfullname = Lynx EVO
|website = https://www.visioneng.us/products/stereo-microscopes/lynx-evo/
|company = Vision Engineering
|description = Stereomicroscope
|location = 1st floor lab (03.1.111)
|primary = Karolis
}}
Lynx EVO is a special microscope that gives sense of depth and has a large peripheral viewing angle due to its eyepiece-less design.
It is mostly used to check your work after bonding and to save a reference image.

The Lynx EVO shares the computer screen with the [[FS bonder]].
The source PC can be switched by pressing <code>Scroll Lock, Scroll Lock, Enter</code> on the keyboard.
== Usage instructions ==
# Turn on the power supply on the left side of the microscope.
# Turn the knob on the power supply clockwise to increase the light intensity. 20% (one increment) of the scale is a good starting point.
# Place your sample under the microscope and check if you can see it.
# Adjust the focus by turning the double knob on the side of the microscope. The larger wheel adjusts the working distance coarsely, and the smaller does finer adjustments. You should be able to see your sample through the big eyepiece.
#: If you cannot reach a reasonable focus, maybe your sample is too low/high? Even though it is possible to move the whole microscope, first try changing the vertical position of your sample. Try putting it on a small box if you had it on the workbench, and vice-versa.
# Adjust the zoom by turning the other knob on the side of the microscope.
# If you want to take a picture, use the uEye software on the Lynx PC.
#: Note that the microscope shares the screen with the bonder. You can switch between computers by pressing <code>Scroll Lock, Scroll Lock, Enter</code> on the keyboard.
# When you are done:
#* Close the uEye software
#* Zoom all the way out
#* Turn the light intensity down
#* Turn off the power supply
#* If you used a red plastic box, move it out of the way
== Troubleshooting ==
;I can't get a responsive image in the software!
:First close the uEye software. Make sure the Lynx EVO power supply is on. Then open the uEye software and press the "Play" button.
;Where's the PC screen? I want to save an image!
:The monitor is shared between the microscope and the bonder. Press <code>Scroll Lock, Scroll Lock, Enter</code> on the keyboard.
== Remote access ==
* TeamViewer: LYNX-PC

[[Category:Characterization]]

Lynx EVO stereomicroscope

2022-05-03T11:04:17Z

Karolis: /* Remote access */

Olympus microscopes

2022-05-03T11:01:01Z

Karolis: /* Remote access */

{{Infobox tool
|image = Tool Olympus BX51M.jpg
|toolfullname = Olympus BX51M Olympus BX53M
|website = http://www.olympus-ims.com/en/
|company = Olympus IMS
|description = Optical microscope
|location = Cleanroom 1 (03.2.209A) Cleanroom 2 (03.2.203B)
|primary = Nader
|secondary = Karolis
}}
There are Olympus BX metrology microscopes both in CR1 (BX51M) and CR2 (BX53M).
They have feature parity and are equipped with 4K cameras and motorized Märzhäuser Wetzlar Tango stages.
Objectives are 5x, 10x, 20x, 50x, 100x.
Ultimate optical resolution (Rayleigh limit) of the 100x objective should be ~400 nm (at 550 nm wavelength).

If you want to resolve smaller features, you can use:
* [[JEOL 7800F|JEOL JSM-7800F]] SEM
* [[Raith eLine]] SEM
* [[Philips TEM]]

If you want to resolve topographical features, you can use:
* [[Tencor profilometer]]
* [[Bruker Dimension Icon AFM]]

If you want to observe photoresist, insert the green filter at the back of the microscope body.
Otherwise white light will expose your resist.

== Usage rules ==
No booking is required, but please be flexible with regard to needs of other users.

The microscopes should be left with the light turned off or all the way down using the controls on the microscope body.

Do not leave samples on the stage or elsewhere in the working area, they might get discarded.

Save images you want to keep to Z drive, local files might get discarded.

== How to: take an overview image ==
<gallery>
File:Olympus-define-overview-area.png|''Stage Navigator'' toolbar should be at the top left of the ''Stream Motion'' software, above the overview image.
File:Olympus-stage-navigator-menu.png|To enable ''Stage Navigator'' toolbar: ''View > Tool Windows > Stage Navigator''.
</gallery>

=== Scanning the area ===
# Make sure the ''Stage Navigator'' toolbar is open.
# Click the left-most icon ''Define Overview Area''.
# Follow the instructions on screen:
## Find the top-left of your area, press ''OK''.
## Find the bottom-right of your area, press ''OK''.
# The microscope will now automatically take and tile the images of the entire area defined by the two corners.
It is now possible to navigate the area by clicking on the overview image.

=== Saving the image ===
If you want to save the overview image:
# ''Right click on the overview image on the left > Open Overview Image''
# ''File > Save As... (Ctrl+Shift+S)''
# Select a filetype that suits your needs:
#* Lossy (recommended for overview images):
#** Recommended 85% quality JPEG (JFIF).
#** High quality compression is imperceptible by human eye.
#** Filesize can be some tens of megabytes.
#** JPEG2000 provides 5-10x smaller filesizes but is not a universally compatible image format.
#* Lossless:
#** Recommended PNG or uncompressed TIFF.
#** The filesize can easily be several hundred megabytes.
#** LZW TIFF compression can reduce the size in half, but the microscope PC struggles with it.
#** JPEG2000 provides lossless compression, but is not a universally compatible image format.
# Save directly into Z drive.

== Troubleshooting ==
; The corners of the image are dark (vignetting)!
: There is a mechanical spring that holds the microscope components together. It needs to be tightened by service. Please notify CR staff.
: For a temporary fix make a flatfield correction: ''Acquire > Devices > Device Settings > camera (UC90) > Shading Correction > Flatfield''
; Everything is green!
: There is a green filter at the back of the microscope body. It is used to observe photoresist without exposing it.
; The image is completely black!
: Switch from eyepiece mode to camera mode (or vice versa) using a rod at the top of the microscope body.
; The overview image is all jumbled up!
: The axes of the motorized stage got inverted by the software gremlins. You can try to fix this or simply ask the CR staff.
: Try: reverse X/Y axes in ''Acquire > Device Settings > Marzhauser Tango''
; The image is completely frozen!
: Turn on live imaging with the big button on the right side of the ''Stream Motion'' software.
; I can see a projection of the cleanroom lab in the image!
: Turn down the exposure/gain in the software and increase the light using the knob on the microscope body.
; The hand controller is not moving the stage!
: Verify that the install Märzhäuser Tango control software is installed.
== Remote access ==
* TeamViewer: SCOPE1, SCOPE2
* LogMeIn: Scope 1 (CR1) [OSIS-CR1Olympus], SCOPE2 (CR2)
[[Category:Tools]]
[[Category:Characterization]]

Alpha-SE ellipsometer

2022-05-03T10:59:38Z

Karolis: /* Remote access */

{{Infobox tool
|image = Tools alpha-SE ellipsometer.jpg
|toolfullname = J.A. Woollam alpha-SE Ellipsometer
|website = https://www.jawoollam.com/products/alpha-se-ellipsometer
|company = J.A. Woollam
|description = Ellipsometer
|location = 2nd floor lab (03.2.213)
|primary = Karolis
}}
The Woollam alpha-SE ellipsometer is a characterization tool for transparent thin film thickness and roughness measurements by evaluating change in reflected/transmitted light polarization.
Getting an accurate result relies on your substrate knowledge.
Therefore, it is best to measure your samples before and after film deposition using the same model.

Most users at NBI use it to measure:
* [[Resists|resist]]
* films deposited by [[Cambridge ALD|ALD]]
* in some cases, films deposited by [[AJA systems|PVD]]
* oxide on semiconductor chips

Other alternatives to measure film thickness at the [[Main Page|NBI cleanroom]] facilities:
* [[Bruker Dimension Icon AFM]]
* [[Tencor profilometer]]
* [[Filmetrics reflectometer]]
* in some cases, [[JEOL 7800F]] SEM
== Quick-start guide ==
Video on how to operate the alpha-SE Ellipsometer:

[[File:Ellipsometer.mp4|500px]]

[https://youtu.be/8NP7sFV3vzo Click here to watch the video on YouTube]
# Prepare for measurement:
#* Turn on using the green button on the top left of the tool.
#* Turn on the small orange pump behind the ellipsometer.
#* Place your sample on the slit in the middle of the instrument. Make sure the two small holes are covered.
#* Flip the ''Sample Vacuum'' switch on the front right of the tool.
# On the PC, open the ''Complete EASE'' software:
#* Mode: Standard
#* Angles: 65°, 70°, 75°
#* Model: choose from list
#* Save Data after Measurement: user choice
#* <code>Measure</code>
# Perform the measurement by following the prompts in the software:
#* Pull out the spring lock and move the laser arm to the requested angle. Make sure the spring locks into the slot.
#* Repeat for the other side.
#* <code>OK</code>
#* Wait until the first part of the measurement finishes.
#* Repeat for all requested angles.
# Read out film thickness value, uncertainty, mean squared error (MSE).
# Finish up:
#* Switch off vacuum
#* Unload sample
#* Turn off pump
#* Turn off tool
# Done!
== Remote access ==
* TeamViewer: uManipulator
* LogMeIn: uMANIPULATOR (K03A)
[[Category:Tools]]
[[Category:Characterization]]

Cambridge ALD

2022-05-03T10:58:46Z

Karolis: /* Remote access */

{{Infobox tool
|image = Tool ALD.jpg
|toolfullname = Savannah S100 (gen. 1)
|website = http://www.cambridgenanotechald.com/products/Savannah-ald-system.shtml
|company = Cambridge NanoTech (Veeco)
|description = Atomic layer deposition system
|location = Cleanroom 1 (03.2.209A) Cleanroom 2 (03.2.203B)
|primary = Martin
|secondary = Karolis
}}

Two nearly identical Savannah S100-like systems are used for atomic layer deposition of aluminum oxide and hafnium oxide.

Other material deposition alternatives at the [[Main Page|NBI cleanroom]]:
* [[AJA systems]] for sputtering/e-gun evaporation
* [[E-Gun evaporator]]
* [[Edwards evaporator|Edwards thermal evaporator]]
* [[Leica sputter coater]]
* [[MBE|Molecular beam epitaxy system]]

== Growth per cycle (GPC) monitoring ==

<gallery mode="traditional">
Image:ALD1.png|ALD1 HfOx
Image:ALD2.png|ALD2 HfOx
</gallery>

== Available processes ==

{| class="wikitable"
|-
! Deposited material !! Precursor !! ALD1 !! ALD2 !! Ref.
|-
| Hafnium oxide (HfOx, HfO2)|| <div class="toccolours mw-collapsible mw-collapsed width:400px" style="width:300px"> TDMAH <div class="mw-collapsible-content">tetrakis(dimethylamino)hafnium [(CH3)2N]4Hf [[File:TDMAH.png|246px]]</div></div> || style="background-color: #c6e0b4" | Yes || style="background-color: #c6e0b4" | Yes || [https://doi.org/10.1016/j.tsf.2005.05.050]
|-
| Aluminum oxide (AlOx, Al2O3) || <div class="toccolours mw-collapsible mw-collapsed" style="width:300px> TMA <div class="mw-collapsible-content">trimethylaluminum (CH3)3Al [[File:TMA.png|290px]]</div></div> || style="background-color: #c6e0b4" | Yes || style="background-color: #c6e0b4" | Yes || [https://doi.org/10.1134/1.1626763]
|}

== Standard operating procedure ==
Video on how to operate ALD 1:

[[File:ALD1.mp4|500px]]

* [https://youtu.be/Do91YRRgI34 Click here to watch the video on YouTube]

Video on how to operate ALD 2:

[[File:ALD2.mp4|500px]]

* [https://www.youtube.com/watch?v=GmNEbyMNC4A Click here to watch the video on YouTube]

* Open valve on top of the nitrogen bottle.
* Check nitrogen bottle pressure. Main bottle pressure should be at least 5 bar, line pressure 3 bar (AJA1) 1-2 bar (AJA2).
*: If line pressure is outside of range, carefully adjust the regulator valve with the flow set to 20 sccm.
* Make sure the valves of '''all''' precursors inside the ALD machine are closed.
* Run recipe ''Default_cleaning'' to pump out any residual gas in the gas lines.
*: With flow set to 0 the actual flow can be between 0-1 sccm.
* Press the ''VENT'' or ''VENT REACTOR'' button.
* Open the metal lid.
* Put your sample inside, roughly in the center, away from the gas inlet and outlet.
*: Check whether the rubber O-ring is properly seated.
* Close the metal lid. Check that the lid is aligned to sit directly on top of the reactor chamber.
* Press the big round ''PUMP'' or ''PUMP REACTOR'' button.
*: Pressure with flow set to 0: ~5e-2 Torr or lower.
* Place the metal cage on top of the tool.
* Open relevant precursor valves.
* Run your recipe.
*: Pressure with 20 sccm N2 flow present: low e-1 Torr.
*: ALD1 pulse lengths: H2O ~0.5 s, HfOx TDMAH 0.2 s, AlOx TMA 0.02 s.
*: ALD2 pulse lengths: H2O ~0.02 s, HfOx TDMAH 0.2-0.5 s.
* Close precursor valves.
* Press the big round ''VENT'' or ''VENT REACTOR'' button.
* Place the metal cage on the side of the tool.
* Take out your sample. Check the rubber o-ring.
* Press the big round ''PUMP'' or ''PUMP REACTOR'' button.
* Close the nitrogen bottle valve on top of the bottle.
* Run recipe ''Default_heater_set''.

== Technical notes ==

* Recipe file location
*: ''ALD1'': ''C:\Savannah\Users\Standard\''
*: ''ALD2'': ''C:\Cambridge Nanotech\Recipes\''
* Log file location
*: ''ALD1'': ''C:\ALD data''. Includes pressure data, screenshot at termination.
*: ''ALD2'': ''C:\Cambridge Nanotech\Log\''. Includes pressure and heater temperature data, screenshot at termination, software event logs.

== Troubleshooting ==

; Pressure reading obviously wrong (above 1e3 Torr or below 1e-4 Torr):
: Pressure gauge failure. Unplug the network cable from the small square pressure gauge beneath the chamber and plug it back in. The pressure reading should return to expected values.
; No peak visible during precursor pulse:
:* Precursor valves closed. Make sure the relevant precursor valves are open. Consult the labels on the inside of the door.
:* Pulse time too short. Select the lowest plotting interval and check whether you can spot a small peak when the automatic valve opens. Increase pulse time as needed.
; Cannot open lid upon venting:
:* Chamber pressure still below atmosphere. Confirm pressure reading in software. If pressure is below 5e2 Torr, check whether the nitrogen bottle valve is open.
:* Rubber O-ring can get stuck to the lid. Gently but firmly lift the lid. Reseat the O-ring if needed.
== Remote access ==
* TeamViewer: ALD1, ALD2
* LogMeIn: ALD1 (CR1), ALD2 (CR2)
[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2022-05-03T09:39:36Z

Karolis: /* Remote access */

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Karolis
|secondary = Martin
}}
<del>For the tools' maintenance log, click [[AJA Systems maintenance log|here]].</del>

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two DC sputtering targets, <del>heater in sample mount</del> and Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular DC sputtering target, one DC sputtering target with adjustable working distance, one RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling. Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.
Oxidation chamber on the loadlock.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2022 March 11):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Si
| FabMate
|-
| 2
| Cr
| intermetallic
|-
| 3
| Au2 (40 g)
| W
|-
| 4
| Au1 (80 g)
| W
|-
| 5
| Al1
| intermetallic
|-
| 6
| Ti
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| W
|-
| 2
| V
| FabMate
|-
| 3
| Ti
| FabMate
|-
| 4
| Al
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr after pumping for 24 hours on main chamber, respectively.

