cleanroom - User contributions [en-gb]

Cambridge ALD

2026-07-08T11:43:17Z

Harry:

{{Infobox tool
|image = Tool ALD.jpg
|toolfullname = Savannah S100 (gen. 1)
|website = http://www.cambridgenanotechald.com/products/Savannah-ald-system.shtml
|company = Cambridge NanoTech (Veeco)
|description = Atomic layer deposition system
|location = Cleanroom 1 (03.2.209A)<br />Cleanroom 2 (03.2.203B)
|primary = Harry
|secondary = Martin
}}

''Page last updated: 15 Jun 2026''

Two nearly identical Savannah S100-like systems are used for [[atomic layer deposition]] of '''aluminum''', '''hafnium''', '''titanium''', '''zirconium'''.

Other material deposition alternatives at the [[Main Page|NBI cleanroom]]:
* [[AJA systems]] for sputtering/e-gun evaporation
* [[E-Gun evaporator]]
* [[Edwards evaporator|Edwards thermal evaporator]]
* [[Leica sputter coater]]
* [[MBE|Molecular beam epitaxy system]]

== Available processes ==

{| class="wikitable"
|-
! Deposited material !! Precursor !! ALD1 !! ALD2 !! Ref.
|-
| Hafnium oxide (HfOx, HfO<sub>2</sub>)
| <div class="toccolours mw-collapsible mw-collapsed width:400px" style="width:300px"> TDMAH <div class="mw-collapsible-content">tetrakis(dimethylamino)hafnium <br/> [(CH<sub>3</sub>)<sub>2</sub>N]<sub>4</sub>Hf <br/> [[File:TDMAH.png|246px]]</div></div>
|style="background-color: #c6e0b4" | Yes || style="background-color: #c6e0b4" | Yes || [https://doi.org/10.1016/j.tsf.2005.05.050]
|-
| Aluminum oxide (AlOx, Al<sub>2</sub>O<sub>3</sub>)
| <div class="toccolours mw-collapsible mw-collapsed" style="width:300px> TMA <div class="mw-collapsible-content">trimethylaluminum <br/> (CH<sub>3</sub>)<sub>3</sub>Al <br/> [[File:TMA.png|290px]]</div></div>
|style="background-color: #c6e0b4" | Yes || style="background-color: #c6e0b4" | Yes || [https://doi.org/10.1134/1.1626763]
|-
| Titanium oxide (TiOx, TiO<sub>2</sub>) || <div class="toccolours mw-collapsible mw-collapsed" style="width:300px> TTIP <div class="mw-collapsible-content">Titanium(IV) isopropoxide <br/>
Ti[OCH(CH<sub>3</sub>)<sub>2</sub>]<sub>4</sub><br/> [[File:TTIP.png|290px]]</div></div>
|style="background-color: #c6e0b4" | Yes || style="background-color: #e0b4c6" | No || [https://pubs.acs.org/doi/full/10.1021/acs.jpcc.5b10529]
|-
| Zirconium oxide (ZrOx, ZrO<sub>2</sub>) || <div class="toccolours mw-collapsible mw-collapsed" style="width:300px> TDMAZ <div class="mw-collapsible-content">Tetrakis(dimethylamido)zirconium(IV) <br/>
[(CH<sub>3</sub>)<sub>2</sub>N]<sub>4</sub>Zr<br/> [[File:CH32N4Zr.png|290px]]</div></div>
|style="background-color: #e0b4c6" | No || style="background-color: #c6e0b4" | Yes || [https://www.osti.gov/servlets/purl/1763732]
|}

== Videos on operating the tools ==
Video on how to operate ALD 1:

[[File:ALD1.mp4|500px]]

* [https://youtu.be/Do91YRRgI34 Click here to watch the video on YouTube]

Video on how to operate ALD 2:

[[File:ALD2.mp4|500px]]

* [https://www.youtube.com/watch?v=GmNEbyMNC4A Click here to watch the video on YouTube]

== Standard Operating Procedure ==
===ALD1===
<div style="background-color: #c0c0c0; border: 1px solid #00000; padding: 10px; border-radius: 5px;">
====Loading====
# Log your process in the Excel notebook.
# Check the nitrogen bottle: ''The indicators should be close to the designated values. If line pressure is ~0bar, contact the cleanroom staff.''
# Make sure the valves of '''all''' precursors inside the ALD tool are closed.
# Run recipe '''0_default_setup''' to pump out any residual gas in the gas lines.
# Press the round '''VENT''' button.
# Open the metal lid.
# Put your sample inside, roughly in the center, away from the gas inlet and outlet.
#: Check whether the rubber O-ring is properly seated.
# Close the metal lid. Check that the lid is aligned to sit directly on top of the reactor chamber.
# Press the round '''PUMP''' button.
# Place the metal cage on top of the tool.
# Open the H<sub>2</sub>0 valve.
# Open relevant precursor valve.
# Run your recipe.
====Unloading====
# Close precursor valves.
# Press the round '''VENT''' button.
# Place the metal cage on the side of the tool.
# Take out your sample. Check the rubber o-ring.
# Press the round '''PUMP''' button.
# Run recipe '''0_default_setup'''.
# Leave the system in the appropriate state.
</div>

===ALD2===
<div style="background-color: #c0c0c0; border: 1px solid #00000; padding: 10px; border-radius: 5px;">
====Loading====
# Log your process in the Excel notebook.
# Check the nitrogen bottle: ''The indicators should be close to the designated values. If line pressure is ~0bar, contact the cleanroom staff.''
# Make sure the valves of '''all''' precursors inside the ALD tool are closed.
# Run recipe '''0_default_setup.txt''' to pump out any residual gas in the gas lines.
# Press the '''VENT REACTOR''' button.
# Open the metal lid.
# Put your sample inside, roughly in the center, away from the gas inlet and outlet.
#: Check whether the rubber O-ring is properly seated.
# Close the metal lid. Check that the lid is aligned to sit directly on top of the reactor chamber.
# Press the '''STOP VENTING''' button.
# Press the '''PUMP REACTOR''' button.
# Place the metal cage on top of the tool.
# Open relevant precursor valve.
# H<sub>2</sub>O is always open.
# Run your recipe.
====Unloading====
# Close precursor valve.
# Press the '''VENT REACTOR''' button.
# Place the metal cage on the wall.
# Take out your sample. Check the rubber o-ring.
# Press the '''STOP VENTING''' button.
# Press the '''PUMP REACTOR''' button.
# Run recipe '''0_default_setup.txt'''.
# Leave the system in the appropriate state.
</div>

== Growth per cycle (GPC) monitoring ==
<gallery mode="packed" widths=500 heights=200>
Image:ALD1.png|ALD1 HfOx
Image:ALD1AlOx.png|ALD1 AlOx
Image:ALD2.png|ALD2 HfOx
</gallery>

==Recommended heater temperatures==
These are the recommended temperatures from the [https://wiki.nbi.ku.dk/w/cleanroom/images/3/3e/Savannah_User_Manual.pdf manual]:
===ALD1 heaters===
{| class="wikitable"
|-
| '''Heaters for the trap (#6)''' || 150°C
|-
| '''Stop valve (#7)''' || 150°C
|-
| '''ALD valve oven (#10)''' || 150°C
|-
| '''Precursor Manifold''' || 150°C
|-
| '''Reactor heaters (#8 and #9) standard''' || 110°C
|-
| '''Reactor heaters (#8 and #9) range''' || 100-200°C
|-
|}

===ALD2 heaters===
{| class="wikitable"
|-
| '''Heaters for the trap (#6)''' || 150°C
|-
| '''Stop valve (#7)''' || 150°C
|-
| '''Precursor Manifold (#10)''' || 150°C
|-
| '''TDMAH and TDMAZ precursor heaters (#12 and #13)''' || 75°C
|-
| '''Reactor heaters (#8 and #9) standard''' || 110°C
|-
| '''Reactor heaters (#8 and #9) range''' || 100-200°C
|-
|}

==Vacuum status==
===ALD1===
''Tested 16 Jun 2026''
{| class="wikitable"
|-
! N<sub>2</sub> (sccm) !! Pressure (Torr)
|-
| 0|| 0.029
|-
| 5 || 0.068
|-
| 20 || 0.135
|-
| 90 || 0.313
|-
|}
===ALD2===
''Tested 16 Jun 2026''
{| class="wikitable"
|-
! N<sub>2</sub> (sccm) !! Pressure (Torr)
|-
| 0|| 0.029
|-
| 5 || 0.068
|-
| 20 || 0.135
|-
| 90 || 0.313
|-
|}

== Witness samples ==
In CR1 and CR2, you can find various witness samples depending on the properties that you would like to explore:
* Only thickness: Si (001) 1 inch wafers
* Thickness and breakdown voltage: Si (001) 15x15 mm2 back-side Au plated
It is recommended to ash the witness chips for 2 mins before loading them in the ALD tool.

== File logs ==

* Recipe file location
*: ''ALD1'': ''C:\Savannah\Users\Standard\''
*: ''ALD2'': ''C:\Cambridge Nanotech\Recipes\''
* Log file location
*: ''ALD1'': ''C:\ALD data''. Includes pressure data, screenshot at termination.
*: ''ALD2'': ''C:\Cambridge Nanotech\Log\''. Includes pressure and heater temperature data, screenshot at termination, software event logs.

== Troubleshooting ==

; Pressure reading obviously wrong (above 1e3 Torr or below 1e-4 Torr):
: Pressure gauge failure. Unplug the network cable from the small square pressure gauge beneath the chamber and plug it back in. The pressure reading should return to expected values.
; No peak visible during precursor pulse:
:* Precursor valves closed. Make sure the relevant precursor valves are open. Consult the labels on the inside of the door.
:* Pulse time too short. Select the lowest plotting interval and check whether you can spot a small peak when the automatic valve opens. Increase pulse time as needed.
; Cannot open lid upon venting:
:* Chamber pressure still below atmosphere. Confirm pressure reading in software. If pressure is below 5e2 Torr, check whether the nitrogen bottle valve is open.
:* Rubber O-ring can get stuck to the lid. Gently but firmly lift the lid. Reseat the O-ring if needed.
; What is the best plot time to graph the process pressure?
: It is recommended to plot only several pulses, for example 30 seconds or 1 minute total plot time. Setting this value to 1 hour during a run can reduce delay precision, because with a 1 hour plot time many data points need to be refreshed, which consumes a lot of processing resources. It is possible to set the plot time to 1 hour to get an overview of pulse heights, but plot times > 5 minutes are not recommended during a run. <ref>Savannah Maintenance Manual</ref>

[[Category:Tools]]
[[Category:Deposition]]

==References==

Training

2026-07-08T08:18:38Z

Harry: /* Shadowing requirements */

Before submitting a training request, please review the prerequisites for each instrument listed below.

'''Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form''' ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through [http://cleanroom.brickhost.com/ Cleanroom Booking System].

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity ('''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General (Safety) Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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<div class="mw-collapsible-content">
* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
</div>
</div>

== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
</div>
</div>

== Lithography ==
'''Request Training for Lithography Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
</div>
</div>

=== Elionix F-125 (125 kV at QuanTech) ===
More information will be provided shortly.
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</div>
</div>

=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
</div>
</div>

== Characterization ==
'''Request Training for Characterization Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== JEOL 7800F Prime SEM ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective.
* Users are required to have prior experience with TEM/STEM before being considered for training.
* Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

=== Woollam alpha-SE Ellipsometer ===
More information will be provided shortly.
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=== Filmetrics reflectometer ===
More information will be provided shortly.
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool for aluminium e-beam evaporation for Josephson junction fabrication.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify the process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
====Shadowing requirements====
Most likely, you will use this tool to make Manhattan-type junctions: '''You are required to draw a schematic with the evaporation angles with respect to your chip design'''. Please show this to the instructor once you have planned the first training.