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* <del>Examine the sample holder. There are three small pins. These pins, via a similar mechanism lock onto the stage inside the main chamber.</del>
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample. <del>The mechanism which locks the sample holder on to the stage in the main chamber, also simultaneously unlocks it from the loading arm.</del>
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the RF2 (sputtering target) stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.148 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for RF milling?
:* RF cable not connected tightly
:*: Abort process, turn off RF milling power supply, reconnect cable
:* Someone touched the matching network.
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo gate valve. Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool)
# Open nitrogen vent valve on the back left of the cryo
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close backing pump to cryo (screw valve under the loadlock turbo)
#* Might need to crack open the valve a bit. Setting turbo controller <code>012: EnableVent: off</code> doesn't help.
# Open backing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo gate valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].
== Remote access ==
* TeamViewer: FILM
* LogMeIn: FILM AJA
[[Category:Tools]]
[[Category:Deposition]]

Heidelberg µPG 501

2022-05-03T09:39:00Z

Karolis: /* Remote access */

{{Infobox tool
|image = Tool Heidelberg.jpg
|toolfullname = Heidelberg µPG 501
|website = http://www.himt.de
|company = Heidelberg Instruments
|description = Table-top maskless aligner
|location = Cleanroom 2
|primary = Nader
|secondary = Martin
|manual = Digital copies on instrument PC desktop
}}

The Heidelberg μPG 501 is a tabletop maskless (i.e. direct-write) ultra-violet photolithography system.
It utilizes a 10 W light emitting diode operating at 390 nm, a 600×800 pixel [https://en.wikipedia.org/wiki/Digital_micromirror_device digital micromirror device], and motorized stage to expose patterns on resist-coated substrates.
The system has a writing speed of 50 mm2/min for the resist [[AZ 1505]] on silicon with a resolution limit of 1 µm, and is therefore well suited for rapid prototyping, as well as for writing large structures that are otherwise too time consuming for [[Lithography glossary|EBL]].
The Heidelberg is compatible with [https://en.wikipedia.org/wiki/AutoCAD_DXF DXF], [https://en.wikipedia.org/wiki/GDSII GDSII], and [https://en.wikipedia.org/wiki/Caltech_Intermediate_Form CIF] [[Lithography glossary|CAD]] files.
The main instrument PC is offline, but it's connected on an online design PC.
The two share a screen, mouse, and keyboard, but you can switch between the two PCs by pressing <code>ctrl, ctrl, enter</code>.

== Specifications ==

* LED emission wavelength: 390 nm
* LED power: 10 W
* Exposure range: 4 ms to 90 s
* Maximum substrate size: 6 × 6 inches2 (152.5 × 152.5 mm2)
* Minimum substrate size: 6 × 6 mm2
* Maximum writing area: 125 × 125 mm2
* Substrate thickness: 0 to 6 mm
* Substrates with thickness variations of below ± 20 µm are recommended

== Operating instructions ==
Video on how to operate the Heidelberg μPG 501:

[[File:UPG501.mp4|500px]]

[https://www.youtube.com/watch?v=v4h6W5l18i0 Click here to watch the video on YouTube]
=== Measure the diode intensity ===
# Make sure the stage is empty.
# From the 'µPG 501 menu', select 'Tools', and then 'Intens. diode'.
# Follow the on-screen instructions. The intensity of the diode will be measured at 40°C. '''Enter the measured value into the logbook on the design PC.'''

=== Load your chip ===
# Press 'Load substrate' in the software menu. The stage will be moved into the loading position, and a software dialog box will open.
# Open the dust cover.
# Place your chip or substrate on the center of the stage, over the four small vacuum holes. Please note the orientation of the coordinate system; the ''x'' direction points outwards from the front of the instrument.
# Enable the vacuum, by toggling the vacuum switch. Make sure your sample is firmly fixed in place. For larger substrates (e.g. 2 inch wafers or larger), you may need to enable suction on additional vacuum regions. Talk to a [[About|cleanroom staff]] member if that is the case.
# Close the dust cover.
# Press OK in the software dialog box. The stage will be moved to it's home position, and another dialog box will open.
# Make sure that the substrate is below the writehead (metallic disc with red light emanating from the center). Not doing so may cause the writehead to be driven into the sample during the next step, potentially severely damaging the system.
# Press 'yes' in the dialog box for pneumatic focusing (recommended, but requires a distance of approx. 3 mm to the edge of the sample), or 'no' for optical focusing (use for small samples, or when writing close the sample edges).

=== Design conversion ===

# Copy your design file to the design PC.
# On the instrument PC, copy to the design file to the correct path depending on the design format (e.g. C:\HIMT\designs\dxf, etc).
# Select 'Start Conversion Interface' in the 'µPG 501 menu'
# Create a new job file, by selecting 'File' and 'New' in the conversion interface. Use job file name along the lines of NAME_DATE.
# Work through the conversion interface. If you plan on performing an alignment exposure, remember to uncheck 'Automatic Centering', and press the 'Reset' button.
# Finish converting your design by clicking 'Complete Tasks' and then 'Complete Expose Jobs'.

=== Exposure ===
# Click 'Select Design' in the 'µPG 501 menu', and select your converted file (e.g. C:\HIMT\LICSource\<<Your job name>>\expose.cfg).
# In the right panel of the 'µPG 501 menu', under 'Exposure mode', select the type of exposure you want.
## 'Standard Exposure': For blank chips
## 'Alignment': For aligning exposures to e.g. chip edges, crosses, etc.
## 'Target Mode': Allows users to draw squares to be exposed.
# Press 'Next'
# Set your exposure time and defocus (e.g. obtained from a dose test). For an alignment exposure, locate the features (e.g. crosses) that you wish to align to, and enter their corresponding design coordinates.
# Start the exposure. A progress bar will be shown along with the time remaining.
# Fill out the log book.

== Preparing a dose test ==
The 'µPG 501 menu' software makes it easy to perform a dose test for a given combination of e.g. resist, substrate, developer, bake-out time and temperature. Two parameters can be varied; the exposure time and the defocusing. If you vary both of them, you'll end up with a two-dimensional grid pattern, where the exposure time increases from top to bottom, and the defocusing increases from left to right. Depending on your design pattern, consider inserting a dummy structure to help you identify the orientation of your dose test later on.
# Start by selecting the design pattern (press 'Select Design' in the menu).
# Then select 'Control Panel' from the 'Tool' menu. This brings up a separate window with the title 'Panel'.
# Select the 'Series' tab.
# Enter your desired dose test parameters, and the step size of the dose test grid. The step size must be larger than your pattern dimensions.
# Press 'Start Exposure Series'.
# After developing your dose test, find the best combination of exposure time and defocusing for your particular design pattern.

== Improving the overlay accuracy ==

The Heidelberg's stage is not calibrated to an absolute length (e.g. NIST) scale. As a result, when performing overlay exposures over patterns written with other instruments, such as the Elionix, the design pattern must be scaled in both the ''x'' and ''y'' dimensions for the length scales to match. This can be easily done in the conversion interface. For some use cases, this will yield an acceptable overlay accuracy, but for more demanding scenarios, further corrections must be made.

The stage's ''x'' and ''y'' axes are not perfectly orthogonal to each other, but rather the angle between the two is approx. 89.996°. This leads to a skewing of the written pattern, and the larger its size, the greater the overlay error becomes. This problem can be circumvented by 'pre-distorting' the design file, so that when written, it will yield the intended design. This can be done using the following steps:

# Open your design in CleWin.
# Make sure the full design is in a single hierarchical cell (i.e. is flat). If not, flatten it.
# Save it as a DXF file.
# Open the program 'Coordinate Adjustment' on the desktop of the design PC.
# Open your newly created DXF file.
# Select a name for the converted file.
# Start the conversion. The pattern will be 'pre-distorted' using the measured parameters shown below. These need to be periodically measured.
# Perform an overlay exposure as per usual, using the pre-distorted file. However, the coordinates of your reference structures (e.g. crosses) should be the ones from your original design file.

== Troubleshooting ==
; Alignment doesn't work?
: Perhaps the configuration file randomly disappeared. Follow the guide on the desktop in order to restore it.
== Remote access ==
* TeamViewer: uPG_501
* LogMeIn: HEIDELBERG TRANSFER (CR2)
[[Category:Tools]]
[[Category:Lithography]]

JEOL 7800F

2022-05-03T09:37:38Z

Karolis: /* Remote access */

{{Infobox tool
|image = Tools JEOL 7800F.jpg
|toolfullname = JEOL JSM-7800F
|website = http://www.jeol.de
|company = JEOL, Ltd.
|description = Scanning electron microscope
|location = 03.1.K08
|primary = Nader
|manual = A printed version is in a blue binder by the instrument
}}

The JEOL 7800F is a 30 kV field emission scanning electron microscope (SEM).
It is equipped with two [https://en.wikipedia.org/wiki/Everhart-Thornley_detector secondary electron detectors] a backscatter detector, and a EDS detector.
It has a eucentric stage, a range of different sample holders depending on application requirements, and can accommodate samples of up to 50 mm in diameter.
A unique feature of this SEM, is its ability to place a negative bias on the sample stage in order to decelerate incoming electrons as well as to eject secondary electrons, thereby increasing the signal-to-noise ratio.
This feature is known as gentle beam (GB), and is particularly useful when working at low acceleration voltages.

[[Raith eLine]] is an alternative to this tool.
It does not have beam deceleration capability, but supports scripting such as unattended imaging.
Repetitive imaging at predetermined locations should be carried out on that tool instead.

== Overview ==

The different components of the SEM are illustrated in the two figures below:

[[File:JEOL 7800F Overview 1.png|left|thumb|Left side of the JEOL 7800F]]
[[File:JEOL 7800F Overview 2.png|left|thumb|Right side of the JEOL 7800F]]
[[File:JEOL 7800F consoles.png|left|thumb|Stage and beam control consoles]]

* The lower electron detector (LED) is a [https://en.wikipedia.org/wiki/Secondary_electrons secondary electron] detector, located in the chamber, and is mostly used for overview images, or in conjunction with sample tilting or high acceleration voltages.
* The upper electron detector (UED) is an in-lens secondary electron detector located in the electron beam column. It is typically used for obtaining ultrahigh resolution iamges at low acceleration voltages. It is usually used in conjunction with the gentle beam (GB).
* The backscatter detector (BSD) measures the high energy electrons from the incident beam that are backscattered by the sample surface. Particularly useful for samples composed of different materials of contrasting densities. The detector is inserted by a pneumatic valve when needed by the user, but is otherwise retracted.
* The EDS detector measures the x-ray wavelengths of photons generated in the sample when exposed to the electron beam. Using the measured x-ray spectrum, the sample material composition may be determined.
* The chamber camera is colour sensitive, and primarily used to see the sample and sample holder in relation to the pole-piece. It can only be switched on if the gun-valve is closed, and the gun-valve cannot be opened while the camera is on.
* The loadlock camera automatically takes a picture of the sample surface when the loadlock is evacuated. However, if the user is not logged in, the image will not be taken, and there is no way to take it without venting and re-evacuating the loadlock. The overview picture can be used for rough navigation of the sample.
* There is a magnetic field sensor suspended adjacent the electron beam column, and is connected to a magnetic field cancellation unit in the corner of the room. If you notice interference, or feel that you are not reaching the image resolution you feel you should, check the field cancellation unit to see if it has been tripped. This happens once in a while due to vibration from foot traffic outside, etc, and the field cancellation may be restored by pressing the reset button on the unit.
* The SEM has a N2 dewar for cooling the sample stage.

== Loading sample ==

# '''Select the appropriate sample holder:''' There are several different sample holders available for the SEM, each adapted for a particular sample size or function, such as a full 2 inch wafer holder, cross-sectional sample holder etc. Generally, you should use the smallest sample holder that will accommodate your sample. This will give you the greatest range of tilt. The PC-SEM software knows about the geometry of the different sample holders, and will automatically set the safe tilt angles for you, and prevent you from accidentally running the sample holder into the pole-piece.
# '''Attach the sample:''' The 2 inch wafer holder allows for the attachment of samples to the holder via clips, and the cross-sectional sample holders alow the samples to be either clamped in place or mounted with a screw. For the remaining sample holders, and adhesive must be used, e.g. carbon tape, graphite paste, or silver conducting paste. Most users use the carbon tape. It is easy to use, and to remove, but due to the elastic nature of the tape, some drift may occur at high magnification. If this is a problem, or you have fragile samples that may break when removed from the adhesive tape, you can try the graphite paste. It has lower adhesion, but also more electrically resistive. There are two pastes available, one suspended in water solution, and the other in isopropanol. Apply only a small dot to the sample holder surface and place your sample over it, press down gently on the sample and then leave it to try for about 5 minutes. Test whether the sample is well attached to the sample holder before loading. Note: Do not use for full wafers.
# '''Set the sample height:''' [[File:Sample holder.png|right|thumb|The 12.5 mm sample holder as seen from the side and from below.]] The sample must be attached to the sample holder such that its surface protrudes slightly from the edge of the sample holder when viewed from the side. The height of this protrusion is known as the sample surface offset. If the sample surface is below the edge of the sample holder, it must be adjusted. In the case of the 12.5 mm sample holder (see figure), this is done by loosening the two retaining screws on the side of the holer, and then screwing the large screw on the underside of the holder. This adjusts the height of the central stub to which the sample is attached.
# '''Load the sample holder:''' Hold the VENT button for two seconds, or until you hear a valve close and the hissing sound of N2 entering the loadlock, and then release clip on the side of the loadlock. This avoids an overpressure from forming within the loadlock which could dislodge the loadlock o-ring. Once the hissing stops, open the loadlock and push the sample holder into the mounting brace. Make sure it sits snugly against the flat edge, and verify that it isn't tilted. Close the loadlock, close the brace, and then press the EVAC. The system will start rough-pumping the loadlock. Pressing EVAC will also trigger the loadlock camera to take a picture of the sample surface, which can be used for navigation later on.
# ''' Insert the sample holder into the chamber:''' Once the pressure in the loadlock reaches 1.6 Pa, the SEM will automatically move the rough pumping to the back of the turbopump, and open the gate valve. This process emits three hisses, after which you can move the sample holder into the chamber using the loading rod, in accordance with the following procedure.

{| width="80%" align="center"
|-
| [[File:JEOL 7800F loading 1.png | 275px]]
|
* Lower the loading rod to the horizontal position by pivoting it downwards by 90°. Once horizontal, it will be pulled in part-ways by a spring.
* Lightly lift the rod a few degrees while applying a very gentle force along it, in order for it to reach the loading position (you should hear a metallic snap).
|-
| [[File:JEOL 7800F loading 2.png | 275px]]
|
* Push the rod directly into the chamber. Do not apply a up/down force, nor twist the rod.
|-
| [[File:JEOL 7800F loading 3.png | 275px]]
|
* You should feel the vacuum help bring in the rod
|-
| [[File:JEOL 7800F loading 4.png | 275px]]
|
* Once the rod is almost fully inserted, you will feel an increased resistance. This is due to the two braces (FIXME) meeting, and is normal. Push a little harder, until you overcome the resistance.
* When the rod is fully inserted, a dialog box will pop up in PC-SEM, asking which sample holder was inserted. ''It is absolutely imperative that you select the correct one from the menu. Not doing so may lead to catastrophic damage to the instrument.''
* Leave the sample surface offset at 0 mm for now.
|-
| [[File:JEOL 7800F loading 5.png | 275px]]
|
* Pull the rod all the way out, until you see the gray plastic stopper pop up, which prevents the rod from being pulled back in. You should hear a clicking noise.
|-
| [[File:JEOL 7800F loading 6.png | 275px]]
|
* Pivot the rod back into the vertical standby position.
|}

== Measuring sample surface offset ==

The SEM uses the sample surface offset value along with the geometry of the sample holder used, to set the allowed ranges for tilt, vertical position, etc. If not set correctly, you will risk running the sample holder into the pole-piece, from which the focused electron beam emerges. A secondary purpose of setting the offset, is that when the focus is linked to the z-coordinate, changing the working distance will automatically set the correct value of z, giving you a good starting focus.

Let's start by defining a few concepts:

[[File:JEOL7800F offset.png|right|200px]]
* The distance form the edge of the pole-piece to the point at which the electron beam is focused is known as the working distance (WD).
* The ''z'' coordinate is the distance from the edge of the pole-piece to the edge of the sample holder
* The sample surface offset (''o'') is the the distance

Thus, it is clear that for the electron beam to be in focus at the sample surface, the condition WD + ''o'' = ''z'' must be true.

To measure the offset, do as follows:
# Make sure the ZFC button is enabled
# Move the sample holder closer to the pole-piece, but keep a safe distance from it; set WD to e.g. 10 or 15 mm, by clicking on WD in the micrograph datazone. The z will be adjusted automatically.
# Set the acceleration voltage to a reasonable value (say 10 kV).
# Once the stage has stopped moving, find something on the surface of your sample to focus on, and zoom in on it
# Now, slowly rotate the ring around the track-ball until you get a reasonably good focus.
# Increase magnification if appropriate, and refine the focus.
# Once you’re happy, the difference between the z and WD gives the offset: ''o'' = ''z'' - WD
# Click on the image of the sample holder in the lower-right quadrant of PC-SEM, and enter the offset value into the field at the bottom of the dialog.

Please note: The offset should always be measured with respect to the highest point on the sample or sample holder. For example, if you are using a sample holder with retraining pins that are held in place with a screw, the head of the screw is now the highest point and should be used to measure the offset.

== Navigating to your region of interest ==
Move to your region of interest. You have several options for stage navigation:
* Dragging and dropping with the mouse in the image area
* Right-clicking on objects in the image area or stage navigation image
* The trackball
* The x/y buttons on the stage console

If you have difficulties locating your structure, you can enable the LDF mode. It will give you a larger field of view and a larger depth of focus, at the expense of imaging resolution. Please note, the LDF mode works by switching off one of the focusing lenses, so if you have LDF mode on for extended periods, you may experience drift after it is turned off. This is due to the lens heating back as current passes through its focusing coils.

== Imaging ==

=== Choice of acceleration voltage, working distance, detector, etc. ===

The choice of acceleration voltage depends on what you want to observe. That being said, the higher the acceleration voltage, the deeper into your sample the electron beam will penetrate, which can be useful e.g. for imaging through oxide layers, etc. On the other hand, if you want to perform surface imaging, you will typically want a low acceleration voltage. As a very general rule of thumb (with lots of exceptions), the working distance should match the acceleration voltage; the faster the electrons are travelling, the more difficult it is to focus them to a point over short distances away from the pole-piece.

The choice of detector depends on your working distance, tilt, etc:

* If you are using a high acceleration voltage, and thus a high working distance, or need to tilt your sample, use the LED. It is great for getting a quick image with minimal hassle, for overview images, etc.
* If you are using a low acceleration voltage, and a low working distance, use the UED; the lower the working distance, the more the pole-piece will shadow the LED, reducing the signal strength. The UED in invariably used in GB mode, which enhances the signal strength by accelerating secondary electrons away from the sample and towards the detector. The maximum GB bias is 2 kV. Note: when using the UED, there is no benefit in going closer than 3 mm; the sample holder will start interacting with the EM field from the pole-piece.
* Especially useful when you have samples composed of materials of contrasting atomic mass. It is typically used in conjunction with a working distance between 4 and 10 mm. Note: When using the BSD, you need a relatively slow scan speed with no frame averaging. More on that later.
* You can combine the signals from multiple detectors by selecting ADD in the detector drop down menu. For instance, you can combine the image from the BSD illustrating the material contrast of the sample, with a surface image from either the LED or UED.

=== Beam conditioning ===

Before you can image your structure, you will need to condition the electron beam. This involves

* focusing
* aligning the aperture (wobble)
* stigmating

You can focus using either
* the focus knob on the beam control console, or
* clicking-and-holding on the focus button above the imaging area (see below), then dragging the mouse.
:: [[File:JEOL 7800F mouse focus.png|672px]]

If the imaged moved while focusing, you'll need to align the aperture. Press the wobble button; this will move the focus up and down, and cause the image to shift back and forth. Adjust the ''x'' and ''y'' knobs to minimize the wobbling – here ''x'' affects the x-movement, etc (in contrast to other systems). Once you’re satisfied, hit the wobble button again to disable it.

Fine-tune the focus. If you notice that adjusting the focus causes the image to be stretched in one direction, and then another, it is astigmated. This distortion is a result of a non-circular beam cross-section at the sample surface, and will need to be corrected using the x and y stigmators. Using mouse-focusing: move the focus back and forth from one extreme (heavily astigmated in one direction) to another ((a) and (b) in the figure below), and find the central point where the image seems equally defocused in all directions (c). Once at this point, adjust the ''x'' or ''y'' stigmator until the focus is optimized, and then repeat the procedure for the other. This should result in an improved image (d). Fine-tune the focus again, and repeat the procedure if necessary.

[[File:JEOL 7800F stigmation.png|center|850px|Steps for improving an astigmated image.]]

=== Scan speeds and the photo button ===

In the top-left of the beam-control console, you’ll find two buttons (quick, fine), that toggle the scan speed of the beam. Alternately, you can use the two buttons in the software menu. There are four speed settings available (quick1, quick2, fine1, fine2), the exact speed of which depends on your particular user settings. To change them, open the “Operation settings” dialog in the “Settings” menu (shown below).

[[File:JEOL 7800F operation settings.png|center|650px|Operation settings dialog box.]]

Here, the quick1 and quick2 are set to fast scan speeds, with 16 frame averages. The lower the scan speed number, the shorter the beam dwell-time at each pixel. The scan speed number follows a logarithmic scale, as shown below.

[[File:JEOL 7800F scan speed chart.png|center|450px|Pixel dwell time v.s. scan speed number.]]

The "Operation settings" dialog box also dictates what happens when you hit the "Freeze" button. It can either integrate for a certain number of frames depending on whether the scan speed is "Quick" or "Fine", or it can simply freeze the frame after scanning it. In the latter case, the beam will be deflected away from the sample, so carbon will not build up on the surface while the frame is frozen. For imaging at greater resolutions than the default addressing grid of 1280 x 960 pixels, the photo button must be used, and the desired resolution chosen in the "Operation settings" dialog. Alternatively, if you're fine with the default resolution, you can freeze the frame, and then press the photo button to save the image. The software will give an estimated time required to take an image, but in general, you should use the fastest scan speed which gives you an acceptable level of noise in your image, in order to avoid distortion of your image due to drift, as well as carbon contamination, etc.

=== Contrast and brightness ===

In addition to manually adjusting the contrast and brightness knobs on the beam-control console, the system also has a automatic contrast and brightness button (ACB). It generally does a reasonable job of correctly setting the contrast and brightness, but if the image is completely underexposed (black) or overexposed (white), or completely out of focus, it might fail.

[[File:JEOL 7800F histogram.png|right|350px]] Clicking the button with the triangle symbol above the LUT button will bring up a histogram of the pixel values of the current frame (shown). You can use this histogram to correctly expose your image: the brightness controls the position of the signal, the contrast controls the width of the signal, and you should aim to use the entire dynamic range of the detector, i.e. the signal should be as wide as possible while still fitting in the histogram range.

== Unloading ==

When you're done with the SEM, turn off the beam, and retract the BSD if applicable, and then press the "Spec. Exchange" button. It will move the stage to the loading/unloading position (X,Y,R,T = 0, Z = 40 mm). Once it's done, the button will become green [[File:JEOL 7800F specimen exchange.png]] and it is safe to transfer the sample holder from the chamber to the loadlock using the loading rod as described above. Once in the loadlock, you can vent the loadlock to retrieve your sample. '''Leave the loadlock pumped down'''. Fill in the log-book, and transfer your files from the SEM PC to e.g. the ZDrive.

== Tips and tricks ==

=== Stepping and sample alignment ===

Under the "Step Control" tab in the upper right corner of PC-SEM, you can find tools for stepping predefined distances in the X, Y directions, as well as rotation. The stepping can be defined as either a physical distance, or a percentage of the frame width. Furthermore, you can align the sample to a given axis clicking on either the horizontal or vertical ruler tools, and drawing a line along the preferred horizontal/vertical axis on the imaging area. This will rotate the stage to match your input. Furthermore, under "Step control" you can save a stage position by clicking the "Addition" button. If you later want to return to this position, you can select the position from the list, and then click on "Move".

=== Restoring stage and beam conditions from previously taken image ===

In the "Image File" tab in the lower-left corner of PC-SEM, there is a dialog box which allows you to restore beam, stage, and detector conditions, acceleration voltage, magnification etc. from a previously taken image. Press browse to select the directory in which your images (as well as the sidecar .txt files). Once the images have been loaded, right click on an given image to restore the conditions it was taken under.

=== Dynamic focus ===

When imaging samples at a high tilt, you may find that the depth of focus is not sufficient. You can compensate for this by checking the "Dynamic Focus" box in the lower middle of PC-SEM, and using the tool in the drop-menu below to set the focus in two regions of your sample surface. When scanning, the SEM will use interpolation to attempt to keep the beam focused along the sample surface.

=== Refocusing after inserting the BSD ===

At some point, you will run into a situation where you want to view your sample using the BSD, but inserting it causes your focus and beam conditions to become degraded. This is due to the fact that the BSD sits very snugly against the pole-piece, and disrupts the balance between the electrostatic and magnetic focusing. In order to restore your focus, use the "Focus Correct" slider at the bottom of the software to restore the balance between the two focusing mechanisms. Note that there is a slight hysteresis in the slider, and that the optimal focus may lie somewhere between two steps.

=== Probe current ===

The probe current can be set using the spin box below the imaging area. The lower the probe current, the smaller the spot-size of the electron beam, and thus, the smaller the features you should be able to resolve. However, decreasing the probe current comes at the cost of a reduced signal-to-noise ratio, and thus there exists a trade-off relationship between signal and resolution. You can mitigate this to an extent by decreasing the scan-speed, but then drift may become an issue. In general, use the following to guide your choice of probe current:

# ultra high resolution: 3-5 (usually only with gentle beam on)
# high resolution: 6
# standard: 8
# overview: 10

The probe current number relates logarithmically to the actual current as shown in the following graph:

[[File:JEOL 7800F probe current chart.png|center|450px|Probe current v.s. probe current number.]]

=== Focus ranges ===

There are two focusing regimes in the SEM; At working distances below ~5.5 mm, the beam will be focused with both an electrostatic and magnetic lens system. Above this working distance, the electrostatic lens is switched off. There is thus a discontinuity at this switching point, and is clearly visible as a "jump" in the image, and you should thus avoid positioning your sample surface there.

== Troubleshooting ==
; Photo button doesn't work?
: Restart PC.
; Drifty image?
: Chiller water needs to be topped up. Contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].

== Remote access ==
* TeamViewer: JEOL7800F
* LogMeIn: JEOL7800F_XFER_PC (BASEMENT)

== Resources ==

[[media:Invitation_to_the_SEM_World.pdf|Invitation to the SEM world]]

[[media:JEOL_Guide_to_SMO.pdf|A guide to scanning microscope observation (JEOL)]]

[[media:Hitachi_SEM_user_guide.pdf|Hitachi SEM user guide (2007)]]

[[Category:Tools]]
[[Category:Characterization]]

Raith eLine

2022-05-03T09:36:55Z

Karolis: /* Remote access */

{{Infobox tool
|image = Tool eline.jpg
|toolfullname = Raith eLine
|website = https://www.raith.com/
|company = Raith Nanofabrication
|description = Electron beam lithography and microscopy system
|location = Cleanroom (03.2.209C)
|primary = Shiv
|secondary = Karolis
}}
Raith eLine is a variable acceleration voltage (up to 30 kV) scanning electron microscope/lithography tool.
Nowadays most e-beam lithography needs are covered by [[Elionix 7000]] and [[Elionix F-125]], so this machine is primarily used for imaging.
It is very convenient to set up automated image acquisition using imaging scripts inside of a position list with coordinates.
You can also import your device design (GDS) and use it as a map.
There is an automatic height sensing (AHS) upgrade installed.

Other lithography tools at the [[Main Page|NBI cleanroom]]:
* [[Elionix 7000]], 100 kV EBL
* [[Elionix F-125]], 125 kV EBL at QuanTech
* [[Heidelberg µPG 501]] LED writer
* [[Süss mask aligner]]

Other SEM imaging tools:
* [[JEOL 7800F]]
* [[JEOL 7800F prime]] at QuanTech

== eLine usage and reservation guidelines ==
* To book time on the machine go to the [http://cleanroom.brickhost.com/Web/schedule.php web schedule]. You should make a booking in the system, even if the machine is available and not booked by others.
* Late cancellations of sessions that you’ve signed up should only happen when unforeseen conflicts or unexpected fab difficulties occur. Please do not sign up to use equipment unless you are prepared and have every intention of using the time.
<blockquote style="background-color: #F0F0F0; border: dashed thin grey;">
If you don't have an account write to the cleanroom staff ([mailto:cleanroom@nbi.dk cleanroom@nbi.dk]) and we will provide you with username and password.
</blockquote>
* Use the dedicated SEM (JEOL) for microscopy, unless the e_Line is really needed. Ask for SEM training if needed.
* Between the hours of 9 am and 6 pm on weekdays, you should:
** not reserve more than 3 hours. See (*)
** not book a 2nd slot, before the 1st one is done. See (*)
** delete booking only before the starting time.
** write to the experiment mailing list that the machine is free, if you finish earlier.
(*) Some NW wafer exposures take longer and exceptions to these rules are made to accommodate these tasks. A special account '''NW-MBE''' is used in the booking system to indicate these jobs.
* Please talk to a [[About|staff member]] if you have fab jobs that are not compatible with the rules above

== Troubleshooting ==

; Error regarding failed 5V supply during EM server software startup?
: Normal and harmless.