The best time to do that is during the shadowing session! Your experienced colleague can explain to you the geometry of the evaporation and based on your chip design, you can create together an appropriate recipe and schematics

During the shadowing session, you are expected to '''actively participate in the process''':
* Understand the risks of the tool
* Ask questions
* Keep notes
* Have some hands-on experience (help with loading, make a new recipe, use the GUI, etc)

==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
</div>
</div>

=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

==== Before the training session ====
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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</div>

=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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</div>

=== Manual bonder ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety
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== Miscellaneous ==

=== Micromanipulator ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety and verify that the user is aware of the dangers of working with nanoparticles.
==== Before you start your training sessions====
* You need to carefully read and familiarise yourself with the risks of exposure while [[Working with nanowires and nanotubes]]
</div>
</div>

[[Category:Tools]]

Training

2026-07-07T08:55:50Z

Harry: /* Plassys Evaporator */

Before submitting a training request, please review the prerequisites for each instrument listed below.

'''Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form''' ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through [http://cleanroom.brickhost.com/ Cleanroom Booking System].

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity ('''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General (Safety) Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
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== Lithography ==
'''Request Training for Lithography Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
More information will be provided shortly.
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==
'''Request Training for Characterization Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective.
* Users are required to have prior experience with TEM/STEM before being considered for training.
* Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
More information will be provided shortly.
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=== Filmetrics reflectometer ===
More information will be provided shortly.
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool for aluminium e-beam evaporation for Josephson junction fabrication.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify the process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
====Shadowing requirements====
Most likely, you will use this tool to make Manhattan-type junctions.

'''You are required to draw a schematic with the evaporation angles with respect to your chip design'''.

The best time to do that is during the shadowing session! Your experienced colleague can explain to you the geometry of the evaporation and based on your chip design, you can create together an appropriate recipe and schematics

==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

==== Before the training session ====
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
</div>
</div>

=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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</div>

== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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</div>

=== Manual bonder ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety
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== Miscellaneous ==

=== Micromanipulator ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety and verify that the user is aware of the dangers of working with nanoparticles.
==== Before you start your training sessions====
* You need to carefully read and familiarise yourself with the risks of exposure while [[Working with nanowires and nanotubes]]
</div>
</div>

[[Category:Tools]]

Training

2026-06-30T15:09:04Z

Harry:

Before submitting a training request, please review the prerequisites for each instrument listed below.

'''Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form''' ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through [http://cleanroom.brickhost.com/ Cleanroom Booking System].

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity ('''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General (Safety) Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
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== Lithography ==
'''Request Training for Lithography Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
More information will be provided shortly.
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==
'''Request Training for Characterization Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective.
* Users are required to have prior experience with TEM/STEM before being considered for training.
* Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
More information will be provided shortly.
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=== Filmetrics reflectometer ===
More information will be provided shortly.
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

==== Before the training session ====
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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</div>

=== Manual bonder ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety
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== Miscellaneous ==

=== Micromanipulator ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety and verify that the user is aware of the dangers of working with nanoparticles.
==== Before you start your training sessions====
* You need to carefully read and familiarise yourself with the risks of exposure while [[Working with nanowires and nanotubes]]
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</div>

[[Category:Tools]]

Training

2026-06-30T15:05:51Z

Harry: /* Plassys Evaporator */

Before submitting a training request, please review the prerequisites for each instrument listed below.

'''Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form''' ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through [http://cleanroom.brickhost.com/ Cleanroom Booking System].

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General (Safety) Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
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== Lithography ==
'''Request Training for Lithography Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
More information will be provided shortly.
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==
'''Request Training for Characterization Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective.
* Users are required to have prior experience with TEM/STEM before being considered for training.
* Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
More information will be provided shortly.
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=== Filmetrics reflectometer ===
More information will be provided shortly.
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

==== Before the training session ====
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== Manual bonder ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety
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== Miscellaneous ==

=== Micromanipulator ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety and verify that the user is aware of the dangers of working with nanoparticles.
==== Before you start your training sessions====
* You need to carefully read and familiarise yourself with the risks of exposure while [[Working with nanowires and nanotubes]]
</div>
</div>

[[Category:Tools]]

Training

2026-06-30T15:05:18Z

Harry: /* Before the training session */

Before submitting a training request, please review the prerequisites for each instrument listed below.

'''Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form''' ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through [http://cleanroom.brickhost.com/ Cleanroom Booking System].

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General (Safety) Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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</div>

== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
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</div>

== Lithography ==
'''Request Training for Lithography Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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</div>

=== Elionix F-125 (125 kV at QuanTech) ===
More information will be provided shortly.
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==
'''Request Training for Characterization Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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</div>

=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective.
* Users are required to have prior experience with TEM/STEM before being considered for training.
* Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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</div>

=== Woollam alpha-SE Ellipsometer ===
More information will be provided shortly.
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=== Filmetrics reflectometer ===
More information will be provided shortly.
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

==== Before the training session ====
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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</div>

=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== Manual bonder ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety
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== Miscellaneous ==

=== Micromanipulator ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety and verify that the user is aware of the dangers of working with nanoparticles.
==== Before you start your training sessions====
* You need to carefully read and familiarise yourself with the risks of exposure while [[Working with nanowires and nanotubes]]
</div>
</div>

[[Category:Tools]]

Training

2026-06-30T15:04:55Z

Harry: /* Before the training session */

Before submitting a training request, please review the prerequisites for each instrument listed below.

'''Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form''' ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through [http://cleanroom.brickhost.com/ Cleanroom Booking System].

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General (Safety) Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
</div>
</div>

== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
</div>
</div>

== Lithography ==
'''Request Training for Lithography Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
</div>
</div>

=== Elionix F-125 (125 kV at QuanTech) ===
More information will be provided shortly.
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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</div>

== Characterization ==
'''Request Training for Characterization Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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</div>

=== JEOL 7800F Prime SEM ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective.
* Users are required to have prior experience with TEM/STEM before being considered for training.
* Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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</div>

=== Woollam alpha-SE Ellipsometer ===
More information will be provided shortly.
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=== Filmetrics reflectometer ===
More information will be provided shortly.
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== Manual bonder ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety
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== Miscellaneous ==

=== Micromanipulator ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety and verify that the user is aware of the dangers of working with nanoparticles.
==== Before you start your training sessions====
* You need to carefully read and familiarise yourself with the risks of exposure while [[Working with nanowires and nanotubes]]
</div>
</div>

[[Category:Tools]]

Training

2026-06-30T15:04:24Z

Harry: /* Thin Film Deposition */

Before submitting a training request, please review the prerequisites for each instrument listed below.

'''Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form''' ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through [http://cleanroom.brickhost.com/ Cleanroom Booking System].

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General (Safety) Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
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== Lithography ==
'''Request Training for Lithography Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
</div>
</div>

=== Elionix F-125 (125 kV at QuanTech) ===
More information will be provided shortly.
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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</div>

== Characterization ==
'''Request Training for Characterization Tools via''' [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis.
* Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]).
* Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training.
* In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective.
* Users are required to have prior experience with TEM/STEM before being considered for training.
* Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
More information will be provided shortly.
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=== Filmetrics reflectometer ===
More information will be provided shortly.
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== Manual bonder ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety
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== Miscellaneous ==

=== Micromanipulator ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety and verify that the user is aware of the dangers of working with nanoparticles.
==== Before you start your training sessions====
* You need to carefully read and familiarise yourself with the risks of exposure while [[Working with nanowires and nanotubes]]
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[[Category:Tools]]

How to evaporate metals in AJA

2026-06-30T14:54:22Z

Harry: Created page with "=The genius remote= [https://e-beam.ferrotec.com/wp-content/uploads/sites/7/carrera_genius.pdf| The genius remote] is used to control the coils at the e-beam and manipulate the beam. There are two options: * '''Left joystick:''' controls the amplitude (''how much the beam oscillates'') * '''Right joystick:''' controls the beam position (''where the beam is located or where is the centre of the oscillation'') =Evaporation of metals= The following instructions are based..."

=The genius remote=

[https://e-beam.ferrotec.com/wp-content/uploads/sites/7/carrera_genius.pdf| The genius remote] is used to control the coils at the e-beam and manipulate the beam.

There are two options:
* '''Left joystick:''' controls the amplitude (''how much the beam oscillates'')
* '''Right joystick:''' controls the beam position (''where the beam is located or where is the centre of the oscillation'')

=Evaporation of metals=
The following instructions are based on the manufacturers ([https://www.lesker.com/newweb/deposition_materials/evaporation-process-notes.cfm | Lesker] and [https://thermionics.com/uhv-resources/ultra-high-vacuum-faq/ | Thermionics])

==Aluminium==
Directly copied from Thermionics website. Will be adjusted according to our SOPs

Aluminum (Al) is highly reactive when molten. Al will react with all liner materials. Al also getters Oxygen to form oxide layers if any oxygen is present during deposition. Aluminum Oxide (Al2O3) has a much higher melting point and vapor pressure when compared to Al (2,045C M.P., 1550C V.P. for Al2O3 compared to 660C M.P., 1,010 V.P. for Al). Further Al2O3 is an excellent insulator compared to Al which is a fairly good conductor. These properties make electron beam evaporation of Al more complicated than most metals. When evaporating Aluminum DO NOT SWEEP the beam! Sweeping the beam produces more heat closer to the liner / material interface. This will greatly speed up the reaction process. You can sweep to initially melt down the charge if needed (larger crucibles will require this- a 2.2cc typically will not). Place the beam as close to the center of the crucible as possible during evaporation. Slowly ramp power up and down. It should take 1-3 minutes to reach evaporation and after finishing the run, you should come back to a low power level (20-30 mA) and soak for 30-60 seconds to “cool down” the melt. This will reduce liner breakage from expansion.Do not overfill liner. Fill the liner 50%-70% (when melted). Aluminum will “climb” the walls of a liner and if it spills over and touches the water cooled crucible the liner will break. In larger sources you can use a liner inside a liner to eliminate this possibility. Overfilling a liner is the #1 cause of failure with AL.

==Gold==
Directly copied from Lekser website. Will be adjusted according to our SOPs

We recommend sweeping the e-beam and ramping power to fully melt the material before depositing films. Once melted, a focused e-beam can be used for the deposition process. With an evaporation temperature of ~1,400°C and a base pressure for evaporation of 10-6 Torr or lower, we anticipate the deposition rate to be 1-5 Angstroms per second.

==Platinum==
This section is currently blank and will be filled in the future

==Chromium==
This section is currently blank and will be filled in the future

==Silicon Oxide==
This section is currently blank and will be filled in the future

AJA systems

2026-06-30T14:41:15Z

Harry:

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Harry
|secondary = Martin
}}
''Page last updated: 22 Jun 2026''

There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

* Service notes and troubleshooting issues are all gathered in the dedicated [[AJA service]] page. Maintenance logs are collected in the Excel czar log page.

* Information on [[How to evaporate metals in AJA |how to evaporate metals in AJA]] based on their physical properties.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside. Oxidation chamber on the loadlock.
* System 2: One regular 2" DC sputtering target, one 3" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10<sup>-8</sup> Torr and 6x10<sup>-8</sup> Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.
The chamber vacuum is monitored periodically by shutting the cryo-valve and recording the rise of pressure rise for 10 mins. The ''rate-of-rise'' history is provided here [link].

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2024 July 2):

{|
|-
|
{| class="wikitable"
|-
! AJA1 !! Material !! Liner !! Thickness limit
|-
| 1 || Al || Intermetallic ||
|-
| 2 || Ti1 || Fabmate ||
|-
| 3 || SiOx || Tungsten ||
|-
| 4 || Au2 || Tungsten ||
|-
| 5 || Ge || Fabmate ||
|-
| 6 || Pt || FabMate || 200 nm*
|-
| DC1 || W || -- ||
|-
| DC2 || Nb<sub>2</sub>Ti || -- ||
|-
|}
|
<span style="display:inline-block; width: 20px;"></span>
|
{| class="wikitable"
|-
! AJA2 !! Material !! Liner !! Thickness limit
|-
| 1 || Pt || Tungsten || 200 nm*
|-
| 2 || Au2 || FabMate ||
|-
| 3 || Al || Intermetallic ||
|-
| 4 || Ti || intermetallic ||
|-
| 5 || Pd || FabMate ||
|-
| 6 || Cr || FabMate ||
|-
| DC1 || Ti || -- ||
|-
| RF2 || Mo || -- ||
|-
| RF3
| Nb<sub>2</sub>Ti || -- ||
|-
|}
|-
|}

Notes:
* If you need to deposit a thicker layer, you need to book enough time for the cryo pump to reach base temperature before continuing with a second layer.
* When you make a booking, you have to select if your deposition includes gold. If yes, you will be asked to fill out the total Au thickness you plan to deposit.
=== Other available materials ===
'''Evaporation''': SiO<sub>2</sub>, MgB<sub>2</sub>, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb<sub>2</sub>Ti<sub>1</sub>, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si<sub>3</sub>N<sub>4</sub>, Ta, Nb<sub>4</sub>Ti<sub>1</sub>, Nb

There is a big [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm compatibility chart] next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

= Instruction videos =

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

= Standard operating procedures =

==System pre-checks==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
* Check the cryo-pump monitor. It should be between '''12-17 K'''. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is '''1500 Hz'''. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is '''<1x10<sup>-7</sup> Torr'''.
*:'''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is '''closed'''.

==Which holder are you using?==
<div style="background-color: #17a2b8; border: 1px solid #1491A5; padding: 10px; border-radius: 5px;">
===AJA1 holders===
* General holder with modular brackets (kept inside the load lock)
* General holder for 4" wafers
* Sputtering holder: Use only for sputtering
===AJA2 holders===
* Au holder (kept inside the load lock)
*: '''If your entire process ends with Au deposition, use the dedicated Au sample holder'''
* General holder
*: '''If your process doesn't end with Au, but any other material, use the generic sample holder'''
* NbTiN holder: Use only for RF3 sputtering of NbTiN
''All the holders are being kept in the N<sub>2</sub> cabinet in the Process Lab 213''
</div>
</div>

==Loading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
#: Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Load your chip either using the mechanical clamps or the double-sided Kapton tape.
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Wait until the chamber pressure goes down to 3x10<sup>-6</sup> Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
# Open the gate valve between the main chamber and the load lock.
# Load the sample holder in the main chamber.
#* AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
#* AJA2: Screw in the sample holder into the stage.
#: Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
# Close the load lock gate valve.
# Check main chamber vacuum.
# Check cryo pump temperature.
</div>

==Unloading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Rotate the sample to the correct position (same orientation as the beginning of the loading procedure).
# Open the gate valve between the main chamber and the load lock.
# Remove the sample holder from the main chamber.
# Close the load lock gate valve.
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Take your sample
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Fill out the Excel log file.
# Clean up after yourself. If the workstation is found untidy, be proactive and leave the setup neat as it is supposed to be.
</div>

==Evaporating metal==
The manufacturer has specific [[How to evaporate metals in AJA|recommendations for ramping up/down the beam current]] based on the physical properties of each material.

A general good idea is to follow the plot below for the beam current ramping.

[[File:Evaporation_profile.pdf| thumb|700px| none|Beam current vs Time for a typical e-beam evaporation.]]

<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading posion'''
# Choose the material on the linear crucible drive as well as on the deposition controller.
# Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
#: This exposes the metal to be evaporated.
#: '''If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!'''
# Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
# Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
#: '''Be very sure that you have opened the e-beam shutter.'''
# Two clicks of the knob and the current set point is set to 4 mA.
#: Wait until the current increases to this value.
# Can you see the bright spot where the beam hits the metal in the crucible?
# Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
#: In the dedicated page for ''materials evaporation'', you can read more information for each material that you can evaporate in the cleanroom.
# Consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
# Ramp the current up at about '''1 click/15 seconds''' to half the value (typically around 20mA).
# Let it sit at that value for 2 mins while the metal soaks (''thermal soaking'') and thermally equilibrates.
#: Too fast and you'll crack the crucible liner or your evaporated metal film will be rough.
# Continue ramping '''1 click/15 seconds''' while monitoring the deposition rate:
#: 1 Å/s is a good rate for metal film evaporation. Try and stay around this value.
# When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
#: The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronising the zero with the shutter opening.
# Wait until the right thickness is evaporated.
# Close the substrate shutter.
# Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds).
#: '''Don't be too quick about it.''' We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
# Turn off the high voltage on the hand remote.
# Wait 2-3 mins for the metal to cool down before moving over to the next metal or finishing your process.
#: '''The metal inside the crucible should stop glowing.'''
# If you're done, turn off the Carrera voltage supply.
# Close the e-beam shutter, '''if the metal is no longer red hot'''.
</div>

==AJA1: Kaufman ion milling==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the sample to face the ion milling gun.
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: ''apex'')
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# In the program, click on the <code>Ion gas</code> button. It should turn green. This diverts the Ar gas flow to the gun.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) according to your recipe.
# In the program, select the <code>Pressure</code> button and set the value according to your recipe.
# Select <code>Pressure</code> button and set the value according to your recipe.
#: A [https://en.wikipedia.org/wiki/PID_controller ''PID-controlled''] gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
# Turn on the Kaufman source controller power supply by physically flicking the switch.
# On the PC at the preparation table, there are several shortcuts to scripts.
#: Execute the relevant beam voltage script (100 V or 300 V) according to your recipe and confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.
#: Wait till the script is done.
# Go back to the laptop.
# Click on the small <code>Output</code> button to turn on the gun.
#: This fires the Ar ions. The ion source shutter still protects your sample.
# Wait for the indicator to turn purple.
# Wait for 2 mins
# Start your timer and open the shutter with the big <code>Shutter</code> button.
#: '''You are now milling.'''
# Click on the big <code>Shutter</code> button to stop the milling.
# Click on the small <code>Output</code> button to turn off the gun (it should turn red).
# Wait for 2 mins while the gun cools down.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# In the program, click on the <code>Ion gas</code> button.
# Turn off the Kaufman source controller power supply by physically flicking the switch.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Proceed with evaporating metal or unloading your sample following the guidelines.
</div>

==AJA2: RF milling (auto - RF1)==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the RF1 power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
#: Your recipe will start automatically
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.

===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
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<div class="mw-collapsible-content">

'''Chamber conditioning'''
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the RF1 stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: ''Max set pt is 50 W''
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are milling'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 25 W.
# Once the system ramps down to 25 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

==AJA1 & AJA2: Sputtering metals==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
#: '''Note:''' ''The sputter sources are angled a bit. 10-20 degrees might give you a more head on sputtering.''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the relevant power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the power source unit.
# Fill out the Excel log file.
# Proceed with any other steps or unload.
===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

'''Important warning before you start: For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!'''

'''Striking the plasma'''
# Open the substrate shutter. The sputter sources have individual shutters.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the power stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are sputtering'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 50 W.
# Once the system ramps down to 50 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

== Oxidation in loadlock ==
AJA1 is equipped with all the necessary gas lines and pressure gauges to oxidise the surface of a sample in the loadlock.

However, currently, the oxygen bottle is not connected. Please contact the cleanroom staff responsible for AJA to request a training on this tool feature.

<div class="mw-collapsible mw-collapsed" style="border:1px solid #ce4e4a; border-left:6px solid #ce4e4a; background:#ce4e4a; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.
</div>
</div>



==Troubleshooting==

Having trouble with the tool? Please contact the tool responsible from the cleanroom.

If you feel comfortable, please consult the troubleshooting guide below:
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; Unable to ignite the plasma (either DC, RF or ion plasma)?
:* Start by checking for shorts between pins on the power supply input, on the sputtering arm/ion source.

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in the crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on the remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters the [[AJA service#Phase II J software configurations |Phase II J software configurations]].
:: user: apex
</div>
</div>
[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2026-06-30T14:36:59Z

Harry: /* Overview */

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Harry
|secondary = Martin
}}
''Page last updated: 22 Jun 2026''

There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside. Oxidation chamber on the loadlock.
* System 2: One regular 2" DC sputtering target, one 3" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10<sup>-8</sup> Torr and 6x10<sup>-8</sup> Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.
The chamber vacuum is monitored periodically by shutting the cryo-valve and recording the rise of pressure rise for 10 mins. The ''rate-of-rise'' history is provided here [link].

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2024 July 2):

{|
|-
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{| class="wikitable"
|-
! AJA1 !! Material !! Liner !! Thickness limit
|-
| 1 || Al || Intermetallic ||
|-
| 2 || Ti1 || Fabmate ||
|-
| 3 || SiOx || Tungsten ||
|-
| 4 || Au2 || Tungsten ||
|-
| 5 || Ge || Fabmate ||
|-
| 6 || Pt || FabMate || 200 nm*
|-
| DC1 || W || -- ||
|-
| DC2 || Nb<sub>2</sub>Ti || -- ||
|-
|}
|
<span style="display:inline-block; width: 20px;"></span>
|
{| class="wikitable"
|-
! AJA2 !! Material !! Liner !! Thickness limit
|-
| 1 || Pt || Tungsten || 200 nm*
|-
| 2 || Au2 || FabMate ||
|-
| 3 || Al || Intermetallic ||
|-
| 4 || Ti || intermetallic ||
|-
| 5 || Pd || FabMate ||
|-
| 6 || Cr || FabMate ||
|-
| DC1 || Ti || -- ||
|-
| RF2 || Mo || -- ||
|-
| RF3
| Nb<sub>2</sub>Ti || -- ||
|-
|}
|-
|}

Notes:
* If you need to deposit a thicker layer, you need to book enough time for the cryo pump to reach base temperature before continuing with a second layer.
* When you make a booking, you have to select if your deposition includes gold. If yes, you will be asked to fill out the total Au thickness you plan to deposit.
=== Other available materials ===
'''Evaporation''': SiO<sub>2</sub>, MgB<sub>2</sub>, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb<sub>2</sub>Ti<sub>1</sub>, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si<sub>3</sub>N<sub>4</sub>, Ta, Nb<sub>4</sub>Ti<sub>1</sub>, Nb

There is a big [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm compatibility chart] next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

= Instruction videos =

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

= Standard operating procedures =

==System pre-checks==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
* Check the cryo-pump monitor. It should be between '''12-17 K'''. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is '''1500 Hz'''. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is '''<1x10<sup>-7</sup> Torr'''.
*:'''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is '''closed'''.

==Which holder are you using?==
<div style="background-color: #17a2b8; border: 1px solid #1491A5; padding: 10px; border-radius: 5px;">
===AJA1 holders===
* General holder with modular brackets (kept inside the load lock)
* General holder for 4" wafers
* Sputtering holder: Use only for sputtering
===AJA2 holders===
* Au holder (kept inside the load lock)
*: '''If your entire process ends with Au deposition, use the dedicated Au sample holder'''
* General holder
*: '''If your process doesn't end with Au, but any other material, use the generic sample holder'''
* NbTiN holder: Use only for RF3 sputtering of NbTiN
''All the holders are being kept in the N<sub>2</sub> cabinet in the Process Lab 213''
</div>
</div>

==Loading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
#: Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Load your chip either using the mechanical clamps or the double-sided Kapton tape.
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Wait until the chamber pressure goes down to 3x10<sup>-6</sup> Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
# Open the gate valve between the main chamber and the load lock.
# Load the sample holder in the main chamber.
#* AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
#* AJA2: Screw in the sample holder into the stage.
#: Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
# Close the load lock gate valve.
# Check main chamber vacuum.
# Check cryo pump temperature.
</div>

==Unloading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Rotate the sample to the correct position (same orientation as the beginning of the loading procedure).
# Open the gate valve between the main chamber and the load lock.
# Remove the sample holder from the main chamber.
# Close the load lock gate valve.
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Take your sample
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Fill out the Excel log file.
# Clean up after yourself. If the workstation is found untidy, be proactive and leave the setup neat as it is supposed to be.
</div>

==Evaporating metal==
The manufacturer has specific [[How to evaporate metals in AJA|recommendations for ramping up/down the beam current]] based on the physical properties of each material.