== Maintenance ==
=== Beam stability test ===
# Gun monitor software: start, change interval to 5-15 s
# SEM software: EHT ON
# WD 10 mm
# View > SEM status, save screenshot of this window
# ELINE software: move to Faraday cup
# 5w
# Start script ''beamstability.js'' (user ''Administrator'' folder ''Scripts'')

=== Closing the CCV ===
Needed when preparing for CDA or power shutdown.

SEM software > open right hand menu > Airlock > Close CCV

== Remote access ==
* TeamViewer: ELINE
* LogMeIn: ELINE

[[Category:Tools]]
[[Category:Lithography]]
[[Category:Characterization]]

Raith eLine

2022-05-03T09:23:54Z

Karolis: /* Maintenance */ added section

{{Infobox tool
|image = Tool eline.jpg
|toolfullname = Raith eLine
|website = https://www.raith.com/
|company = Raith Nanofabrication
|description = Electron beam lithography and microscopy system
|location = Cleanroom (03.2.209C)
|primary = Shiv
|secondary = Karolis
}}
Raith eLine is a variable acceleration voltage (up to 30 kV) scanning electron microscope/lithography tool.
Nowadays most e-beam lithography needs are covered by [[Elionix 7000]] and [[Elionix F-125]], so this machine is primarily used for imaging.
It is very convenient to set up automated image acquisition using imaging scripts inside of a position list with coordinates.
You can also import your device design (GDS) and use it as a map.
There is an automatic height sensing (AHS) upgrade installed.

Other lithography tools at the [[Main Page|NBI cleanroom]]:
* [[Elionix 7000]], 100 kV EBL
* [[Elionix F-125]], 125 kV EBL at QuanTech
* [[Heidelberg µPG 501]] LED writer
* [[Süss mask aligner]]

Other SEM imaging tools:
* [[JEOL 7800F]]
* [[JEOL 7800F prime]] at QuanTech

== eLine usage and reservation guidelines ==
* To book time on the machine go to the [http://cleanroom.brickhost.com/Web/schedule.php web schedule]. You should make a booking in the system, even if the machine is available and not booked by others.
* Late cancellations of sessions that you’ve signed up should only happen when unforeseen conflicts or unexpected fab difficulties occur. Please do not sign up to use equipment unless you are prepared and have every intention of using the time.
<blockquote style="background-color: #F0F0F0; border: dashed thin grey;">
If you don't have an account write to the cleanroom staff ([mailto:cleanroom@nbi.dk cleanroom@nbi.dk]) and we will provide you with username and password.
</blockquote>
* Use the dedicated SEM (JEOL) for microscopy, unless the e_Line is really needed. Ask for SEM training if needed.
* Between the hours of 9 am and 6 pm on weekdays, you should:
** not reserve more than 3 hours. See (*)
** not book a 2nd slot, before the 1st one is done. See (*)
** delete booking only before the starting time.
** write to the experiment mailing list that the machine is free, if you finish earlier.
(*) Some NW wafer exposures take longer and exceptions to these rules are made to accommodate these tasks. A special account '''NW-MBE''' is used in the booking system to indicate these jobs.
* Please talk to a [[About|staff member]] if you have fab jobs that are not compatible with the rules above

== Troubleshooting ==

; Error regarding failed 5V supply during EM server software startup?
: Normal and harmless.

== Maintenance ==
=== Beam stability test ===
# Gun monitor software: start, change interval to 5-15 s
# SEM software: EHT ON
# WD 10 mm
# View > SEM status, save screenshot of this window
# ELINE software: move to Faraday cup
# 5w
# Start script ''beamstability.js'' (user ''Administrator'' folder ''Scripts'')

=== Closing the CCV ===
Needed when preparing for CDA or power shutdown.

SEM software > open right hand menu > Airlock > Close CCV

[[Category:Tools]]
[[Category:Lithography]]
[[Category:Characterization]]

Heidelberg µPG 501

2022-05-03T08:50:52Z

Karolis: /* Troubleshooting */ added small troubleshooting section regarding disappearing config

Raith eLine

2022-05-03T08:48:58Z

Karolis: added troubleshooting of failed 5V power supply error

{{Infobox tool
|image = Tool eline.jpg
|toolfullname = Raith eLine
|website = https://www.raith.com/
|company = Raith Nanofabrication
|description = Electron beam lithography and microscopy system
|location = Cleanroom (03.2.209C)
|primary = Shiv
|secondary = Karolis
}}
Raith eLine is a variable acceleration voltage (up to 30 kV) scanning electron microscope/lithography tool.
Nowadays most e-beam lithography needs are covered by [[Elionix 7000]] and [[Elionix F-125]], so this machine is primarily used for imaging.
It is very convenient to set up automated image acquisition using imaging scripts inside of a position list with coordinates.
You can also import your device design (GDS) and use it as a map.
There is an automatic height sensing (AHS) upgrade installed.

Other lithography tools at the [[Main Page|NBI cleanroom]]:
* [[Elionix 7000]], 100 kV EBL
* [[Elionix F-125]], 125 kV EBL at QuanTech
* [[Heidelberg µPG 501]] LED writer
* [[Süss mask aligner]]

Other SEM imaging tools:
* [[JEOL 7800F]]
* [[JEOL 7800F prime]] at QuanTech

== eLine usage and reservation guidelines ==
* To book time on the machine go to the [http://cleanroom.brickhost.com/Web/schedule.php web schedule]. You should make a booking in the system, even if the machine is available and not booked by others.
* Late cancellations of sessions that you’ve signed up should only happen when unforeseen conflicts or unexpected fab difficulties occur. Please do not sign up to use equipment unless you are prepared and have every intention of using the time.
<blockquote style="background-color: #F0F0F0; border: dashed thin grey;">
If you don't have an account write to the cleanroom staff ([mailto:cleanroom@nbi.dk cleanroom@nbi.dk]) and we will provide you with username and password.
</blockquote>
* Use the dedicated SEM (JEOL) for microscopy, unless the e_Line is really needed. Ask for SEM training if needed.
* Between the hours of 9 am and 6 pm on weekdays, you should:
** not reserve more than 3 hours. See (*)
** not book a 2nd slot, before the 1st one is done. See (*)
** delete booking only before the starting time.
** write to the experiment mailing list that the machine is free, if you finish earlier.
(*) Some NW wafer exposures take longer and exceptions to these rules are made to accommodate these tasks. A special account '''NW-MBE''' is used in the booking system to indicate these jobs.
* Please talk to a [[About|staff member]] if you have fab jobs that are not compatible with the rules above

== Troubleshooting ==

; Error regarding failed 5V supply during EM server software startup?
: Normal and harmless.

[[Category:Tools]]
[[Category:Lithography]]
[[Category:Characterization]]

Raith eLine

2022-05-03T08:46:36Z

Karolis: added general info

{{Infobox tool
|image = Tool eline.jpg
|toolfullname = Raith eLine
|website = https://www.raith.com/
|company = Raith Nanofabrication
|description = Electron beam lithography and microscopy system
|location = Cleanroom (03.2.209C)
|primary = Shiv
|secondary = Karolis
}}
Raith eLine is a variable acceleration voltage (up to 30 kV) scanning electron microscope/lithography tool.
Nowadays most e-beam lithography needs are covered by [[Elionix 7000]] and [[Elionix F-125]], so this machine is primarily used for imaging.
It is very convenient to set up automated image acquisition using imaging scripts inside of a position list with coordinates.
You can also import your device design (GDS) and use it as a map.
There is an automatic height sensing (AHS) upgrade installed.

Other lithography tools at the [[Main Page|NBI cleanroom]]:
* [[Elionix 7000]], 100 kV EBL
* [[Elionix F-125]], 125 kV EBL at QuanTech
* [[Heidelberg µPG 501]] LED writer
* [[Süss mask aligner]]

Other SEM imaging tools:
* [[JEOL 7800F]]
* [[JEOL 7800F prime]] at QuanTech

== eLine usage and reservation guidelines ==
* To book time on the machine go to the [http://cleanroom.brickhost.com/Web/schedule.php web schedule]. You should make a booking in the system, even if the machine is available and not booked by others.
* Late cancellations of sessions that you’ve signed up should only happen when unforeseen conflicts or unexpected fab difficulties occur. Please do not sign up to use equipment unless you are prepared and have every intention of using the time.
<blockquote style="background-color: #F0F0F0; border: dashed thin grey;">
If you don't have an account write to the cleanroom staff ([mailto:cleanroom@nbi.dk cleanroom@nbi.dk]) and we will provide you with username and password.
</blockquote>
* Use the dedicated SEM (JEOL) for microscopy, unless the e_Line is really needed. Ask for SEM training if needed.
* Between the hours of 9 am and 6 pm on weekdays, you should:
** not reserve more than 3 hours. See (*)
** not book a 2nd slot, before the 1st one is done. See (*)
** delete booking only before the starting time.
** write to the experiment mailing list that the machine is free, if you finish earlier.
(*) Some NW wafer exposures take longer and exceptions to these rules are made to accommodate these tasks. A special account '''NW-MBE''' is used in the booking system to indicate these jobs.
* Please talk to a [[About|staff member]] if you have fab jobs that are not compatible with the rules above

[[Category:Tools]]
[[Category:Lithography]]
[[Category:Characterization]]

Staff

2022-05-03T08:45:08Z

Karolis: created as a redirect

#REDIRECT [[About#Staff]]

Olympus microscopes

2022-05-03T08:38:13Z

Karolis: /* Troubleshooting */ added fixes for vignetting, reversed axes, disabled controller

{{Infobox tool
|image = Tool Olympus BX51M.jpg
|toolfullname = Olympus BX51M Olympus BX53M
|website = http://www.olympus-ims.com/en/
|company = Olympus IMS
|description = Optical microscope
|location = Cleanroom 1 (03.2.209A) Cleanroom 2 (03.2.203B)
|primary = Nader
|secondary = Karolis
}}
There are Olympus BX metrology microscopes both in CR1 (BX51M) and CR2 (BX53M).
They have feature parity and are equipped with 4K cameras and motorized Märzhäuser Wetzlar Tango stages.
Objectives are 5x, 10x, 20x, 50x, 100x.
Ultimate optical resolution (Rayleigh limit) of the 100x objective should be ~400 nm (at 550 nm wavelength).

If you want to resolve smaller features, you can use:
* [[JEOL 7800F|JEOL JSM-7800F]] SEM
* [[Raith eLine]] SEM
* [[Philips TEM]]

If you want to resolve topographical features, you can use:
* [[Tencor profilometer]]
* [[Bruker Dimension Icon AFM]]

If you want to observe photoresist, insert the green filter at the back of the microscope body.
Otherwise white light will expose your resist.

== Usage rules ==
No booking is required, but please be flexible with regard to needs of other users.

The microscopes should be left with the light turned off or all the way down using the controls on the microscope body.

Do not leave samples on the stage or elsewhere in the working area, they might get discarded.

Save images you want to keep to Z drive, local files might get discarded.

== How to: take an overview image ==
<gallery>
File:Olympus-define-overview-area.png|''Stage Navigator'' toolbar should be at the top left of the ''Stream Motion'' software, above the overview image.
File:Olympus-stage-navigator-menu.png|To enable ''Stage Navigator'' toolbar: ''View > Tool Windows > Stage Navigator''.
</gallery>

=== Scanning the area ===
# Make sure the ''Stage Navigator'' toolbar is open.
# Click the left-most icon ''Define Overview Area''.
# Follow the instructions on screen:
## Find the top-left of your area, press ''OK''.
## Find the bottom-right of your area, press ''OK''.
# The microscope will now automatically take and tile the images of the entire area defined by the two corners.
It is now possible to navigate the area by clicking on the overview image.

=== Saving the image ===
If you want to save the overview image:
# ''Right click on the overview image on the left > Open Overview Image''
# ''File > Save As... (Ctrl+Shift+S)''
# Select a filetype that suits your needs:
#* Lossy (recommended for overview images):
#** Recommended 85% quality JPEG (JFIF).
#** High quality compression is imperceptible by human eye.
#** Filesize can be some tens of megabytes.
#** JPEG2000 provides 5-10x smaller filesizes but is not a universally compatible image format.
#* Lossless:
#** Recommended PNG or uncompressed TIFF.
#** The filesize can easily be several hundred megabytes.
#** LZW TIFF compression can reduce the size in half, but the microscope PC struggles with it.
#** JPEG2000 provides lossless compression, but is not a universally compatible image format.
# Save directly into Z drive.

== Troubleshooting ==
; The corners of the image are dark (vignetting)!
: There is a mechanical spring that holds the microscope components together. It needs to be tightened by service. Please notify CR staff.
: For a temporary fix make a flatfield correction: ''Acquire > Devices > Device Settings > camera (UC90) > Shading Correction > Flatfield''
; Everything is green!
: There is a green filter at the back of the microscope body. It is used to observe photoresist without exposing it.
; The image is completely black!
: Switch from eyepiece mode to camera mode (or vice versa) using a rod at the top of the microscope body.
; The overview image is all jumbled up!
: The axes of the motorized stage got inverted by the software gremlins. You can try to fix this or simply ask the CR staff.
: Try: reverse X/Y axes in ''Acquire > Device Settings > Marzhauser Tango''
; The image is completely frozen!
: Turn on live imaging with the big button on the right side of the ''Stream Motion'' software.
; I can see a projection of the cleanroom lab in the image!
: Turn down the exposure/gain in the software and increase the light using the knob on the microscope body.
; The hand controller is not moving the stage!
: Verify that the install Märzhäuser Tango control software is installed.

[[Category:Tools]]
[[Category:Characterization]]

JEOL 7800F

2022-05-03T08:35:08Z

Karolis: /* Resources */ added small troubleshooting section

{{Infobox tool
|image = Tools JEOL 7800F.jpg
|toolfullname = JEOL JSM-7800F
|website = http://www.jeol.de
|company = JEOL, Ltd.
|description = Scanning electron microscope
|location = 03.1.K08
|primary = Nader
|manual = A printed version is in a blue binder by the instrument
}}

The JEOL 7800F is a 30 kV field emission scanning electron microscope (SEM).
It is equipped with two [https://en.wikipedia.org/wiki/Everhart-Thornley_detector secondary electron detectors] a backscatter detector, and a EDS detector.
It has a eucentric stage, a range of different sample holders depending on application requirements, and can accommodate samples of up to 50 mm in diameter.
A unique feature of this SEM, is its ability to place a negative bias on the sample stage in order to decelerate incoming electrons as well as to eject secondary electrons, thereby increasing the signal-to-noise ratio.
This feature is known as gentle beam (GB), and is particularly useful when working at low acceleration voltages.

[[Raith eLine]] is an alternative to this tool.
It does not have beam deceleration capability, but supports scripting such as unattended imaging.
Repetitive imaging at predetermined locations should be carried out on that tool instead.