A general good idea is to follow the plot below for the beam current ramping.

[[File:Evaporation_profile.pdf| thumb|700px| none|Beam current vs Time for a typical e-beam evaporation.]]

<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading posion'''
# Choose the material on the linear crucible drive as well as on the deposition controller.
# Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
#: This exposes the metal to be evaporated.
#: '''If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!'''
# Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
# Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
#: '''Be very sure that you have opened the e-beam shutter.'''
# Two clicks of the knob and the current set point is set to 4 mA.
#: Wait until the current increases to this value.
# Can you see the bright spot where the beam hits the metal in the crucible?
# Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
#: In the dedicated page for ''materials evaporation'', you can read more information for each material that you can evaporate in the cleanroom.
# Consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
# Ramp the current up at about '''1 click/15 seconds''' to half the value (typically around 20mA).
# Let it sit at that value for 2 mins while the metal soaks (''thermal soaking'') and thermally equilibrates.
#: Too fast and you'll crack the crucible liner or your evaporated metal film will be rough.
# Continue ramping '''1 click/15 seconds''' while monitoring the deposition rate:
#: 1 Å/s is a good rate for metal film evaporation. Try and stay around this value.
# When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
#: The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronising the zero with the shutter opening.
# Wait until the right thickness is evaporated.
# Close the substrate shutter.
# Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds).
#: '''Don't be too quick about it.''' We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
# Turn off the high voltage on the hand remote.
# Wait 2-3 mins for the metal to cool down before moving over to the next metal or finishing your process.
#: '''The metal inside the crucible should stop glowing.'''
# If you're done, turn off the Carrera voltage supply.
# Close the e-beam shutter, '''if the metal is no longer red hot'''.
</div>

==AJA1: Kaufman ion milling==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the sample to face the ion milling gun.
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: ''apex'')
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# In the program, click on the <code>Ion gas</code> button. It should turn green. This diverts the Ar gas flow to the gun.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) according to your recipe.
# In the program, select the <code>Pressure</code> button and set the value according to your recipe.
# Select <code>Pressure</code> button and set the value according to your recipe.
#: A [https://en.wikipedia.org/wiki/PID_controller ''PID-controlled''] gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
# Turn on the Kaufman source controller power supply by physically flicking the switch.
# On the PC at the preparation table, there are several shortcuts to scripts.
#: Execute the relevant beam voltage script (100 V or 300 V) according to your recipe and confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.
#: Wait till the script is done.
# Go back to the laptop.
# Click on the small <code>Output</code> button to turn on the gun.
#: This fires the Ar ions. The ion source shutter still protects your sample.
# Wait for the indicator to turn purple.
# Wait for 2 mins
# Start your timer and open the shutter with the big <code>Shutter</code> button.
#: '''You are now milling.'''
# Click on the big <code>Shutter</code> button to stop the milling.
# Click on the small <code>Output</code> button to turn off the gun (it should turn red).
# Wait for 2 mins while the gun cools down.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# In the program, click on the <code>Ion gas</code> button.
# Turn off the Kaufman source controller power supply by physically flicking the switch.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Proceed with evaporating metal or unloading your sample following the guidelines.
</div>

==AJA2: RF milling (auto - RF1)==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the RF1 power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
#: Your recipe will start automatically
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.

===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
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<div class="mw-collapsible-content">

'''Chamber conditioning'''
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the RF1 stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: ''Max set pt is 50 W''
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are milling'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 25 W.
# Once the system ramps down to 25 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

==AJA1 & AJA2: Sputtering metals==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
#: '''Note:''' ''The sputter sources are angled a bit. 10-20 degrees might give you a more head on sputtering.''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the relevant power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the power source unit.
# Fill out the Excel log file.
# Proceed with any other steps or unload.
===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

'''Important warning before you start: For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!'''

'''Striking the plasma'''
# Open the substrate shutter. The sputter sources have individual shutters.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the power stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are sputtering'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 50 W.
# Once the system ramps down to 50 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

== Oxidation in loadlock ==
AJA1 is equipped with all the necessary gas lines and pressure gauges to oxidise the surface of a sample in the loadlock.

However, currently, the oxygen bottle is not connected. Please contact the cleanroom staff responsible for AJA to request a training on this tool feature.

<div class="mw-collapsible mw-collapsed" style="border:1px solid #ce4e4a; border-left:6px solid #ce4e4a; background:#ce4e4a; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.
</div>
</div>



==Troubleshooting==

Having trouble with the tool? Please contact the tool responsible from the cleanroom.

If you feel comfortable, please consult the troubleshooting guide below:
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<div class="mw-collapsible-content">

; Unable to ignite the plasma (either DC, RF or ion plasma)?
:* Start by checking for shorts between pins on the power supply input, on the sputtering arm/ion source.

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in the crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on the remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters the [[AJA service#Phase II J software configurations |Phase II J software configurations]].
:: user: apex
</div>
</div>
[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2026-06-30T14:31:47Z

Harry: /* Evaporating metal */

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Harry
|secondary = Martin
}}
''Page last updated: 22 Jun 2026''

There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside. Oxidation chamber on the loadlock.
* System 2: One regular 2" DC sputtering target, one 3" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10<sup>-8</sup> Torr and 6x10<sup>-8</sup> Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.
The chamber vacuum is monitored periodically by shutting the cryo-valve and recording the rise of pressure rise for 10 mins. The ''rate-of-rise'' history is provided here [link].

Service notes and troubleshooting issues are all gathered in the dedicated [[AJA service]] page. Maintenance logs are collected in the Excel czar log page.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2024 July 2):

{|
|-
|
{| class="wikitable"
|-
! AJA1 !! Material !! Liner !! Thickness limit
|-
| 1 || Al || Intermetallic ||
|-
| 2 || Ti1 || Fabmate ||
|-
| 3 || SiOx || Tungsten ||
|-
| 4 || Au2 || Tungsten ||
|-
| 5 || Ge || Fabmate ||
|-
| 6 || Pt || FabMate || 200 nm*
|-
| DC1 || W || -- ||
|-
| DC2 || Nb<sub>2</sub>Ti || -- ||
|-
|}
|
<span style="display:inline-block; width: 20px;"></span>
|
{| class="wikitable"
|-
! AJA2 !! Material !! Liner !! Thickness limit
|-
| 1 || Pt || Tungsten || 200 nm*
|-
| 2 || Au2 || FabMate ||
|-
| 3 || Al || Intermetallic ||
|-
| 4 || Ti || intermetallic ||
|-
| 5 || Pd || FabMate ||
|-
| 6 || Cr || FabMate ||
|-
| DC1 || Ti || -- ||
|-
| RF2 || Mo || -- ||
|-
| RF3
| Nb<sub>2</sub>Ti || -- ||
|-
|}
|-
|}

Notes:
* If you need to deposit a thicker layer, you need to book enough time for the cryo pump to reach base temperature before continuing with a second layer.
* When you make a booking, you have to select if your deposition includes gold. If yes, you will be asked to fill out the total Au thickness you plan to deposit.
=== Other available materials ===
'''Evaporation''': SiO<sub>2</sub>, MgB<sub>2</sub>, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb<sub>2</sub>Ti<sub>1</sub>, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si<sub>3</sub>N<sub>4</sub>, Ta, Nb<sub>4</sub>Ti<sub>1</sub>, Nb

There is a big [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm compatibility chart] next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

= Instruction videos =

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

= Standard operating procedures =

==System pre-checks==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
* Check the cryo-pump monitor. It should be between '''12-17 K'''. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is '''1500 Hz'''. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is '''<1x10<sup>-7</sup> Torr'''.
*:'''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is '''closed'''.

==Which holder are you using?==
<div style="background-color: #17a2b8; border: 1px solid #1491A5; padding: 10px; border-radius: 5px;">
===AJA1 holders===
* General holder with modular brackets (kept inside the load lock)
* General holder for 4" wafers
* Sputtering holder: Use only for sputtering
===AJA2 holders===
* Au holder (kept inside the load lock)
*: '''If your entire process ends with Au deposition, use the dedicated Au sample holder'''
* General holder
*: '''If your process doesn't end with Au, but any other material, use the generic sample holder'''
* NbTiN holder: Use only for RF3 sputtering of NbTiN
''All the holders are being kept in the N<sub>2</sub> cabinet in the Process Lab 213''
</div>
</div>

==Loading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
#: Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Load your chip either using the mechanical clamps or the double-sided Kapton tape.
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Wait until the chamber pressure goes down to 3x10<sup>-6</sup> Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
# Open the gate valve between the main chamber and the load lock.
# Load the sample holder in the main chamber.
#* AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
#* AJA2: Screw in the sample holder into the stage.
#: Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
# Close the load lock gate valve.
# Check main chamber vacuum.
# Check cryo pump temperature.
</div>

==Unloading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Rotate the sample to the correct position (same orientation as the beginning of the loading procedure).
# Open the gate valve between the main chamber and the load lock.
# Remove the sample holder from the main chamber.
# Close the load lock gate valve.
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Take your sample
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Fill out the Excel log file.
# Clean up after yourself. If the workstation is found untidy, be proactive and leave the setup neat as it is supposed to be.
</div>

==Evaporating metal==
The manufacturer has specific [[How to evaporate metals in AJA|recommendations for ramping up/down the beam current]] based on the physical properties of each material.

A general good idea is to follow the plot below for the beam current ramping.

[[File:Evaporation_profile.pdf| thumb|700px| none|Beam current vs Time for a typical e-beam evaporation.]]

<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading posion'''
# Choose the material on the linear crucible drive as well as on the deposition controller.
# Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
#: This exposes the metal to be evaporated.
#: '''If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!'''
# Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
# Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
#: '''Be very sure that you have opened the e-beam shutter.'''
# Two clicks of the knob and the current set point is set to 4 mA.
#: Wait until the current increases to this value.
# Can you see the bright spot where the beam hits the metal in the crucible?
# Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
#: In the dedicated page for ''materials evaporation'', you can read more information for each material that you can evaporate in the cleanroom.
# Consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
# Ramp the current up at about '''1 click/15 seconds''' to half the value (typically around 20mA).
# Let it sit at that value for 2 mins while the metal soaks (''thermal soaking'') and thermally equilibrates.
#: Too fast and you'll crack the crucible liner or your evaporated metal film will be rough.
# Continue ramping '''1 click/15 seconds''' while monitoring the deposition rate:
#: 1 Å/s is a good rate for metal film evaporation. Try and stay around this value.
# When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
#: The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronising the zero with the shutter opening.
# Wait until the right thickness is evaporated.
# Close the substrate shutter.
# Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds).
#: '''Don't be too quick about it.''' We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
# Turn off the high voltage on the hand remote.
# Wait 2-3 mins for the metal to cool down before moving over to the next metal or finishing your process.
#: '''The metal inside the crucible should stop glowing.'''
# If you're done, turn off the Carrera voltage supply.
# Close the e-beam shutter, '''if the metal is no longer red hot'''.
</div>

==AJA1: Kaufman ion milling==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the sample to face the ion milling gun.
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: ''apex'')
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# In the program, click on the <code>Ion gas</code> button. It should turn green. This diverts the Ar gas flow to the gun.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) according to your recipe.
# In the program, select the <code>Pressure</code> button and set the value according to your recipe.
# Select <code>Pressure</code> button and set the value according to your recipe.
#: A [https://en.wikipedia.org/wiki/PID_controller ''PID-controlled''] gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
# Turn on the Kaufman source controller power supply by physically flicking the switch.
# On the PC at the preparation table, there are several shortcuts to scripts.
#: Execute the relevant beam voltage script (100 V or 300 V) according to your recipe and confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.
#: Wait till the script is done.
# Go back to the laptop.
# Click on the small <code>Output</code> button to turn on the gun.
#: This fires the Ar ions. The ion source shutter still protects your sample.
# Wait for the indicator to turn purple.
# Wait for 2 mins
# Start your timer and open the shutter with the big <code>Shutter</code> button.
#: '''You are now milling.'''
# Click on the big <code>Shutter</code> button to stop the milling.
# Click on the small <code>Output</code> button to turn off the gun (it should turn red).
# Wait for 2 mins while the gun cools down.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# In the program, click on the <code>Ion gas</code> button.
# Turn off the Kaufman source controller power supply by physically flicking the switch.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Proceed with evaporating metal or unloading your sample following the guidelines.
</div>

==AJA2: RF milling (auto - RF1)==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the RF1 power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
#: Your recipe will start automatically
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.

===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

'''Chamber conditioning'''
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the RF1 stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: ''Max set pt is 50 W''
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are milling'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 25 W.
# Once the system ramps down to 25 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

==AJA1 & AJA2: Sputtering metals==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
#: '''Note:''' ''The sputter sources are angled a bit. 10-20 degrees might give you a more head on sputtering.''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the relevant power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the power source unit.
# Fill out the Excel log file.
# Proceed with any other steps or unload.
===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

'''Important warning before you start: For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!'''

'''Striking the plasma'''
# Open the substrate shutter. The sputter sources have individual shutters.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the power stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are sputtering'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 50 W.
# Once the system ramps down to 50 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

== Oxidation in loadlock ==
AJA1 is equipped with all the necessary gas lines and pressure gauges to oxidise the surface of a sample in the loadlock.

However, currently, the oxygen bottle is not connected. Please contact the cleanroom staff responsible for AJA to request a training on this tool feature.

<div class="mw-collapsible mw-collapsed" style="border:1px solid #ce4e4a; border-left:6px solid #ce4e4a; background:#ce4e4a; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
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<div class="mw-collapsible-content">

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.
</div>
</div>



==Troubleshooting==

Having trouble with the tool? Please contact the tool responsible from the cleanroom.

If you feel comfortable, please consult the troubleshooting guide below:
<div class="mw-collapsible mw-collapsed" style="border:1px solid #f5c6cb; border-left:6px solid #f5c6cb; background:#f8d7da; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

; Unable to ignite the plasma (either DC, RF or ion plasma)?
:* Start by checking for shorts between pins on the power supply input, on the sputtering arm/ion source.

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in the crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on the remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters the [[AJA service#Phase II J software configurations |Phase II J software configurations]].
:: user: apex
</div>
</div>
[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2026-06-30T14:22:31Z

Harry: /* Evaporating metal */

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Harry
|secondary = Martin
}}
''Page last updated: 22 Jun 2026''

There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside. Oxidation chamber on the loadlock.
* System 2: One regular 2" DC sputtering target, one 3" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10<sup>-8</sup> Torr and 6x10<sup>-8</sup> Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.
The chamber vacuum is monitored periodically by shutting the cryo-valve and recording the rise of pressure rise for 10 mins. The ''rate-of-rise'' history is provided here [link].

Service notes and troubleshooting issues are all gathered in the dedicated [[AJA service]] page. Maintenance logs are collected in the Excel czar log page.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2024 July 2):

{|
|-
|
{| class="wikitable"
|-
! AJA1 !! Material !! Liner !! Thickness limit
|-
| 1 || Al || Intermetallic ||
|-
| 2 || Ti1 || Fabmate ||
|-
| 3 || SiOx || Tungsten ||
|-
| 4 || Au2 || Tungsten ||
|-
| 5 || Ge || Fabmate ||
|-
| 6 || Pt || FabMate || 200 nm*
|-
| DC1 || W || -- ||
|-
| DC2 || Nb<sub>2</sub>Ti || -- ||
|-
|}
|
<span style="display:inline-block; width: 20px;"></span>
|
{| class="wikitable"
|-
! AJA2 !! Material !! Liner !! Thickness limit
|-
| 1 || Pt || Tungsten || 200 nm*
|-
| 2 || Au2 || FabMate ||
|-
| 3 || Al || Intermetallic ||
|-
| 4 || Ti || intermetallic ||
|-
| 5 || Pd || FabMate ||
|-
| 6 || Cr || FabMate ||
|-
| DC1 || Ti || -- ||
|-
| RF2 || Mo || -- ||
|-
| RF3
| Nb<sub>2</sub>Ti || -- ||
|-
|}
|-
|}

Notes:
* If you need to deposit a thicker layer, you need to book enough time for the cryo pump to reach base temperature before continuing with a second layer.
* When you make a booking, you have to select if your deposition includes gold. If yes, you will be asked to fill out the total Au thickness you plan to deposit.
=== Other available materials ===
'''Evaporation''': SiO<sub>2</sub>, MgB<sub>2</sub>, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb<sub>2</sub>Ti<sub>1</sub>, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si<sub>3</sub>N<sub>4</sub>, Ta, Nb<sub>4</sub>Ti<sub>1</sub>, Nb

There is a big [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm compatibility chart] next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

= Instruction videos =

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

= Standard operating procedures =

==System pre-checks==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
* Check the cryo-pump monitor. It should be between '''12-17 K'''. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is '''1500 Hz'''. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is '''<1x10<sup>-7</sup> Torr'''.
*:'''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is '''closed'''.

==Which holder are you using?==
<div style="background-color: #17a2b8; border: 1px solid #1491A5; padding: 10px; border-radius: 5px;">
===AJA1 holders===
* General holder with modular brackets (kept inside the load lock)
* General holder for 4" wafers
* Sputtering holder: Use only for sputtering
===AJA2 holders===
* Au holder (kept inside the load lock)
*: '''If your entire process ends with Au deposition, use the dedicated Au sample holder'''
* General holder
*: '''If your process doesn't end with Au, but any other material, use the generic sample holder'''
* NbTiN holder: Use only for RF3 sputtering of NbTiN
''All the holders are being kept in the N<sub>2</sub> cabinet in the Process Lab 213''
</div>
</div>

==Loading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
#: Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Load your chip either using the mechanical clamps or the double-sided Kapton tape.
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Wait until the chamber pressure goes down to 3x10<sup>-6</sup> Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
# Open the gate valve between the main chamber and the load lock.
# Load the sample holder in the main chamber.
#* AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
#* AJA2: Screw in the sample holder into the stage.
#: Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
# Close the load lock gate valve.
# Check main chamber vacuum.
# Check cryo pump temperature.
</div>

==Unloading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Rotate the sample to the correct position (same orientation as the beginning of the loading procedure).
# Open the gate valve between the main chamber and the load lock.
# Remove the sample holder from the main chamber.
# Close the load lock gate valve.
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Take your sample
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Fill out the Excel log file.
# Clean up after yourself. If the workstation is found untidy, be proactive and leave the setup neat as it is supposed to be.
</div>

==Evaporating metal==
The manufacturer has specific [[How to evaporate metals in AJA|recommendations for ramping up/down the beam current]] based on the physical properties of each material.

A general good idea is to follow the plot below for the beam current ramping.

[[File:Evaporation_profile.pdf| page=1| thumb| Beam current vs Time for a typical e-beam evaporation.]]

<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading posion'''
# Choose the material on the linear crucible drive as well as on the deposition controller.
# Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
#: This exposes the metal to be evaporated.
#: '''If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!'''
# Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
# Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
#: '''Be very sure that you have opened the e-beam shutter.'''
# Two clicks of the knob and the current set point is set to 4 mA.
#: Wait until the current increases to this value.
# Can you see the bright spot where the beam hits the metal in the crucible?
# Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
#: In the dedicated page for ''materials evaporation'', you can read more information for each material that you can evaporate in the cleanroom.
# Consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
# Ramp the current up at about '''1 click/15 seconds''' to half the value (typically around 20mA).
# Let it sit at that value for 2 mins while the metal soaks (''thermal soaking'') and thermally equilibrates.
#: Too fast and you'll crack the crucible liner or your evaporated metal film will be rough.
# Continue ramping '''1 click/15 seconds''' while monitoring the deposition rate:
#: 1 Å/s is a good rate for metal film evaporation. Try and stay around this value.
# When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
#: The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronising the zero with the shutter opening.
# Wait until the right thickness is evaporated.
# Close the substrate shutter.
# Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds).
#: '''Don't be too quick about it.''' We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
# Turn off the high voltage on the hand remote.
# Wait 2-3 mins for the metal to cool down before moving over to the next metal or finishing your process.
#: '''The metal inside the crucible should stop glowing.'''
# If you're done, turn off the Carrera voltage supply.
# Close the e-beam shutter, '''if the metal is no longer red hot'''.
</div>

==AJA1: Kaufman ion milling==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the sample to face the ion milling gun.
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: ''apex'')
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# In the program, click on the <code>Ion gas</code> button. It should turn green. This diverts the Ar gas flow to the gun.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) according to your recipe.
# In the program, select the <code>Pressure</code> button and set the value according to your recipe.
# Select <code>Pressure</code> button and set the value according to your recipe.
#: A [https://en.wikipedia.org/wiki/PID_controller ''PID-controlled''] gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
# Turn on the Kaufman source controller power supply by physically flicking the switch.
# On the PC at the preparation table, there are several shortcuts to scripts.
#: Execute the relevant beam voltage script (100 V or 300 V) according to your recipe and confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.
#: Wait till the script is done.
# Go back to the laptop.
# Click on the small <code>Output</code> button to turn on the gun.
#: This fires the Ar ions. The ion source shutter still protects your sample.
# Wait for the indicator to turn purple.
# Wait for 2 mins
# Start your timer and open the shutter with the big <code>Shutter</code> button.
#: '''You are now milling.'''
# Click on the big <code>Shutter</code> button to stop the milling.
# Click on the small <code>Output</code> button to turn off the gun (it should turn red).
# Wait for 2 mins while the gun cools down.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# In the program, click on the <code>Ion gas</code> button.
# Turn off the Kaufman source controller power supply by physically flicking the switch.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Proceed with evaporating metal or unloading your sample following the guidelines.
</div>

==AJA2: RF milling (auto - RF1)==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the RF1 power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
#: Your recipe will start automatically
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.

===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
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<div class="mw-collapsible-content">

'''Chamber conditioning'''
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the RF1 stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: ''Max set pt is 50 W''
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are milling'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 25 W.
# Once the system ramps down to 25 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

==AJA1 & AJA2: Sputtering metals==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
#: '''Note:''' ''The sputter sources are angled a bit. 10-20 degrees might give you a more head on sputtering.''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the relevant power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the power source unit.
# Fill out the Excel log file.
# Proceed with any other steps or unload.
===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

'''Important warning before you start: For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!'''

'''Striking the plasma'''
# Open the substrate shutter. The sputter sources have individual shutters.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the power stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are sputtering'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 50 W.
# Once the system ramps down to 50 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

== Oxidation in loadlock ==
AJA1 is equipped with all the necessary gas lines and pressure gauges to oxidise the surface of a sample in the loadlock.