== Overview ==

The different components of the SEM are illustrated in the two figures below:

[[File:JEOL 7800F Overview 1.png|left|thumb|Left side of the JEOL 7800F]]
[[File:JEOL 7800F Overview 2.png|left|thumb|Right side of the JEOL 7800F]]
[[File:JEOL 7800F consoles.png|left|thumb|Stage and beam control consoles]]

* The lower electron detector (LED) is a [https://en.wikipedia.org/wiki/Secondary_electrons secondary electron] detector, located in the chamber, and is mostly used for overview images, or in conjunction with sample tilting or high acceleration voltages.
* The upper electron detector (UED) is an in-lens secondary electron detector located in the electron beam column. It is typically used for obtaining ultrahigh resolution iamges at low acceleration voltages. It is usually used in conjunction with the gentle beam (GB).
* The backscatter detector (BSD) measures the high energy electrons from the incident beam that are backscattered by the sample surface. Particularly useful for samples composed of different materials of contrasting densities. The detector is inserted by a pneumatic valve when needed by the user, but is otherwise retracted.
* The EDS detector measures the x-ray wavelengths of photons generated in the sample when exposed to the electron beam. Using the measured x-ray spectrum, the sample material composition may be determined.
* The chamber camera is colour sensitive, and primarily used to see the sample and sample holder in relation to the pole-piece. It can only be switched on if the gun-valve is closed, and the gun-valve cannot be opened while the camera is on.
* The loadlock camera automatically takes a picture of the sample surface when the loadlock is evacuated. However, if the user is not logged in, the image will not be taken, and there is no way to take it without venting and re-evacuating the loadlock. The overview picture can be used for rough navigation of the sample.
* There is a magnetic field sensor suspended adjacent the electron beam column, and is connected to a magnetic field cancellation unit in the corner of the room. If you notice interference, or feel that you are not reaching the image resolution you feel you should, check the field cancellation unit to see if it has been tripped. This happens once in a while due to vibration from foot traffic outside, etc, and the field cancellation may be restored by pressing the reset button on the unit.
* The SEM has a N2 dewar for cooling the sample stage.

== Loading sample ==

# '''Select the appropriate sample holder:''' There are several different sample holders available for the SEM, each adapted for a particular sample size or function, such as a full 2 inch wafer holder, cross-sectional sample holder etc. Generally, you should use the smallest sample holder that will accommodate your sample. This will give you the greatest range of tilt. The PC-SEM software knows about the geometry of the different sample holders, and will automatically set the safe tilt angles for you, and prevent you from accidentally running the sample holder into the pole-piece.
# '''Attach the sample:''' The 2 inch wafer holder allows for the attachment of samples to the holder via clips, and the cross-sectional sample holders alow the samples to be either clamped in place or mounted with a screw. For the remaining sample holders, and adhesive must be used, e.g. carbon tape, graphite paste, or silver conducting paste. Most users use the carbon tape. It is easy to use, and to remove, but due to the elastic nature of the tape, some drift may occur at high magnification. If this is a problem, or you have fragile samples that may break when removed from the adhesive tape, you can try the graphite paste. It has lower adhesion, but also more electrically resistive. There are two pastes available, one suspended in water solution, and the other in isopropanol. Apply only a small dot to the sample holder surface and place your sample over it, press down gently on the sample and then leave it to try for about 5 minutes. Test whether the sample is well attached to the sample holder before loading. Note: Do not use for full wafers.
# '''Set the sample height:''' [[File:Sample holder.png|right|thumb|The 12.5 mm sample holder as seen from the side and from below.]] The sample must be attached to the sample holder such that its surface protrudes slightly from the edge of the sample holder when viewed from the side. The height of this protrusion is known as the sample surface offset. If the sample surface is below the edge of the sample holder, it must be adjusted. In the case of the 12.5 mm sample holder (see figure), this is done by loosening the two retaining screws on the side of the holer, and then screwing the large screw on the underside of the holder. This adjusts the height of the central stub to which the sample is attached.
# '''Load the sample holder:''' Hold the VENT button for two seconds, or until you hear a valve close and the hissing sound of N2 entering the loadlock, and then release clip on the side of the loadlock. This avoids an overpressure from forming within the loadlock which could dislodge the loadlock o-ring. Once the hissing stops, open the loadlock and push the sample holder into the mounting brace. Make sure it sits snugly against the flat edge, and verify that it isn't tilted. Close the loadlock, close the brace, and then press the EVAC. The system will start rough-pumping the loadlock. Pressing EVAC will also trigger the loadlock camera to take a picture of the sample surface, which can be used for navigation later on.
# ''' Insert the sample holder into the chamber:''' Once the pressure in the loadlock reaches 1.6 Pa, the SEM will automatically move the rough pumping to the back of the turbopump, and open the gate valve. This process emits three hisses, after which you can move the sample holder into the chamber using the loading rod, in accordance with the following procedure.

{| width="80%" align="center"
|-
| [[File:JEOL 7800F loading 1.png | 275px]]
|
* Lower the loading rod to the horizontal position by pivoting it downwards by 90°. Once horizontal, it will be pulled in part-ways by a spring.
* Lightly lift the rod a few degrees while applying a very gentle force along it, in order for it to reach the loading position (you should hear a metallic snap).
|-
| [[File:JEOL 7800F loading 2.png | 275px]]
|
* Push the rod directly into the chamber. Do not apply a up/down force, nor twist the rod.
|-
| [[File:JEOL 7800F loading 3.png | 275px]]
|
* You should feel the vacuum help bring in the rod
|-
| [[File:JEOL 7800F loading 4.png | 275px]]
|
* Once the rod is almost fully inserted, you will feel an increased resistance. This is due to the two braces (FIXME) meeting, and is normal. Push a little harder, until you overcome the resistance.
* When the rod is fully inserted, a dialog box will pop up in PC-SEM, asking which sample holder was inserted. ''It is absolutely imperative that you select the correct one from the menu. Not doing so may lead to catastrophic damage to the instrument.''
* Leave the sample surface offset at 0 mm for now.
|-
| [[File:JEOL 7800F loading 5.png | 275px]]
|
* Pull the rod all the way out, until you see the gray plastic stopper pop up, which prevents the rod from being pulled back in. You should hear a clicking noise.
|-
| [[File:JEOL 7800F loading 6.png | 275px]]
|
* Pivot the rod back into the vertical standby position.
|}

== Measuring sample surface offset ==

The SEM uses the sample surface offset value along with the geometry of the sample holder used, to set the allowed ranges for tilt, vertical position, etc. If not set correctly, you will risk running the sample holder into the pole-piece, from which the focused electron beam emerges. A secondary purpose of setting the offset, is that when the focus is linked to the z-coordinate, changing the working distance will automatically set the correct value of z, giving you a good starting focus.

Let's start by defining a few concepts:

[[File:JEOL7800F offset.png|right|200px]]
* The distance form the edge of the pole-piece to the point at which the electron beam is focused is known as the working distance (WD).
* The ''z'' coordinate is the distance from the edge of the pole-piece to the edge of the sample holder
* The sample surface offset (''o'') is the the distance

Thus, it is clear that for the electron beam to be in focus at the sample surface, the condition WD + ''o'' = ''z'' must be true.

To measure the offset, do as follows:
# Make sure the ZFC button is enabled
# Move the sample holder closer to the pole-piece, but keep a safe distance from it; set WD to e.g. 10 or 15 mm, by clicking on WD in the micrograph datazone. The z will be adjusted automatically.
# Set the acceleration voltage to a reasonable value (say 10 kV).
# Once the stage has stopped moving, find something on the surface of your sample to focus on, and zoom in on it
# Now, slowly rotate the ring around the track-ball until you get a reasonably good focus.
# Increase magnification if appropriate, and refine the focus.
# Once you’re happy, the difference between the z and WD gives the offset: ''o'' = ''z'' - WD
# Click on the image of the sample holder in the lower-right quadrant of PC-SEM, and enter the offset value into the field at the bottom of the dialog.

Please note: The offset should always be measured with respect to the highest point on the sample or sample holder. For example, if you are using a sample holder with retraining pins that are held in place with a screw, the head of the screw is now the highest point and should be used to measure the offset.

== Navigating to your region of interest ==
Move to your region of interest. You have several options for stage navigation:
* Dragging and dropping with the mouse in the image area
* Right-clicking on objects in the image area or stage navigation image
* The trackball
* The x/y buttons on the stage console

If you have difficulties locating your structure, you can enable the LDF mode. It will give you a larger field of view and a larger depth of focus, at the expense of imaging resolution. Please note, the LDF mode works by switching off one of the focusing lenses, so if you have LDF mode on for extended periods, you may experience drift after it is turned off. This is due to the lens heating back as current passes through its focusing coils.

== Imaging ==

=== Choice of acceleration voltage, working distance, detector, etc. ===

The choice of acceleration voltage depends on what you want to observe. That being said, the higher the acceleration voltage, the deeper into your sample the electron beam will penetrate, which can be useful e.g. for imaging through oxide layers, etc. On the other hand, if you want to perform surface imaging, you will typically want a low acceleration voltage. As a very general rule of thumb (with lots of exceptions), the working distance should match the acceleration voltage; the faster the electrons are travelling, the more difficult it is to focus them to a point over short distances away from the pole-piece.

The choice of detector depends on your working distance, tilt, etc:

* If you are using a high acceleration voltage, and thus a high working distance, or need to tilt your sample, use the LED. It is great for getting a quick image with minimal hassle, for overview images, etc.
* If you are using a low acceleration voltage, and a low working distance, use the UED; the lower the working distance, the more the pole-piece will shadow the LED, reducing the signal strength. The UED in invariably used in GB mode, which enhances the signal strength by accelerating secondary electrons away from the sample and towards the detector. The maximum GB bias is 2 kV. Note: when using the UED, there is no benefit in going closer than 3 mm; the sample holder will start interacting with the EM field from the pole-piece.
* Especially useful when you have samples composed of materials of contrasting atomic mass. It is typically used in conjunction with a working distance between 4 and 10 mm. Note: When using the BSD, you need a relatively slow scan speed with no frame averaging. More on that later.
* You can combine the signals from multiple detectors by selecting ADD in the detector drop down menu. For instance, you can combine the image from the BSD illustrating the material contrast of the sample, with a surface image from either the LED or UED.

=== Beam conditioning ===

Before you can image your structure, you will need to condition the electron beam. This involves

* focusing
* aligning the aperture (wobble)
* stigmating

You can focus using either
* the focus knob on the beam control console, or
* clicking-and-holding on the focus button above the imaging area (see below), then dragging the mouse.
:: [[File:JEOL 7800F mouse focus.png|672px]]

If the imaged moved while focusing, you'll need to align the aperture. Press the wobble button; this will move the focus up and down, and cause the image to shift back and forth. Adjust the ''x'' and ''y'' knobs to minimize the wobbling – here ''x'' affects the x-movement, etc (in contrast to other systems). Once you’re satisfied, hit the wobble button again to disable it.

Fine-tune the focus. If you notice that adjusting the focus causes the image to be stretched in one direction, and then another, it is astigmated. This distortion is a result of a non-circular beam cross-section at the sample surface, and will need to be corrected using the x and y stigmators. Using mouse-focusing: move the focus back and forth from one extreme (heavily astigmated in one direction) to another ((a) and (b) in the figure below), and find the central point where the image seems equally defocused in all directions (c). Once at this point, adjust the ''x'' or ''y'' stigmator until the focus is optimized, and then repeat the procedure for the other. This should result in an improved image (d). Fine-tune the focus again, and repeat the procedure if necessary.

[[File:JEOL 7800F stigmation.png|center|850px|Steps for improving an astigmated image.]]

=== Scan speeds and the photo button ===

In the top-left of the beam-control console, you’ll find two buttons (quick, fine), that toggle the scan speed of the beam. Alternately, you can use the two buttons in the software menu. There are four speed settings available (quick1, quick2, fine1, fine2), the exact speed of which depends on your particular user settings. To change them, open the “Operation settings” dialog in the “Settings” menu (shown below).

[[File:JEOL 7800F operation settings.png|center|650px|Operation settings dialog box.]]

Here, the quick1 and quick2 are set to fast scan speeds, with 16 frame averages. The lower the scan speed number, the shorter the beam dwell-time at each pixel. The scan speed number follows a logarithmic scale, as shown below.

[[File:JEOL 7800F scan speed chart.png|center|450px|Pixel dwell time v.s. scan speed number.]]

The "Operation settings" dialog box also dictates what happens when you hit the "Freeze" button. It can either integrate for a certain number of frames depending on whether the scan speed is "Quick" or "Fine", or it can simply freeze the frame after scanning it. In the latter case, the beam will be deflected away from the sample, so carbon will not build up on the surface while the frame is frozen. For imaging at greater resolutions than the default addressing grid of 1280 x 960 pixels, the photo button must be used, and the desired resolution chosen in the "Operation settings" dialog. Alternatively, if you're fine with the default resolution, you can freeze the frame, and then press the photo button to save the image. The software will give an estimated time required to take an image, but in general, you should use the fastest scan speed which gives you an acceptable level of noise in your image, in order to avoid distortion of your image due to drift, as well as carbon contamination, etc.

=== Contrast and brightness ===

In addition to manually adjusting the contrast and brightness knobs on the beam-control console, the system also has a automatic contrast and brightness button (ACB). It generally does a reasonable job of correctly setting the contrast and brightness, but if the image is completely underexposed (black) or overexposed (white), or completely out of focus, it might fail.

[[File:JEOL 7800F histogram.png|right|350px]] Clicking the button with the triangle symbol above the LUT button will bring up a histogram of the pixel values of the current frame (shown). You can use this histogram to correctly expose your image: the brightness controls the position of the signal, the contrast controls the width of the signal, and you should aim to use the entire dynamic range of the detector, i.e. the signal should be as wide as possible while still fitting in the histogram range.

== Unloading ==

When you're done with the SEM, turn off the beam, and retract the BSD if applicable, and then press the "Spec. Exchange" button. It will move the stage to the loading/unloading position (X,Y,R,T = 0, Z = 40 mm). Once it's done, the button will become green [[File:JEOL 7800F specimen exchange.png]] and it is safe to transfer the sample holder from the chamber to the loadlock using the loading rod as described above. Once in the loadlock, you can vent the loadlock to retrieve your sample. '''Leave the loadlock pumped down'''. Fill in the log-book, and transfer your files from the SEM PC to e.g. the ZDrive.

== Tips and tricks ==

=== Stepping and sample alignment ===

Under the "Step Control" tab in the upper right corner of PC-SEM, you can find tools for stepping predefined distances in the X, Y directions, as well as rotation. The stepping can be defined as either a physical distance, or a percentage of the frame width. Furthermore, you can align the sample to a given axis clicking on either the horizontal or vertical ruler tools, and drawing a line along the preferred horizontal/vertical axis on the imaging area. This will rotate the stage to match your input. Furthermore, under "Step control" you can save a stage position by clicking the "Addition" button. If you later want to return to this position, you can select the position from the list, and then click on "Move".

=== Restoring stage and beam conditions from previously taken image ===

In the "Image File" tab in the lower-left corner of PC-SEM, there is a dialog box which allows you to restore beam, stage, and detector conditions, acceleration voltage, magnification etc. from a previously taken image. Press browse to select the directory in which your images (as well as the sidecar .txt files). Once the images have been loaded, right click on an given image to restore the conditions it was taken under.

=== Dynamic focus ===

When imaging samples at a high tilt, you may find that the depth of focus is not sufficient. You can compensate for this by checking the "Dynamic Focus" box in the lower middle of PC-SEM, and using the tool in the drop-menu below to set the focus in two regions of your sample surface. When scanning, the SEM will use interpolation to attempt to keep the beam focused along the sample surface.