However, currently, the oxygen bottle is not connected. Please contact the cleanroom staff responsible for AJA to request a training on this tool feature.

<div class="mw-collapsible mw-collapsed" style="border:1px solid #ce4e4a; border-left:6px solid #ce4e4a; background:#ce4e4a; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.
</div>
</div>



==Troubleshooting==

Having trouble with the tool? Please contact the tool responsible from the cleanroom.

If you feel comfortable, please consult the troubleshooting guide below:
<div class="mw-collapsible mw-collapsed" style="border:1px solid #f5c6cb; border-left:6px solid #f5c6cb; background:#f8d7da; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

; Unable to ignite the plasma (either DC, RF or ion plasma)?
:* Start by checking for shorts between pins on the power supply input, on the sputtering arm/ion source.

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in the crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on the remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters the [[AJA service#Phase II J software configurations |Phase II J software configurations]].
:: user: apex
</div>
</div>
[[Category:Tools]]
[[Category:Deposition]]

File:Evaporation profile.pdf

2026-06-30T14:21:18Z

Harry: Harry uploaded a new version of File:Evaporation profile.pdf

File:Evaporation profile.pdf

2026-06-30T14:06:42Z

Harry:

AJA systems

2026-06-30T14:04:01Z

Harry: /* Evaporating metal */

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Harry
|secondary = Martin
}}
''Page last updated: 22 Jun 2026''

There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside. Oxidation chamber on the loadlock.
* System 2: One regular 2" DC sputtering target, one 3" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10<sup>-8</sup> Torr and 6x10<sup>-8</sup> Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.
The chamber vacuum is monitored periodically by shutting the cryo-valve and recording the rise of pressure rise for 10 mins. The ''rate-of-rise'' history is provided here [link].

Service notes and troubleshooting issues are all gathered in the dedicated [[AJA service]] page. Maintenance logs are collected in the Excel czar log page.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2024 July 2):

{|
|-
|
{| class="wikitable"
|-
! AJA1 !! Material !! Liner !! Thickness limit
|-
| 1 || Al || Intermetallic ||
|-
| 2 || Ti1 || Fabmate ||
|-
| 3 || SiOx || Tungsten ||
|-
| 4 || Au2 || Tungsten ||
|-
| 5 || Ge || Fabmate ||
|-
| 6 || Pt || FabMate || 200 nm*
|-
| DC1 || W || -- ||
|-
| DC2 || Nb<sub>2</sub>Ti || -- ||
|-
|}
|
<span style="display:inline-block; width: 20px;"></span>
|
{| class="wikitable"
|-
! AJA2 !! Material !! Liner !! Thickness limit
|-
| 1 || Pt || Tungsten || 200 nm*
|-
| 2 || Au2 || FabMate ||
|-
| 3 || Al || Intermetallic ||
|-
| 4 || Ti || intermetallic ||
|-
| 5 || Pd || FabMate ||
|-
| 6 || Cr || FabMate ||
|-
| DC1 || Ti || -- ||
|-
| RF2 || Mo || -- ||
|-
| RF3
| Nb<sub>2</sub>Ti || -- ||
|-
|}
|-
|}

Notes:
* If you need to deposit a thicker layer, you need to book enough time for the cryo pump to reach base temperature before continuing with a second layer.
* When you make a booking, you have to select if your deposition includes gold. If yes, you will be asked to fill out the total Au thickness you plan to deposit.
=== Other available materials ===
'''Evaporation''': SiO<sub>2</sub>, MgB<sub>2</sub>, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb<sub>2</sub>Ti<sub>1</sub>, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si<sub>3</sub>N<sub>4</sub>, Ta, Nb<sub>4</sub>Ti<sub>1</sub>, Nb

There is a big [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm compatibility chart] next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

= Instruction videos =

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

= Standard operating procedures =

==System pre-checks==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
* Check the cryo-pump monitor. It should be between '''12-17 K'''. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is '''1500 Hz'''. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is '''<1x10<sup>-7</sup> Torr'''.
*:'''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is '''closed'''.

==Which holder are you using?==
<div style="background-color: #17a2b8; border: 1px solid #1491A5; padding: 10px; border-radius: 5px;">
===AJA1 holders===
* General holder with modular brackets (kept inside the load lock)
* General holder for 4" wafers
* Sputtering holder: Use only for sputtering
===AJA2 holders===
* Au holder (kept inside the load lock)
*: '''If your entire process ends with Au deposition, use the dedicated Au sample holder'''
* General holder
*: '''If your process doesn't end with Au, but any other material, use the generic sample holder'''
* NbTiN holder: Use only for RF3 sputtering of NbTiN
''All the holders are being kept in the N<sub>2</sub> cabinet in the Process Lab 213''
</div>
</div>

==Loading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
#: Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Load your chip either using the mechanical clamps or the double-sided Kapton tape.
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Wait until the chamber pressure goes down to 3x10<sup>-6</sup> Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
# Open the gate valve between the main chamber and the load lock.
# Load the sample holder in the main chamber.
#* AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
#* AJA2: Screw in the sample holder into the stage.
#: Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
# Close the load lock gate valve.
# Check main chamber vacuum.
# Check cryo pump temperature.
</div>

==Unloading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Rotate the sample to the correct position (same orientation as the beginning of the loading procedure).
# Open the gate valve between the main chamber and the load lock.
# Remove the sample holder from the main chamber.
# Close the load lock gate valve.
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Take your sample
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Fill out the Excel log file.
# Clean up after yourself. If the workstation is found untidy, be proactive and leave the setup neat as it is supposed to be.
</div>

==Evaporating metal==
The manufacturer has specific [[How to evaporate metals in AJA|recommendations for ramping up/down the beam current]] based on the physical properties of each material.

A general good idea is to follow the plot below for the beam current ramping.

<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading posion'''
# Choose the material on the linear crucible drive as well as on the deposition controller.
# Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
#: This exposes the metal to be evaporated.
#: '''If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!'''
# Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
# Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
#: '''Be very sure that you have opened the e-beam shutter.'''
# Two clicks of the knob and the current set point is set to 4 mA.
#: Wait until the current increases to this value.
# Can you see the bright spot where the beam hits the metal in the crucible?
# Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
#: In the dedicated page for ''materials evaporation'', you can read more information for each material that you can evaporate in the cleanroom.
# Consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
# Ramp the current up at about '''1 click/15 seconds''' to half the value (typically around 20mA).
# Let it sit at that value for 2 mins while the metal soaks (''thermal soaking'') and thermally equilibrates.
#: Too fast and you'll crack the crucible liner or your evaporated metal film will be rough.
# Continue ramping '''1 click/15 seconds''' while monitoring the deposition rate:
#: 1 Å/s is a good rate for metal film evaporation. Try and stay around this value.
# When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
#: The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronising the zero with the shutter opening.
# Wait until the right thickness is evaporated.
# Close the substrate shutter.
# Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds).
#: '''Don't be too quick about it.''' We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
# Turn off the high voltage on the hand remote.
# Wait 2-3 mins for the metal to cool down before moving over to the next metal or finishing your process.
#: '''The metal inside the crucible should stop glowing.'''
# If you're done, turn off the Carrera voltage supply.
# Close the e-beam shutter, '''if the metal is no longer red hot'''.
</div>

==AJA1: Kaufman ion milling==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the sample to face the ion milling gun.
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: ''apex'')
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# In the program, click on the <code>Ion gas</code> button. It should turn green. This diverts the Ar gas flow to the gun.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) according to your recipe.
# In the program, select the <code>Pressure</code> button and set the value according to your recipe.
# Select <code>Pressure</code> button and set the value according to your recipe.
#: A [https://en.wikipedia.org/wiki/PID_controller ''PID-controlled''] gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
# Turn on the Kaufman source controller power supply by physically flicking the switch.
# On the PC at the preparation table, there are several shortcuts to scripts.
#: Execute the relevant beam voltage script (100 V or 300 V) according to your recipe and confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.
#: Wait till the script is done.
# Go back to the laptop.
# Click on the small <code>Output</code> button to turn on the gun.
#: This fires the Ar ions. The ion source shutter still protects your sample.
# Wait for the indicator to turn purple.
# Wait for 2 mins
# Start your timer and open the shutter with the big <code>Shutter</code> button.
#: '''You are now milling.'''
# Click on the big <code>Shutter</code> button to stop the milling.
# Click on the small <code>Output</code> button to turn off the gun (it should turn red).
# Wait for 2 mins while the gun cools down.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# In the program, click on the <code>Ion gas</code> button.
# Turn off the Kaufman source controller power supply by physically flicking the switch.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Proceed with evaporating metal or unloading your sample following the guidelines.
</div>

==AJA2: RF milling (auto - RF1)==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the RF1 power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
#: Your recipe will start automatically
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.

===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

'''Chamber conditioning'''
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the RF1 stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: ''Max set pt is 50 W''
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are milling'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 25 W.
# Once the system ramps down to 25 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

==AJA1 & AJA2: Sputtering metals==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
#: '''Note:''' ''The sputter sources are angled a bit. 10-20 degrees might give you a more head on sputtering.''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the relevant power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the power source unit.
# Fill out the Excel log file.
# Proceed with any other steps or unload.
===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

'''Important warning before you start: For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!'''

'''Striking the plasma'''
# Open the substrate shutter. The sputter sources have individual shutters.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the power stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are sputtering'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 50 W.
# Once the system ramps down to 50 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

== Oxidation in loadlock ==
AJA1 is equipped with all the necessary gas lines and pressure gauges to oxidise the surface of a sample in the loadlock.

However, currently, the oxygen bottle is not connected. Please contact the cleanroom staff responsible for AJA to request a training on this tool feature.

<div class="mw-collapsible mw-collapsed" style="border:1px solid #ce4e4a; border-left:6px solid #ce4e4a; background:#ce4e4a; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
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<div class="mw-collapsible-content">

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.
</div>
</div>



==Troubleshooting==

Having trouble with the tool? Please contact the tool responsible from the cleanroom.

If you feel comfortable, please consult the troubleshooting guide below:
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; Unable to ignite the plasma (either DC, RF or ion plasma)?
:* Start by checking for shorts between pins on the power supply input, on the sputtering arm/ion source.

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in the crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on the remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters the [[AJA service#Phase II J software configurations |Phase II J software configurations]].
:: user: apex
</div>
</div>
[[Category:Tools]]
[[Category:Deposition]]

FS bonder

2026-06-30T10:02:56Z

Harry:

{{Infobox tool
|image = Tools FS bonder.jpg
|toolfullname = F&S Bondtec 5630
|website = https://www.fsbondtec.at/?lang=en
|company = F&S Bondtec
|description = Semi-automatic bonder
|location = 1st floor lab (03.1.111)
|primary = Harry
|secondary = Nader
}}
F/S Bondtec 5630 is a semi-automatic bonder.
Users typically use it to bond semiconductor substrates to PCB daughterboards.
It uses a 25 um aluminum wire, bonded at room temperature.

The bonder shares the flow hood and PC monitor with the [[Lynx EVO stereomicroscope]].

<blockquote style="background-color: #F0F0F0; border: dashed thin grey;">
The source PC can be switched by pressing <code>Scroll Lock, Scroll Lock, Enter</code> on the keyboard.
</blockquote>

All users need to be trained by a cleanroom staff member before they can work independently on the tool. Please read the [[Training Packaging F&S autobonder|tool training guidelines]] to apply for training

= Standard operating procedure =

This is a standard operating procedure describing the use of '''F&S 5630 bonder''' on the first floor lab.

== Preparation ==
# Turn on the light on top of the laminar air flow bench. Set the flow to 5.
# Open the sash.
# Start the 5630 program.
## Do you want to move home? '''Yes'''
## Do you want to open the last bonding program? '''No'''
## <code>File > Load</code>: Load your preferable bondprogramme.
# Choose the appropriate block for your daughterboard from the first drawer. There are four different blocks corresponding to different daughterboards:
## Copenhagen (large and small block)
## QBoard II
## Sydney
## transmon
## QCage
# Remove the dummy daughterboard from the block.
# Screw your PCB onto the block.
# Mount your chip to the board following the procedure you learnt from your group.
## Wait a few minutes for the chip to dry.
# Mount the block on the bonder stage.
# Connect the grounding cable to the block.
# Use an ESD anti-static wrist strap.
# Press <code>F1</code> on the side key panel to bring up the bonding dialog.

== Bonding ==
# In <code>Bond1</code>:
## Find one of the bonding pads of your daughterboard.
## Adjust light settings and focus.
## <code>Store trace - 6</code> to register the height and xy-coordinates.
# Press <code>Right - 2</code> or click on <code>Bond2</code>. Note that the head might leave a small mark where it touches down.
# In <code>Bond2</code>:
## Find one of the bonding pads of your chip. Preferably choose a spare if you have any available.
## Adjust light settings and focus on the chip.
## <code>Store trace - 6</code> to store chip height. Note that the head might leave a small mark where it touches down.
# Now you are ready to bond!
##It is always a good idea to start with a test bond on spare pads to test the success and the profile of your wirebond. Adjust the bonding parameters if necessary.
##Once you find the optimal bonding parameters. Drag and drop '''Bond1''' and '''Bond2''' on the desired positions and then press <code>F1</code> to bond.

<blockquote style="background-color: #F0F0F0; border: dashed thin grey;">
'''Notes'''
* Arrows left/right move between Bond1 and Bond2.
* Pressing <code>F1</code> bond on Bond1 moves to Bond2 position.
* Pressing <code>F1</code> bond on Bond2 bonds.
* Pressing <code>0 home | escape</code> homes the stage, turns off the light and turns off the camera.
</blockquote>

== Clean-up ==
# Close the bonding dialog. Save the bond program by selecting <code>File > Save</code> if you would like to save your changes.
# Close the 5630 program.
# Wait until the sample stage moves to the home position.
# Unscrew the block from the stage.
# You can move the block Under the Lynx Microscope to take some images of your final bonding result.
# Unscrew your bonded chip/daughterboard from the block.
# Check that all of the fuzz buttons are present. '''If not, replace.'''
# Screw a dummy board in place.
# Fill in the sheet-log. Required fields are name, date and comments/problems, if there are any.
# Close the sash.
# Turn down the air flow to 1.
# Turn off the light.

= Common issues =

== DLC flatline==
:If you see a DLC curve flatline near 0 (usually accompanied by a failed bond) it is likely the bond wire has come out of the wedge or clamp and needs rethreading. Try <code>Wire Feed -#</code> to check if you can see the wire tail first.

== The wedge may be clogged ==
# Check the thread.
# Press <code>Feed #</code> to feed the wire. If the wire does not come out of the wedge, you need to rethread.
# Release the right clamp by rotating it 90 degrees clockwise.
# Use the scissors to cut the damaged part of the wire.
# Use the designated tweezers for rethreading.
# If the wire doesn't pass through the wedge hole:
## Press <code>Test</code> on the ultrasonic generator while touching the wedge close to the tip with your metallic tweezers.
## Try rethreading again and repeat the process if you don't succeed by your first attempt.
## As a last resort, you can try rethreading in the opposite direction. This will verify that your wedge is clogged (or not).
## Once you verify that the wedge is clogged, contact one of the tool administrators and they will replace the wedge.
#'''Do not attempt to replace the wedge by yourself.'''

== Z motor error ==
Can happen "randomly" but most common after a failed bond.
# Check to see if the red sensor light on the left-hand side of the bond head is ON.
# If it is on, gently rotate the mushroom shaped wheel clockwise until the red light goes off.
# Restart 5630 software (save? Yes) and carry on bonding as before.

== The bond is in the wrong place==
''The bond is in the wrong place, even though the Bond1 Bond2 positions were correctly set''
: If you use <code>Bond - F1</code> to switch between the tabs "Bond1 > Bond2 > BOND" make sure the stage has finished moving before pressing <code>F1</code> to advance.
: The bonder appears to read the stage instantaneous position as you switch tabs, rather than use the stored bond position.

== After power loss, if the ultrasound generator lights are red ==
: Check the blue ultrasound generator software and reset the errors in each tab

== Stepper error ==
''This is only for the tool responsible, please do not proceed yourself if not authorised''

This error occurred after a very dramatic head crash (chip and QCAGE PCB were destroyed). The stepper was oscillating when pressing the <code>Home</code> button.

<code>StepperException: timout waiting for idle during homing</code>
<div class="toccolours mw-collapsible mw-collapsed" style="overflow:auto;">
<div style="line-height:1.6;"> '''Here is the response from the bondtec engineers:'''</div>
<div class="mw-collapsible-content">
It looks like your clamp is misaligned, pressing against the Bondtool and needs to be adjusted.

You can try to adjust the clamp by loosening the allen screw and then rotating the clamp.

[[File:Screw_bonder.png|thumb|left]]
</div></div>

== Other errors ==
: Most other problems can be resolved by saving and restarting the 5630 program. But please take a screenshot and report the problem to the [[About|cleanroom staff]]: [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].

=Bondprogramme setup=

==First-time bondprogramme setup==
## "Create Program Dialog" box appears.
## Data source: Create from default value: 25 um
# Use the joystick to move to the bonding pads on the daughterboard (not your chip): It should be at least 5 mm away from any screws or connectors.
# "Global Camera setting": Adjust Gain and Shutter to make the daughter board visible.
# Adjust head height to see the PCB in focus: press button on joystick, tilt joystick down <i>slowly</i>
# <code>Next</code>
# <code>Store trace - 6</code> to set "Workheight1"
# <code>Store trace - 6</code> to set "Workheight2"
# Bring the bonding head halfway down (no closer than 5 mm above the highest point of any screws)
# <code>Store trace - 6</code> to set "Joystick Limit"
# <code>Store trace - 6</code> to set "max z position"
## The head will touch down on the PCB and adjust the height. Note that the head might leave a small mark where it touches down.
## In all of these four states you don’t need to move the stage or change the height of the head (except height for "joystick limit").
# <code>Next</code>
# <code>File > Save as...</code> to save your bonding program.
## Please make a folder for yourself in the ''users'' folder.
<blockquote style="background-color: #F0F0F0; border: dashed thin grey;">
'''Bonding parameter suggestions'''
* Bond force: 30
* US power: 60
* Total bond time: 30
* Other parameters default

''You can change these parameters later ant any point before/during/after bonding.''

''You are encouraged to look up parameters that previous users have used on similar surfaces.''
</blockquote>

== Reuse a bondprogramme (single wire mode) ==

#: Load selected program "File > Open" <p>'''Warning:''' It is usually safe to load any program written for the specific sample holder you are using (standard thickness brass block is 10mm). If you have a PCB with additional features e.g. capacitors or extra tall connectors beware when loading programs, the last bond position (to which the bonder will drive directly when you open the bonding dialog) may be INSIDE one of your tall features. It is safest to load the program first, open the bonding dialog, and check the bond head position and height and then go to "Home position" to load your sample/PCB. If in doubt, ask an experienced user or a member of staff.</p>
# If required select "Single Wire" mode.
# Press <code>Bond - F1</code> to bring up the Bonding Dialog...
# '''It is very strongly recommended that you perform a touch down to verify the height of your chip and PCB before you start bonding'''. If you don't and you are unlucky you may damage your chip and/or bend the bondhead! You have been warned!
## Adjust Bond1 focus and light settings until you can see the PC in reasonably sharp focus.
## Drag and drop the Bond1 position to a suitable touchdown location (e.g. Bond pad at least 5mm away from any connectors - remember the rear of the wedge.)
## Click to place the cursor in the "Height" box
## Press <code>Store Trace - 6</code>, bondhead will now touch down and update both the bond height and the focus height for Bond1.
## Switch to Bond2 tab and repeat steps 2-4. Note the touch down will probably leave a small mark so select a location (e.g. Off-mesa/blank space) where you do not actually want to bond.
# Drag and drop the bond end points and <code>Bond - F1</code> as normal.

= Maintenance =
== Weight calibration ==
=== Procedure ===
# Place a digital weighing scale on the bonder sample holder. You will need a scale with a range over 200 g.
# Make a new bond program for the height of the scale.
# Bonder software: <code>Mode > Head calibration</code>
# In BW-Calib tab:
## Weight point 1: <code>Store trace - 6</code>
### Wedge comes down and presses on the scale.
### Update weight point 1.
## Weight point 2: <code>Store trace - 6</code>
### Wedge comes down and presses on the scale.
### Update weight point 2.
## Repeat until both weights are accurate within 1 g.

=== Calibration test ===
# Open the bond program for the scale.
# <code>F1</code> to open the bonding window.
# Click on <code>Bond1</code>.
# Set the bonding force to e.g. 25 g and US power to 0.
# Change to step mode with <code>F2</code>.
# <code>F1</code> to go through the bonding steps until the head presses on the scale.
# Verify that the weight is within 1 g, otherwise repeat the procedure.

== Check the transducer values ==
After initializing check which TD sensor value you have.
You can find this value (Adc0) under <code>Page>Bhc IO's</code>
Check the value and also the value when you enter 0 in Bondforce and click on set.
{| class="wikitable"
|-
! Bondweight!! Adc0
|-
| 0 || 24873
|-
| 30 || 21885
|}

== Cleaning recipe for clogged wedges==
# 15 min Acetonce sonication at 35°C, 37kHz and 50% power (in a glass beaker)
# 5 min IPA sonication at 35°C, 37kHz and 50% power
# 5 min IPA
# Blow dry with N2 gun
# Blow dry with hot air
# Optical inspection of the wedges at the microscope located on the left side of the bonder
20 Aug 2024: '''Nader, Harry''' out of approx 35 wedges, only 4 were clogged after cleaning.

[[Category:Tools]]

Training

2026-06-29T11:17:56Z

Harry: /* Manual bonder */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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<div class="mw-collapsible-content">
* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
</div>
</div>

== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
<div class="mw-collapsible mw-collapsed" style="border:1px solid #d8dde3; border-left:6px solid #72777d; background:#f8f9fa; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
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<div class="mw-collapsible-content">
* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
</div>
</div>

== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b8e2d5; border-left:6px solid #14866d; background:#f2fbf8; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
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<div class="mw-collapsible-content">
==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
</div>
</div>

=== Elionix F-125 (125 kV at QuanTech) ===
More information will be provided shortly.
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<div class="mw-collapsible-content">
</div>
</div>

=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b8e2d5; border-left:6px solid #14866d; background:#f2fbf8; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
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<div class="mw-collapsible-content">
* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
</div>
</div>

== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== JEOL 7800F Prime SEM ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

=== Woollam alpha-SE Ellipsometer ===
More information will be provided shortly.
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</div>
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=== Filmetrics reflectometer ===
More information will be provided shortly.
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
</div>
</div>

=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
</div>
</div>

=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
</div>
</div>

== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
</div>
</div>

=== Manual bonder ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety
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== Miscellaneous ==

=== Micromanipulator ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety and verify that the user is aware of the dangers of working with nanoparticles.
==== Before you start your training sessions====
* You need to carefully read and familiarise yourself with the risks of exposure while [[Working with nanowires and nanotubes]]
</div>
</div>

[[Category:Tools]]

AJA systems

2026-06-29T10:11:16Z

Harry: /* Oxidation in loadlock */

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Harry
|secondary = Martin
}}
''Page last updated: 22 Jun 2026''

There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside. Oxidation chamber on the loadlock.
* System 2: One regular 2" DC sputtering target, one 3" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10<sup>-8</sup> Torr and 6x10<sup>-8</sup> Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.
The chamber vacuum is monitored periodically by shutting the cryo-valve and recording the rise of pressure rise for 10 mins. The ''rate-of-rise'' history is provided here [link].