=== Refocusing after inserting the BSD ===

At some point, you will run into a situation where you want to view your sample using the BSD, but inserting it causes your focus and beam conditions to become degraded. This is due to the fact that the BSD sits very snugly against the pole-piece, and disrupts the balance between the electrostatic and magnetic focusing. In order to restore your focus, use the "Focus Correct" slider at the bottom of the software to restore the balance between the two focusing mechanisms. Note that there is a slight hysteresis in the slider, and that the optimal focus may lie somewhere between two steps.

=== Probe current ===

The probe current can be set using the spin box below the imaging area. The lower the probe current, the smaller the spot-size of the electron beam, and thus, the smaller the features you should be able to resolve. However, decreasing the probe current comes at the cost of a reduced signal-to-noise ratio, and thus there exists a trade-off relationship between signal and resolution. You can mitigate this to an extent by decreasing the scan-speed, but then drift may become an issue. In general, use the following to guide your choice of probe current:

# ultra high resolution: 3-5 (usually only with gentle beam on)
# high resolution: 6
# standard: 8
# overview: 10

The probe current number relates logarithmically to the actual current as shown in the following graph:

[[File:JEOL 7800F probe current chart.png|center|450px|Probe current v.s. probe current number.]]

=== Focus ranges ===

There are two focusing regimes in the SEM; At working distances below ~5.5 mm, the beam will be focused with both an electrostatic and magnetic lens system. Above this working distance, the electrostatic lens is switched off. There is thus a discontinuity at this switching point, and is clearly visible as a "jump" in the image, and you should thus avoid positioning your sample surface there.

== Troubleshooting ==
; Photo button doesn't work?
: Restart PC.
; Drifty image?
: Chiller water needs to be topped up. Contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
== Resources ==

[[media:Invitation_to_the_SEM_World.pdf|Invitation to the SEM world]]

[[media:JEOL_Guide_to_SMO.pdf|A guide to scanning microscope observation (JEOL)]]

[[media:Hitachi_SEM_user_guide.pdf|Hitachi SEM user guide (2007)]]

[[Category:Tools]]
[[Category:Characterization]]

Olympus microscopes

2022-04-28T14:41:23Z

Karolis: added general info, how to create an overview image, troubleshooting

{{Infobox tool
|image = Tool Olympus BX51M.jpg
|toolfullname = Olympus BX51M Olympus BX53M
|website = http://www.olympus-ims.com/en/
|company = Olympus IMS
|description = Optical microscope
|location = Cleanroom 1 (03.2.209A) Cleanroom 2 (03.2.203B)
|primary = Nader
|secondary = Karolis
}}
There are Olympus BX metrology microscopes both in CR1 (BX51M) and CR2 (BX53M).
They have feature parity and are equipped with 4K cameras and motorized Märzhäuser Wetzlar Tango stages.
Objectives are 5x, 10x, 20x, 50x, 100x.
Ultimate optical resolution (Rayleigh limit) of the 100x objective should be ~400 nm (at 550 nm wavelength).

If you want to resolve smaller features, you can use:
* [[JEOL 7800F|JEOL JSM-7800F]] SEM
* [[Raith eLine]] SEM
* [[Philips TEM]]

If you want to resolve topographical features, you can use:
* [[Tencor profilometer]]
* [[Bruker Dimension Icon AFM]]

If you want to observe photoresist, insert the green filter at the back of the microscope body.
Otherwise white light will expose your resist.

== Usage rules ==
No booking is required, but please be flexible with regard to needs of other users.

The microscopes should be left with the light turned off or all the way down using the controls on the microscope body.

Do not leave samples on the stage or elsewhere in the working area, they might get discarded.

Save images you want to keep to Z drive, local files might get discarded.

== How to: take an overview image ==
<gallery>
File:Olympus-define-overview-area.png|''Stage Navigator'' toolbar should be at the top left of the ''Stream Motion'' software, above the overview image.
File:Olympus-stage-navigator-menu.png|To enable ''Stage Navigator'' toolbar: ''View > Tool Windows > Stage Navigator''.
</gallery>

=== Scanning the area ===
# Make sure the ''Stage Navigator'' toolbar is open.
# Click the left-most icon ''Define Overview Area''.
# Follow the instructions on screen:
## Find the top-left of your area, press ''OK''.
## Find the bottom-right of your area, press ''OK''.
# The microscope will now automatically take and tile the images of the entire area defined by the two corners.
It is now possible to navigate the area by clicking on the overview image.

=== Saving the image ===
If you want to save the overview image:
# ''Right click on the overview image on the left > Open Overview Image''
# ''File > Save As... (Ctrl+Shift+S)''
# Select a filetype that suits your needs:
#* Lossy (recommended for overview images):
#** Recommended 85% quality JPEG (JFIF).
#** High quality compression is imperceptible by human eye.
#** Filesize can be some tens of megabytes.
#** JPEG2000 provides 5-10x smaller filesizes but is not a universally compatible image format.
#* Lossless:
#** Recommended PNG or uncompressed TIFF.
#** The filesize can easily be several hundred megabytes.
#** LZW TIFF compression can reduce the size in half, but the microscope PC struggles with it.
#** JPEG2000 provides lossless compression, but is not a universally compatible image format.
# Save directly into Z drive.

== Troubleshooting ==
; The corners of the image are dark!
: There is a mechanical spring that holds the microscope components together. It needs to be tightened by service. Please notify CR staff.
; Everything is green!
: There is a green filter at the back of the microscope body. It is used to observe photoresist without exposing it.
; The image is completely black!
: Switch from eyepiece mode to camera mode (or vice versa) using a rod at the top of the microscope body.
; The overview image is all jumbled up!
: The axes of the motorized stage got inverted by the software gremlins. You can try to fix this or simply ask the CR staff.
; The image is completely frozen!
: Turn on live imaging with the big button on the right side of the ''Stream Motion'' software.
; I can see a projection of the cleanroom lab in the image!
: Turn down the exposure/gain in the software and increase the light using the knob on the microscope body.

[[Category:Tools]]
[[Category:Characterization]]

Olympus BX53M

2022-04-28T13:52:50Z

Karolis: added to redirect to unified Olympus microscopes page

#REDIRECT [[Olympus microscopes]]

Olympus BX51M

2022-04-28T13:51:29Z

Karolis: Karolis moved page Olympus BX51M to Olympus microscopes: two different models of Olympus microscopes

#REDIRECT [[Olympus microscopes]]

Olympus microscopes

2022-04-28T13:51:29Z

Karolis: Karolis moved page Olympus BX51M to Olympus microscopes: two different models of Olympus microscopes

{{Infobox tool
|image = Tool Olympus BX51M.jpg
|toolfullname = Olympus BX51M
|website = http://www.olympus-ims.com/en/
|company = Olympus IMS
|description = Optical microscope
|location = Cleanrooms 1 & 2
|primary = Nader
|secondary = Karolis
}}

[[Category:Tools]]
[[Category:Characterization]]

File:Olympus-stage-navigator-menu.png

2022-04-28T11:31:21Z

Karolis:

File:Olympus-define-overview-area.png

2022-04-28T11:31:13Z

Karolis:

Tools

2022-04-26T11:46:56Z

Karolis: added link to training page

A prerequisite for using the cleanroom tools is that a cleanroom staff member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the [[Training|training]] page and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].]
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system]. However, after a certain period of inactivity on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Tool list ==
{| style="width: 85%;"
|- style="text-align:left;"
! Lithography !! Thin film & III-Vs !! Characterization !! Other
|- valign="top"
| style="width: 20%;" |
* [[Heidelberg µPG 501|Heidelberg LED writer]]
* [[Süss mask aligner]]
* [[Raith eLine|Raith eLine 30 kV EBL/SEM]]
* [[Elionix_7000|Elionix 7000 100 kV EBL]]
* [[Elionix_F-125|Elionix F-125 125kV EBL]] (QuanTech)
| style="width: 20%;" |
* [[AJA systems]]
* [[E-Gun evaporator]]
* [[Edwards evaporator|Edwards thermal evaporator]]
* [[Laurell spinners]]
* [[Cambridge ALD]]
* [[Leica sputter coater]]
* [[MBE]]
| style="width: 20%;" |
* [[JEOL 6320F|JEOL JSM-6320F]]
* [[JEOL 7800F|JEOL JSM-7800F]]
* [[Raith eLine]]
* [[Philips TEM]]
* [[Tencor profilometer]]
* [[Alpha-SE ellipsometer]]

* [[Olympus BX51M|Olympus BX51M microscopes]]
* [[Lynx EVO stereomicroscope]]
* [[Bruker Dimension Icon AFM]]
* [[Filmetrics reflectometer]]
* [[Probe station]]
| style="width: 20%;" |
* [[Süss scriber|Manual Süss scriber]]
* [[Loomis scriber|Automatic Loomis scriber]]
* [[Dicing saw]]
* [[AccuThermo RTA]]
* [[Plasma-Preen asher]]
* [[Diener plasma asher]]
* [[Tergeo plasma asher]]
* [[FS bonder]]

* [[Micromanipulator]]
* [[Präzitherm hotplates]]
* [[Critical point dryer]]
|}

== Tool access requirement guidelines ==

{| cellspacing=0px style="text-align: center;"
! scope="col" width="20%" align="right" |
! scope="col" width="20%" | Bachelor
! scope="col" width="20%" | Master
! scope="col" width="20%" | PhD
! scope="col" width="20%" | Postdoc
|-
| style="text-align:right; padding-right:6px;" | [[Raith eLine|eLine]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Elionix]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Heidelberg µPG 501|LED writer]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Süss mask aligner|Mask aligner]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[AJA Systems|AJAs]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[E-Gun evaporator|E-gun]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Edwards evaporator|Edwards]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Cambridge ALD|ALD]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Leica sputter coater|Leica sputter]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 6320F]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[JEOL 7800F]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Philips TEM|TEM]]
| style="background-color: #ff9f9f" | No
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Tencor profilometer|Profilometer]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Alpha-SE Ellipsometer|Ellipsometer]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-

| style="text-align:right; padding-right:6px;" | [[Bruker Dimension Icon AFM|AFM]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Filmetrics reflectometer|Filmetrics]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="padding-bottom:6px;" |
|-
| style="text-align:right; padding-right:6px;" | [[Süss scriber|Manual scriber]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Loomis scriber]]
| style="background-color: #ff9f9f" | No
| style="background-color: #ff9f9f" | No
| style="background-color: #ff9f9f" | No
| style="background-color: #ff9f9f" | No
|-
| style="text-align:right; padding-right:6px;" | [[AccuThermo RTA|RTA]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Biorad]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Plasma-Preen asher|Microwave asher]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Diener plasma asher|Diener asher]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Tergeo Plasma Asher|Tergeo asher]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|-
| style="text-align:right; padding-right:6px;" | [[Laurell spinners|Spinners]]
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
| style="background-color: #c6e0b4" | Yes
|}

[[Category:Tools]]

Micromanipulator

2022-04-26T09:44:06Z

Karolis: /* Stage */ fixed links to stage parts

{{Infobox tool
|image = Tools_Micromanipulator.jpg
|toolfullname = Micromanipulator
|company = Leica/Zaber/Eppendorf
|description = Optical microscope + motorized stage + manipulator arm
|location = Basement, Elionix room 03.01.K03
|primary = Karolis
|secondary = Martin
}}

Micromanipulator is a setup meant for nanowire transfer from a source substrate to a target substrate.
This is done using a transfer arm that can move with sub-micrometer precision.
The substrates can be moved with a motorized stage in x, y, z, and rotated around the z axis.
The action can be observed through a microscope/camera.
== Usage rules ==
Do not place used probes back into the box. If you want to reuse a probe in the future, put it in your own box and clearly label the box. Unknown boxes will be disposed of.

Put used probes into the sharps bin. Do not close the sharps bin fully but leave a small gap to put probes.

Wipe all surfaces both before and after using the tool.
Nanowires can be [[Working with nanowires and nanotubes|very toxic]].
They are small enough to get into human cells and damage their DNA.
The length of the DNA molecule is ~5 um, and most nanowires used at this tool are small enough to damage this molecule.

III-V semiconductors that the nanowires can include can also be very toxic.
Take care of your own [[Safety|safety]] and also the safety of your colleagues.

Try your best not to crash the microscope objectives into the substrate or stage.
Let the [[About|staff]] know if this happens -- send a short message to [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].

== Usage guide ==
Most users have a specific use case for the manipulator.
Therefore this short guide should only act as a guideline.
There is no wrong way to use the tool!

The following instructions use the paradigm of fixing the focal plane and only changing the z position of the stage and the probe.
It is entirely a matter of preference as it can be equally efficient to constantly change the focal plane to e.g. follow the probe movements.

=== Prepare for work ===
# Put on gloves and wipe down all surfaces that you might touch: handrest, joysticks, stage, knobs.
# Make sure the PC is working and the LAS software is running. If not, reboot and launch the software.
# On the stage joystick: <code>Long press 1</code> to home all axes.
# Make sure the stage is at the lowest vertical position and then move it up at least two steps.
# Place your source and target chips on the stage.
# Turn on the light: only the green button on the right.
# Increase the light intensity: turn the knob clockwise. The more light, the faster the camera can produce visible images.
=== Find the target and source locations ===
# Use the knobs on the linear drives to quickly position the target chip under the microscope light.
# Use the joystick to find the target location for the transfer. Place it in the center of the field of view.
# Adjust the working distance of the microscope using the knob on the right.
# Change to a higher magnification objective. Only touch the big ridged ring and not the objectives themselves. Adjust focus again. Repeat until the image is in focus with the highest magnification.
# <code>Long press 5</code> to save the stage position. This is the ''target position''. To prevent accidents caused by unintended button presses, save it to 3 & 4 as well.
# '''Do not touch the microscope focus from this point on.''' All further movements assume we know where the focal plane is at all times.
# Repeat the procedure for the source chip. Instead of moving the microscope focus, move the stage vertically. You can do this by twisting the joystick.
# <code>Long press 3</code> to save the stage position. This is the ''source position''.
# <code>Short press 5</code> to verify the target position. Adjust z if needed and save again. The stage repeatability in z is not exact, so there might be small inaccuracies.
# <code>Short press 3</code> to verify the source position. Adjust z if needed and save again.
=== Get the probe ready ===
# <code>Short press 5</code> to return to the target position.
# Swing the transfer arm out and take out the probe holder.
# Place a desired probe in the probe holder. The visible shank length should be comparable to the wire.
# Adjust the probe holder to the desired angle.
# Set the probe controller to <code>coarse</code>.
# While watching the probe wire, carefully swing the arm back in. The wire should not touch the substrate. The arm/probe should not touch the objective. Move the arm with the controller if needed.
# Change to the lowest magnification.
# Use the controller to move the wire in the xy plane until you can see it in the field of view.
# Move it down until the tip starts to move into focus. Then change to higher magnification and <code>fine</code> movement speed.
# Change to <code>x-fine</code> and repeat the process until you are at the highest magnification and the probe is nearly touching the surface.
# Lightly touch the surface with the probe.
# Look at the controller and move '''up''' 30 um.
# <code>Long press Pos 1</code> to save the probe position. This is the ''probe approach position''.
# Move up 300 um more (or more if you have a large difference in substrate thicknesses). <code>Long press Pos 2</code> to save the probe position. This is the ''transfer position''. Save it to <code>Pos 3</code> as well, just in case.
=== Ready ===
# Now you are ready to transfer!
#* <code>Short press 3</code> moves the stage to ''source position''.
#* <code>Short press 5</code> moves the stage to ''target position''.
#* <code>Short press Pos 1</code> lowers the probe to ''approach position''.
#* <code>Short press Pos 2</code> raises the probe to ''transfer position''.
=== Done ===
When you are done transferring:
# <code>Short press Pos 2</code> to raise the probe and swing out the arm.
# Take out the probe and put it in the yellow sharps bin.
# <code>Long press 1</code> to home the stage and take your substrates.
# Log your work and any issues you noticed. Notify the staff if there's anything wrong with the setup or you're using probes from the last silver pouch.
# Wipe down all surfaces that you might have touched: handrest, joysticks, stage, knobs.
# Done!

== Instrumentation ==
=== Manipulator arm ===
[[File:Micromanipulator_Transferman_4r_controller.jpg|thumb|Transferman 4r controller]]
* Eppendorf TransferMan 4r system
* or a custom manual arm

Regardless of which arm is used, there are markings on the optical table denoting where it should be fixed.

The Transferman 4r offers 3 programmable positions and 3 programmable movement speeds.
You should be very careful and only use the two faster movement speeds at low microscope magnification, and only when far away from the substrate vertically.
Be conservative with selecting the saved positions, since crashing the probe into the substrate can ruin your work very easily.
Both short instructions and full operating manual can be found [https://www.eppendorf.com/dk-en/eShop-Products/Cell-Manipulation/Micromanipulation/TransferMan-4r-p-PF-26484 online].

The optimal angle for the probe depends on the nanowire stiffness, substrate geometry and substrate surface properties.
A good starting point is 15°.
=== Stage ===
[[File:Micromanipulator_stage_joystick.jpg|thumb|Zaber stage joystick]]
The stage is a stack of Zaber motion modules:
{| class="wikitable"
|-
|[https://www.zaber.com/manuals/X-JOY3 X-JOY3]
|Programmable 3-axis joystick
|-
|[https://www.zaber.com/manuals/X-LSM X-LSM100A] x2
|2 linear stages, <3 um repeatability
|-
|[https://www.zaber.com/manuals/X-RSW-E X-RSW60C-E03]
|Motorized rotary stage
|-
|[https://www.zaber.com/manuals/X-VSR X-VSR20A]
|Vertical lift stage, <1 um repeatability
|-
|}
The modules can be moved directly using the knobs on each module.
For the x/y stages the knobs increase/decrease velocity, single press decelerates, double press instantly stops.
Rotation/z stages are moved one step per knob position.

The joystick should have these functions:
{| class="wikitable"
! Key || Short Press || Long Press
|-
| 1 || Stop all axes || Home all axes
|-
| 2 || Send alerts* 1, 2 || Send alerts* 1, 3, 4
|-
| 3 || Move to saved position || Save current position
|-
| 4 || Move to saved position || Save current position
|-
| 5 || Move to saved position || Save current position
|-
| 6 || Axis x low speed || Axis x high speed
|-
| 7 || Axis y low speed || Axis y high speed
|-
| 8 || Rotation low speed || Rotation high speed
|-
|}
The joystick functions can be changed through the ''[https://www.zaber.com/software Zaber console] - 1'' software.

=== Microscope ===
This is currently a Leica DM2500 MH microscope body, Leica [https://www.leica-microsystems.com/products/microscope-cameras/p/leica-mc170-hd/downloads/ MC170 HD] camera and Leica acquisition software setup.

The field of view/depth of field/resolution of this setup is somewhat limited, but should be good enough for most users.

In fact, short depth of field lets you judge the relative vertical position between the probe and the substrate.

=== Probes ===
[[File:72X_dim.png|thumb|Probe dimensions in inches]]
Also known as needles.
These are thin tungsten wire on a thicker nickel shank.
We use 72X-G2/01 (0.1 um tip radius) and 72X-G2/025 (0.25 um) from [https://www.americanprobe.com/72x-tungsten-wire-3-mil-probe.html American Probe].
The taper model can be found in this handy chart: [[Media:American-Probe-taper-model.pdf|.pdf]].

== Troubleshooting ==
; I can't get any light through the microscope!
<gallery>
File:Micromanipulator_lamp_off.jpg|Lamp turned off
File:Micromanipulator_lamp_on.jpg|Lamp turned on. Notice that the left button remains in the same position.
</gallery>
: Someone probably switched the light source to back lighting. The microscope does not support this. Simply flip the up-down arrow button on the light source. Double check that the green power button is lit, and the knob is not at the minimum position.
; The camera output is completely frozen!
: Turn on live capture mode.
; I would like to save an image of what I see but I don't know how!
: Press ''Acquire image'' in the bottom left of the Leica software window.
; Everything on the PC is frozen, I can't move the mouse cursor!
: The PC has crashed. Find the power button on the PC under the optical table and hold it for several seconds until the PC restarts.
; The image is very strange!
: Maybe someone crashed the lens into the stage and did not tell anyone. Move the stage and the manipulator out of the way, carefully unscrew the questionable objective, blow away any dust with the nitrogen gun, and very gently wipe the lens with mild solvent. Original cleaning instructions from the manufacturer can be found [https://www.leica-microsystems.com/products/light-microscopes/p/leica-dm2500-mh/downloads/ online].
; The image on the screen updates only every few seconds!
: The automatic exposure function in the software collects enough light to see a good signal. Try to increase the light intensity by turning the knob on the power supply clockwise.
; The image is too bright/dark!
: There are two options:
<gallery>
File:Micromanipulator_auto_exposure.png|Auto exposure
</gallery>
:# The automatic exposure fuction in the software is turned off. The iris button in the top left of the Leica Acquisition Suite window should be red: ''Acquire > Camera > Automatic exposure''.
:# If it is already active and at the exposure limit, try adjusting the light intensity.

== Ordering probes & service ==

This information is on the [https://wiki.nbi.ku.dk/qdevwiki/Micromanipulator internal QDev wiki].

[[Category:Tools]]

Micromanipulator

2022-04-26T09:41:12Z

Karolis: added link to QDev wiki

{{Infobox tool
|image = Tools_Micromanipulator.jpg
|toolfullname = Micromanipulator
|company = Leica/Zaber/Eppendorf
|description = Optical microscope + motorized stage + manipulator arm
|location = Basement, Elionix room 03.01.K03
|primary = Karolis
|secondary = Martin
}}

Micromanipulator is a setup meant for nanowire transfer from a source substrate to a target substrate.
This is done using a transfer arm that can move with sub-micrometer precision.
The substrates can be moved with a motorized stage in x, y, z, and rotated around the z axis.
The action can be observed through a microscope/camera.
== Usage rules ==
Do not place used probes back into the box. If you want to reuse a probe in the future, put it in your own box and clearly label the box. Unknown boxes will be disposed of.

Put used probes into the sharps bin. Do not close the sharps bin fully but leave a small gap to put probes.

Wipe all surfaces both before and after using the tool.
Nanowires can be [[Working with nanowires and nanotubes|very toxic]].
They are small enough to get into human cells and damage their DNA.
The length of the DNA molecule is ~5 um, and most nanowires used at this tool are small enough to damage this molecule.

III-V semiconductors that the nanowires can include can also be very toxic.
Take care of your own [[Safety|safety]] and also the safety of your colleagues.

Try your best not to crash the microscope objectives into the substrate or stage.
Let the [[About|staff]] know if this happens -- send a short message to [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].

== Usage guide ==
Most users have a specific use case for the manipulator.
Therefore this short guide should only act as a guideline.
There is no wrong way to use the tool!

The following instructions use the paradigm of fixing the focal plane and only changing the z position of the stage and the probe.
It is entirely a matter of preference as it can be equally efficient to constantly change the focal plane to e.g. follow the probe movements.

=== Prepare for work ===
# Put on gloves and wipe down all surfaces that you might touch: handrest, joysticks, stage, knobs.
# Make sure the PC is working and the LAS software is running. If not, reboot and launch the software.
# On the stage joystick: <code>Long press 1</code> to home all axes.
# Make sure the stage is at the lowest vertical position and then move it up at least two steps.
# Place your source and target chips on the stage.
# Turn on the light: only the green button on the right.
# Increase the light intensity: turn the knob clockwise. The more light, the faster the camera can produce visible images.
=== Find the target and source locations ===
# Use the knobs on the linear drives to quickly position the target chip under the microscope light.
# Use the joystick to find the target location for the transfer. Place it in the center of the field of view.
# Adjust the working distance of the microscope using the knob on the right.
# Change to a higher magnification objective. Only touch the big ridged ring and not the objectives themselves. Adjust focus again. Repeat until the image is in focus with the highest magnification.
# <code>Long press 5</code> to save the stage position. This is the ''target position''. To prevent accidents caused by unintended button presses, save it to 3 & 4 as well.
# '''Do not touch the microscope focus from this point on.''' All further movements assume we know where the focal plane is at all times.
# Repeat the procedure for the source chip. Instead of moving the microscope focus, move the stage vertically. You can do this by twisting the joystick.
# <code>Long press 3</code> to save the stage position. This is the ''source position''.
# <code>Short press 5</code> to verify the target position. Adjust z if needed and save again. The stage repeatability in z is not exact, so there might be small inaccuracies.
# <code>Short press 3</code> to verify the source position. Adjust z if needed and save again.
=== Get the probe ready ===
# <code>Short press 5</code> to return to the target position.
# Swing the transfer arm out and take out the probe holder.
# Place a desired probe in the probe holder. The visible shank length should be comparable to the wire.
# Adjust the probe holder to the desired angle.
# Set the probe controller to <code>coarse</code>.
# While watching the probe wire, carefully swing the arm back in. The wire should not touch the substrate. The arm/probe should not touch the objective. Move the arm with the controller if needed.
# Change to the lowest magnification.
# Use the controller to move the wire in the xy plane until you can see it in the field of view.
# Move it down until the tip starts to move into focus. Then change to higher magnification and <code>fine</code> movement speed.
# Change to <code>x-fine</code> and repeat the process until you are at the highest magnification and the probe is nearly touching the surface.
# Lightly touch the surface with the probe.
# Look at the controller and move '''up''' 30 um.
# <code>Long press Pos 1</code> to save the probe position. This is the ''probe approach position''.
# Move up 300 um more (or more if you have a large difference in substrate thicknesses). <code>Long press Pos 2</code> to save the probe position. This is the ''transfer position''. Save it to <code>Pos 3</code> as well, just in case.
=== Ready ===
# Now you are ready to transfer!
#* <code>Short press 3</code> moves the stage to ''source position''.
#* <code>Short press 5</code> moves the stage to ''target position''.
#* <code>Short press Pos 1</code> lowers the probe to ''approach position''.
#* <code>Short press Pos 2</code> raises the probe to ''transfer position''.
=== Done ===
When you are done transferring:
# <code>Short press Pos 2</code> to raise the probe and swing out the arm.
# Take out the probe and put it in the yellow sharps bin.
# <code>Long press 1</code> to home the stage and take your substrates.
# Log your work and any issues you noticed. Notify the staff if there's anything wrong with the setup or you're using probes from the last silver pouch.
# Wipe down all surfaces that you might have touched: handrest, joysticks, stage, knobs.
# Done!

== Instrumentation ==
=== Manipulator arm ===
[[File:Micromanipulator_Transferman_4r_controller.jpg|thumb|Transferman 4r controller]]
* Eppendorf TransferMan 4r system
* or a custom manual arm

Regardless of which arm is used, there are markings on the optical table denoting where it should be fixed.

The Transferman 4r offers 3 programmable positions and 3 programmable movement speeds.
You should be very careful and only use the two faster movement speeds at low microscope magnification, and only when far away from the substrate vertically.
Be conservative with selecting the saved positions, since crashing the probe into the substrate can ruin your work very easily.
Both short instructions and full operating manual can be found [https://www.eppendorf.com/dk-en/eShop-Products/Cell-Manipulation/Micromanipulation/TransferMan-4r-p-PF-26484 online].

The optimal angle for the probe depends on the nanowire stiffness, substrate geometry and substrate surface properties.
A good starting point is 15°.
=== Stage ===
[[File:Micromanipulator_stage_joystick.jpg|thumb|Zaber stage joystick]]
The stage is a stack of Zaber motion modules:
{| class="wikitable"
|-
|[https://www.zaber.com/Manuals/X-JOY3 X-JOY3]
|Programmable 3-axis joystick
|-
|[https://www.zaber.com/Manuals/X-LSM X-LSM100A] x2
|2 linear stages, <3 um repeatability
|-
|[https://www.zaber.com/Manuals/X-RSW-E X-RSW60C-E03]
|Motorized rotary stage
|-
|[https://www.zaber.com/manuals/X-VSR X-VSR20A]
|Vertical lift stage, <1 um repeatability
|-
|}
The modules can be moved directly using the knobs on each module.
For the x/y stages the knobs increase/decrease velocity, single press decelerates, double press instantly stops.
Rotation/z stages are moved one step per knob position.

The joystick should have these functions:
{| class="wikitable"
! Key || Short Press || Long Press
|-
| 1 || Stop all axes || Home all axes
|-
| 2 || Send alerts* 1, 2 || Send alerts* 1, 3, 4
|-
| 3 || Move to saved position || Save current position
|-
| 4 || Move to saved position || Save current position
|-
| 5 || Move to saved position || Save current position
|-
| 6 || Axis x low speed || Axis x high speed
|-
| 7 || Axis y low speed || Axis y high speed
|-
| 8 || Rotation low speed || Rotation high speed
|-
|}
The joystick functions can be changed through the ''[https://www.zaber.com/software Zaber console] - 1'' software.

=== Microscope ===
This is currently a Leica DM2500 MH microscope body, Leica [https://www.leica-microsystems.com/products/microscope-cameras/p/leica-mc170-hd/downloads/ MC170 HD] camera and Leica acquisition software setup.

The field of view/depth of field/resolution of this setup is somewhat limited, but should be good enough for most users.

In fact, short depth of field lets you judge the relative vertical position between the probe and the substrate.

=== Probes ===
[[File:72X_dim.png|thumb|Probe dimensions in inches]]
Also known as needles.
These are thin tungsten wire on a thicker nickel shank.
We use 72X-G2/01 (0.1 um tip radius) and 72X-G2/025 (0.25 um) from [https://www.americanprobe.com/72x-tungsten-wire-3-mil-probe.html American Probe].
The taper model can be found in this handy chart: [[Media:American-Probe-taper-model.pdf|.pdf]].

== Troubleshooting ==
; I can't get any light through the microscope!
<gallery>
File:Micromanipulator_lamp_off.jpg|Lamp turned off
File:Micromanipulator_lamp_on.jpg|Lamp turned on. Notice that the left button remains in the same position.
</gallery>
: Someone probably switched the light source to back lighting. The microscope does not support this. Simply flip the up-down arrow button on the light source. Double check that the green power button is lit, and the knob is not at the minimum position.
; The camera output is completely frozen!
: Turn on live capture mode.
; I would like to save an image of what I see but I don't know how!
: Press ''Acquire image'' in the bottom left of the Leica software window.
; Everything on the PC is frozen, I can't move the mouse cursor!
: The PC has crashed. Find the power button on the PC under the optical table and hold it for several seconds until the PC restarts.
; The image is very strange!
: Maybe someone crashed the lens into the stage and did not tell anyone. Move the stage and the manipulator out of the way, carefully unscrew the questionable objective, blow away any dust with the nitrogen gun, and very gently wipe the lens with mild solvent. Original cleaning instructions from the manufacturer can be found [https://www.leica-microsystems.com/products/light-microscopes/p/leica-dm2500-mh/downloads/ online].
; The image on the screen updates only every few seconds!
: The automatic exposure function in the software collects enough light to see a good signal. Try to increase the light intensity by turning the knob on the power supply clockwise.
; The image is too bright/dark!
: There are two options:
<gallery>
File:Micromanipulator_auto_exposure.png|Auto exposure
</gallery>
:# The automatic exposure fuction in the software is turned off. The iris button in the top left of the Leica Acquisition Suite window should be red: ''Acquire > Camera > Automatic exposure''.
:# If it is already active and at the exposure limit, try adjusting the light intensity.

== Ordering probes & service ==

This information is on the [https://wiki.nbi.ku.dk/qdevwiki/Micromanipulator internal QDev wiki].

[[Category:Tools]]

AJA systems

2022-04-26T09:34:23Z

Karolis: /* Troubleshooting */ added link to default software configurations

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Karolis
|secondary = Martin
}}
<del>For the tools' maintenance log, click [[AJA Systems maintenance log|here]].</del>

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two DC sputtering targets, <del>heater in sample mount</del> and Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside.
* System 2: One regular DC sputtering target, one DC sputtering target with adjustable working distance, one RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling. Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.
Oxidation chamber on the loadlock.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2022 March 11):

{|
|-
|
{| class="wikitable"
|-
! AJA1
! Material
! Liner
|-
| 1
| Si
| FabMate
|-
| 2
| Cr
| intermetallic
|-
| 3
| Au2 (40 g)
| W
|-
| 4
| Au1 (80 g)
| W
|-
| 5
| Al1
| intermetallic
|-
| 6
| Ti
| FabMate
|-
| DC1
| W
| --
|-
| DC2
| NbTi
| --
|-
|}
|

|
{| class="wikitable"
|-
! AJA2
! Material
! Liner
|-
| 1
| Au
| W
|-
| 2
| V
| FabMate
|-
| 3
| Ti
| FabMate
|-
| 4
| Al
| intermetallic
|-
| 5
| Ge
| FabMate
|-
| 6
| Pt
| FabMate
|-
| DC1
| ReMo
| --
|-
| RF2
| NbTi
| --
|-
|}
|-
|}

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10-8 Torr and 6x10-8 Torr after pumping for 24 hours on main chamber, respectively.

== '''Step by step guide''' ==

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

===Loading your sample===
* Check the cryo-pump monitor. It should be between 12-17 K. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is 1500 Hz. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is <1x10-7 Torr. '''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is closed.
* Push down the 'Load Lock' switch in order to vent the load lock.
* Once the load lock pressure reaches ~760 Torr, the load lock lid pops out a bit and can be rotated freely.
** Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
* Rotate the lid until the permanent markers meet and twist the lid out, pivoting about the two permanent marks on the left.
** The permanent marks indicate the position of spring loaded ball bearing that hold the lid in place, preventing it from falling out.
** Ideally, you want rotate the lid so as to pivot against two bearings.
* Place the load lock lid, handle up, on the three rubber bumps.
* Remove the sample holder. It's held in place by three pins that lock into a groove.
* <del>Examine the sample holder. There are three small pins. These pins, via a similar mechanism lock onto the stage inside the main chamber.</del>
* Grab a fresh cleanroom wipe, place the sample holder on the wipe.
* Load your chip either using the mechanical clamps or the double sided Kapton tape.
* Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid and flick the 'load lock' switch up to pump out.
* Wait until the chamber pressure goes down to 3x10-6 Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
* Open the gate valve between the main chamber and the load lock.
* Load your sample. <del>The mechanism which locks the sample holder on to the stage in the main chamber, also simultaneously unlocks it from the loading arm.</del>
** AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
** AJA2: Screw in the sample holder into the stage.
** Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
* Close the load lock valve.
** Check main chamber vacuum.
** Check cryo pump temperature.

===Evaporating metal===
* Rotate the stage to face the crucible liners.
* Choose the material on the linear crucible drive as well as on the deposition controller.
* Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
** This exposes the metal to be evaporated.
** If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!
* Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
* Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
** Be very sure that you have opened the e-beam shutter.
* Two clicks of the knob and the current set point is set to 4 mA (AJA2) or 5 mA (AJA1).
** Wait until the current increases to this value.
* Can you see the bright spot where the beam hits the metal in the crucible?
** Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
* Now, consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
* Ramp the current up at about 20 mA/min to half the value (1 click/10 seconds). Let it sit at that value for 2 mins while the metal soaks and thermally equilibriates.
** Too fast and you'll crack the crucible liner
** or your evaporated metal film will be rough.
* 1 Å/s is a good rate for metal film evaporation. Try and stay around this value. 2 Å/s for gold is okay.
* When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
** The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronizing the zero with the shutter opening.
* Wait until the right thickness is evaporated.
* Close the substrate shutter.
* Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds). Don't be too quick about it. We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
* Turn off high voltage.
* Wait 2-3 mins for the metal to cool down before moving over to the next metal. The metal inside the crucible should stop glowing.
* If you're done, turn off the Carrera voltage supply.
* Close the e-beam shutter if the metal is no longer red hot.

===Unloading your sample===
* Rotate the sample to the correct position (same orientation as during the loading procedure).
* Open the load lock gate valve, and unload your sample.
* Close the load lock valve.
* Vent the load lock using the load lock switch on the main rack.
* As before, wait till the load lock reaches ~760 Torr and pops out a bit.
* Twist and pull the lid out if the permanent marks are lined up.
* Rest the lid on rubber knobs, handle up.
* Fresh cleanroom wipe!
* Get the sample cassette out, unload your sample.
** If you used double sided tape, wipe off the residue with IPA or ethanol.
* Put the sample cassette back and pump out the load lock.
* Fill out the Excel log file.
* Clean up after yourself. If the work station is found untidy, the last user will be held accountable.

===Using the Kaufman ion source (ion milling)===
* Load your sample via the load lock following the procedure detailed above.
* Rotate the sample to face the ion milling gun.
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ program is running. If not, start it up.
** The password: apex
* Set the adaptive pressure controller to 'Remote'.
** It's a 3 sec long press.
* In the program, click on the ion gas button. It should turn green. This diverts the Ar gas flow to the gun.
* Turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* Select 'Pressure' button and enter a value:
** Again, the Excel log files should guide you in selecting an appropriate value. Typically, a flow of 6 sccm and a pressure of 0.6 mbar works nicely.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the PhaseIIJ program.
* Turn on the Kaufman ion source controller power supply.
* Set the power supply to remote mode.

* On the PC at the prep table there are several shortcuts to scripts.
# Execute the relevant beam voltage script (100 V or 300 V). Confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.

* Go back to the laptop.
* Click on the small 'output' button to turn on the gun.
** This fires the Ar ions. The ion source shutter still protects your sample.
* Wait for the indicator to turn purple.
* Start your timer and open the shutter with the big 'shutter' button.
* You are now milling.

* To turn off the Kaufman ion source click the green output button. It should turn red.
* Wait 2 mins for the gun to cool down. Do NOT turn off the Ar yet.
* In the pressure control section of the PhaseIIJ software click 'Open' to completely open the cryo gate valve and pump the Ar out.
* Turn off the Ar gas flow.
* Turn off the Kaufman source controller.
* Set the adaptive pressure controller to local.
* Turn on the ion gauge (pressure sensor).
* Proceed with evaporating metal or unloading your sample following the guidelines.

===Sputtering metals===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
* info: In the program, turn on the Ar flow and set the 'STPT' (set point) to an appropriate value.
** Look at the Excel log files to select a relevant set of values for the flow. The flow roughly sets the base Ar pressure in the chamber.
* info: Finer control over the Ar pressure in the chamber is achieved by selecting 'Pressure' button and entering a value.
** Again, the Excel log files should guide you in selecting an appropriate value.
** The program floors the entered value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
* info: A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.
* Rotate the sample to face downwards.
** The sputter sources are angled a bit and 10-20 degree might give you a more head on sputtering.
* Power up the relevant sputtering source power unit.

====Auto====
* Click Run process
* Scroll down to and select your desired sputtering recipe
* Run

====Manual====
* Striking the plasma:
** Open the substrate shutter. The sputter sources have individual shutters.
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
** Set the RF2 (sputtering target) stpt to 50 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating and will break the sputter housing.
** Close the viewport shutter, since they will get covered with the sputtered film.
** Once the desired set point is reached, open the sputter shutter and start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 50 W.
** Once the system ramps down to 50 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open' in the software.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!

====After either Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Carry on with other steps such as metallization, unloading, etc as outlined above.

===Substrate sputtering (RF)===
* Load your sample via the load lock following the procedure detailed above
* Turn off the ion gauge (pressure gauge).
* On the laptop, make sure the PhaseIIJ programs is running.
** If not start it up. The password:apex
* Set the adaptive pressure controller to 'Remote'
** It's a 3 sec long press.
* Rotate the sample to face downwards.
* Power up the relevant sputtering source power unit.
====Auto====
* Select run process
* Scroll down to the desired program
* Run
====Manual====
* Striking the plasma:
** Set the Ar flow to 80 sccm and pressure to 30 mTorr.
<div class="toccolours">
Info:

A PID controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display look at the 'SP' and the 'P1'. These should match the value that you want and keyed into the phaseIIJ program.

The program floors the entered pressure set point value to a single digit precision. 0.61 will become 0.6. 0.6 sometimes becomes 0.5. I just live with this minor annoyance.
</div>
* Striking the plasma (contd.):
** Set the RF1 stpt to 25 W and turn on the output.
** Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
** Check that the plasma is visible (a faint purple blueish hue inside the main chamber).
** There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.
* Ramping: Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
** Max set pt is 50 W
** Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
** Close the viewport shutter.
** Once the desired set point is reached start the timer.
* Ramping down:
** Enter the ramp down time and THEN the set point of 25 W.
** Once the system ramps down to 25 W, turn off the output.
* Open the adaptive pressure controller by clicking on 'Open'.
** This opens up the cryo valve to max.
* Turn off the Ar gas flow.

====After Auto or Manual====
* Set the adaptive pressure controller to local
* Turn on the ion gauge
* Turn off the RF power source
* Carry on with other steps such as metalization, unloading, etc as outlined above.

=== Oxidation in loadlock ===

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.148 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.

== Older ion milling notes ==
When operating normally, the chamber should light a clear whiteish hue, and the kaufman power source should read numbers similar to these:
[[Image: Milling_STDPROC.png|thumb|center|600px|Approximate standard values on power supply when running the milling]] 

====Miscellaneous notes / values for milling ====
Please update this list with good tips / mill rates for materials:
* The approximate mill rate for '''InSb heterostructure is 15 nm/min'''. It is advised to tilt the sample to 30 degrees and use 30 speed on the rotating engine. This gives a cleaner and more smooth surface.

* '''Photolith AZ1505''' millrate is approximately '''15nm/min''' (at angle 30 degrees).

== '''Troubleshooting''' ==

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for RF milling?
:* RF cable not connected tightly
:*: Abort process, turn off RF milling power supply, reconnect cable
:* Someone touched the matching network.
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters from OneNote or the [[AJA_systems#Special_notes|special notes]].
:: user: apex

== Maintenance ==

=== Standard maintenance ===

# Log cryo temp, base pressure.
# Close cryo gate valve.
# Turn off ion gauge.
# Open loadlock gate valve.
# Turn off loadlock turbo.
#: While venting:
#* Unscrew right port with the linear crucible drive using two 9/16" wrenches.
#* Unscrew lid if you intend to open it.
#* Above 1e0 Torr loadlock pressure slowly open the vent nitrogen needle valve in front of the chamber.
# At atmosphere: start stopwatch.
# Pull out right port, open e-beam shutter.
# For each crucible:
#* Wipe target metal surface with wipe
#* Weigh with digital scale
#** W crucible weighs ~120 g
#** Intermetallic crucible ~20 g
#** FabMate crucible ~12 g
#** Gold pellets <80 g, 40-45 g for half
#** Al pellets 6-7 g
#** Top up target material if needed, log amount.
# If Sensor Life < 70% change the QCM. You can do this by sticking your hand through the loadlock. Be careful not to touch the mirror.
#* AJA1: gold plated 6 MHz. There are two. Sensor 2 is towards the end of the assembly. It is a bit tricky to get out, even with the sensor shutter open.
#* AJA2: silver plated 6 MHz (doesn't fail immediately during Pt evaporation)
# Push the linear drive back inside, screw the nuts back on the bolts
# Check if you can see the crucible in the mirror. If not:
## Attach chain to only one lid hook. Pull with ceiling motor for 20 mins
## Once the lid is open then lower the lid and lift with all three hooks
## Check if the quarter silicon wafer has started to delaminate. If so, peel off and reuse if possible. If it is not reflective enough, replace with clean quarter wafer.
## Adjust the clamp holding the mirror so that you can see the crucible through the port with LED light.
## Close lid, do not tighten screws/nuts
# Start pumping, log time at atmosphere, tighten the nuts on the crucible linear drive
# Close vent needle valve (not too tight!)
# If loadlock pressure goes below 1e-1 Torr, there are no obvious leaks
# After 30-60 mins check pressure. If <1e-4 Torr, turn on ion gauge
# Open cryo gate valve at own discretion. Turbo helps pumping down to ~1e-6 Torr. At lower pressures loadlock gate valve should be closed and only cryo should be open to the main chamber.
# Write a message to the users!

=== Cryo pump regeneration ===

# Close cryo gate valve. Turbo is pumping the main chamber
# Turn off cryo (on the wall behind the tool)
# Open nitrogen vent valve on the back left of the cryo
# Let warm to max T (~285 K), takes ~1 hour
# Close nitrogen vent valve
# Close backing pump to cryo (screw valve under the loadlock turbo)
#* Might need to crack open the valve a bit. Setting turbo controller <code>012: EnableVent: off</code> doesn't help.
# Open backing to cryo (screw valve next to cryo)
# Wait 20 mins to rough pump cryo
# Open roughing to turbo
# Turn on cryo
# Wait ~60 mins to get between 200-150 K
# Close roughing to cryo
# Wait until min T. Must be below 20 K (2-3 hours at 2 K/min)
#: If does not go down below 20 K, replace cryo with spare unit. Return cryo for repair/refurb to Edwards Vacuum. Contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki]
# Close loadlock
# Open cryo gate valve

=== Special notes ===
The standard Phase II J software onfigurations on the systems are:



'''AJA1'''
[[Image:Aja1setup.jpg|600px|standard config AJA1]]

'''AJA2'''
[[Image:Aja2setup.jpg|600px|standard config AJA2]]

* If you are unable to ignite the plasma (either DC, RF or ion plasma) start by checking for shorts between pins on the powersupply input on the sputtering arm / ion source.

==Service/repair/purchasing==
More notes and service/repair/purchasing contacts on the [https://wiki.nbi.ku.dk/qdevwiki/AJA_Systems internal QDev wiki].

[[Category:Tools]]
[[Category:Deposition]]