Service notes and troubleshooting issues are all gathered in the dedicated [[AJA service]] page. Maintenance logs are collected in the Excel czar log page.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2024 July 2):

{|
|-
|
{| class="wikitable"
|-
! AJA1 !! Material !! Liner !! Thickness limit
|-
| 1 || Al || Intermetallic ||
|-
| 2 || Ti1 || Fabmate ||
|-
| 3 || SiOx || Tungsten ||
|-
| 4 || Au2 || Tungsten ||
|-
| 5 || Ge || Fabmate ||
|-
| 6 || Pt || FabMate || 200 nm*
|-
| DC1 || W || -- ||
|-
| DC2 || Nb<sub>2</sub>Ti || -- ||
|-
|}
|
<span style="display:inline-block; width: 20px;"></span>
|
{| class="wikitable"
|-
! AJA2 !! Material !! Liner !! Thickness limit
|-
| 1 || Pt || Tungsten || 200 nm*
|-
| 2 || Au2 || FabMate ||
|-
| 3 || Al || Intermetallic ||
|-
| 4 || Ti || intermetallic ||
|-
| 5 || Pd || FabMate ||
|-
| 6 || Cr || FabMate ||
|-
| DC1 || Ti || -- ||
|-
| RF2 || Mo || -- ||
|-
| RF3
| Nb<sub>2</sub>Ti || -- ||
|-
|}
|-
|}

Notes:
* If you need to deposit a thicker layer, you need to book enough time for the cryo pump to reach base temperature before continuing with a second layer.
* When you make a booking, you have to select if your deposition includes gold. If yes, you will be asked to fill out the total Au thickness you plan to deposit.
=== Other available materials ===
'''Evaporation''': SiO<sub>2</sub>, MgB<sub>2</sub>, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb<sub>2</sub>Ti<sub>1</sub>, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si<sub>3</sub>N<sub>4</sub>, Ta, Nb<sub>4</sub>Ti<sub>1</sub>, Nb

There is a big [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm compatibility chart] next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

= Instruction videos =

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

= Standard operating procedures =

==System pre-checks==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
* Check the cryo-pump monitor. It should be between '''12-17 K'''. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is '''1500 Hz'''. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is '''<1x10<sup>-7</sup> Torr'''.
*:'''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is '''closed'''.

==Which holder are you using?==
<div style="background-color: #17a2b8; border: 1px solid #1491A5; padding: 10px; border-radius: 5px;">
===AJA1 holders===
* General holder with modular brackets (kept inside the load lock)
* General holder for 4" wafers
* Sputtering holder: Use only for sputtering
===AJA2 holders===
* Au holder (kept inside the load lock)
*: '''If your entire process ends with Au deposition, use the dedicated Au sample holder'''
* General holder
*: '''If your process doesn't end with Au, but any other material, use the generic sample holder'''
* NbTiN holder: Use only for RF3 sputtering of NbTiN
''All the holders are being kept in the N<sub>2</sub> cabinet in the Process Lab 213''
</div>
</div>

==Loading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
#: Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Load your chip either using the mechanical clamps or the double-sided Kapton tape.
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Wait until the chamber pressure goes down to 3x10<sup>-6</sup> Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
# Open the gate valve between the main chamber and the load lock.
# Load the sample holder in the main chamber.
#* AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
#* AJA2: Screw in the sample holder into the stage.
#: Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
# Close the load lock gate valve.
# Check main chamber vacuum.
# Check cryo pump temperature.
</div>

==Unloading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Rotate the sample to the correct position (same orientation as the beginning of the loading procedure).
# Open the gate valve between the main chamber and the load lock.
# Remove the sample holder from the main chamber.
# Close the load lock gate valve.
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Take your sample
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Fill out the Excel log file.
# Clean up after yourself. If the workstation is found untidy, be proactive and leave the setup neat as it is supposed to be.
</div>

==Evaporating metal==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading posion'''
# Choose the material on the linear crucible drive as well as on the deposition controller.
# Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
#: This exposes the metal to be evaporated.
#: '''If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!'''
# Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
# Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
#: '''Be very sure that you have opened the e-beam shutter.'''
# Two clicks of the knob and the current set point is set to 4 mA.
#: Wait until the current increases to this value.
# Can you see the bright spot where the beam hits the metal in the crucible?
# Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
#: In the dedicated page for ''materials evaporation'', you can read more information for each material that you can evaporate in the cleanroom.
# Consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
# Ramp the current up at about '''1 click/15 seconds''' to half the value (typically around 20mA).
# Let it sit at that value for 2 mins while the metal soaks (''thermal soaking'') and thermally equilibrates.
#: Too fast and you'll crack the crucible liner or your evaporated metal film will be rough.
# Continue ramping '''1 click/15 seconds''' while monitoring the deposition rate:
#: 1 Å/s is a good rate for metal film evaporation. Try and stay around this value.
# When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
#: The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronising the zero with the shutter opening.
# Wait until the right thickness is evaporated.
# Close the substrate shutter.
# Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds).
#: '''Don't be too quick about it.''' We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
# Turn off the high voltage on the hand remote.
# Wait 2-3 mins for the metal to cool down before moving over to the next metal or finishing your process.
#: '''The metal inside the crucible should stop glowing.'''
# If you're done, turn off the Carrera voltage supply.
# Close the e-beam shutter, '''if the metal is no longer red hot'''.
</div>

==AJA1: Kaufman ion milling==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the sample to face the ion milling gun.
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: ''apex'')
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# In the program, click on the <code>Ion gas</code> button. It should turn green. This diverts the Ar gas flow to the gun.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) according to your recipe.
# In the program, select the <code>Pressure</code> button and set the value according to your recipe.
# Select <code>Pressure</code> button and set the value according to your recipe.
#: A [https://en.wikipedia.org/wiki/PID_controller ''PID-controlled''] gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
# Turn on the Kaufman source controller power supply by physically flicking the switch.
# On the PC at the preparation table, there are several shortcuts to scripts.
#: Execute the relevant beam voltage script (100 V or 300 V) according to your recipe and confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.
#: Wait till the script is done.
# Go back to the laptop.
# Click on the small <code>Output</code> button to turn on the gun.
#: This fires the Ar ions. The ion source shutter still protects your sample.
# Wait for the indicator to turn purple.
# Wait for 2 mins
# Start your timer and open the shutter with the big <code>Shutter</code> button.
#: '''You are now milling.'''
# Click on the big <code>Shutter</code> button to stop the milling.
# Click on the small <code>Output</code> button to turn off the gun (it should turn red).
# Wait for 2 mins while the gun cools down.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# In the program, click on the <code>Ion gas</code> button.
# Turn off the Kaufman source controller power supply by physically flicking the switch.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Proceed with evaporating metal or unloading your sample following the guidelines.
</div>

==AJA2: RF milling (auto - RF1)==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the RF1 power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
#: Your recipe will start automatically
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.

===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

'''Chamber conditioning'''
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the RF1 stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: ''Max set pt is 50 W''
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are milling'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 25 W.
# Once the system ramps down to 25 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

==AJA1 & AJA2: Sputtering metals==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
#: '''Note:''' ''The sputter sources are angled a bit. 10-20 degrees might give you a more head on sputtering.''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the relevant power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the power source unit.
# Fill out the Excel log file.
# Proceed with any other steps or unload.
===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

'''Important warning before you start: For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!'''

'''Striking the plasma'''
# Open the substrate shutter. The sputter sources have individual shutters.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the power stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are sputtering'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 50 W.
# Once the system ramps down to 50 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

== Oxidation in loadlock ==
AJA1 is equipped with all the necessary gas lines and pressure gauges to oxidise the surface of a sample in the loadlock.

However, currently, the oxygen bottle is not connected. Please contact the cleanroom staff responsible for AJA to request a training on this tool feature.

<div class="mw-collapsible mw-collapsed" style="border:1px solid #ce4e4a; border-left:6px solid #ce4e4a; background:#ce4e4a; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.
</div>
</div>



==Troubleshooting==

Having trouble with the tool? Please contact the tool responsible from the cleanroom.

If you feel comfortable, please consult the troubleshooting guide below:
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<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

; Unable to ignite the plasma (either DC, RF or ion plasma)?
:* Start by checking for shorts between pins on the power supply input, on the sputtering arm/ion source.

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in the crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on the remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters the [[AJA service#Phase II J software configurations |Phase II J software configurations]].
:: user: apex
</div>
</div>
[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2026-06-29T10:10:56Z

Harry: /* Oxidation in loadlock */

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Harry
|secondary = Martin
}}
''Page last updated: 22 Jun 2026''

There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside. Oxidation chamber on the loadlock.
* System 2: One regular 2" DC sputtering target, one 3" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10<sup>-8</sup> Torr and 6x10<sup>-8</sup> Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.
The chamber vacuum is monitored periodically by shutting the cryo-valve and recording the rise of pressure rise for 10 mins. The ''rate-of-rise'' history is provided here [link].

Service notes and troubleshooting issues are all gathered in the dedicated [[AJA service]] page. Maintenance logs are collected in the Excel czar log page.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2024 July 2):

{|
|-
|
{| class="wikitable"
|-
! AJA1 !! Material !! Liner !! Thickness limit
|-
| 1 || Al || Intermetallic ||
|-
| 2 || Ti1 || Fabmate ||
|-
| 3 || SiOx || Tungsten ||
|-
| 4 || Au2 || Tungsten ||
|-
| 5 || Ge || Fabmate ||
|-
| 6 || Pt || FabMate || 200 nm*
|-
| DC1 || W || -- ||
|-
| DC2 || Nb<sub>2</sub>Ti || -- ||
|-
|}
|
<span style="display:inline-block; width: 20px;"></span>
|
{| class="wikitable"
|-
! AJA2 !! Material !! Liner !! Thickness limit
|-
| 1 || Pt || Tungsten || 200 nm*
|-
| 2 || Au2 || FabMate ||
|-
| 3 || Al || Intermetallic ||
|-
| 4 || Ti || intermetallic ||
|-
| 5 || Pd || FabMate ||
|-
| 6 || Cr || FabMate ||
|-
| DC1 || Ti || -- ||
|-
| RF2 || Mo || -- ||
|-
| RF3
| Nb<sub>2</sub>Ti || -- ||
|-
|}
|-
|}

Notes:
* If you need to deposit a thicker layer, you need to book enough time for the cryo pump to reach base temperature before continuing with a second layer.
* When you make a booking, you have to select if your deposition includes gold. If yes, you will be asked to fill out the total Au thickness you plan to deposit.
=== Other available materials ===
'''Evaporation''': SiO<sub>2</sub>, MgB<sub>2</sub>, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb<sub>2</sub>Ti<sub>1</sub>, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si<sub>3</sub>N<sub>4</sub>, Ta, Nb<sub>4</sub>Ti<sub>1</sub>, Nb

There is a big [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm compatibility chart] next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

= Instruction videos =

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

= Standard operating procedures =

==System pre-checks==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
* Check the cryo-pump monitor. It should be between '''12-17 K'''. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is '''1500 Hz'''. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is '''<1x10<sup>-7</sup> Torr'''.
*:'''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is '''closed'''.

==Which holder are you using?==
<div style="background-color: #17a2b8; border: 1px solid #1491A5; padding: 10px; border-radius: 5px;">
===AJA1 holders===
* General holder with modular brackets (kept inside the load lock)
* General holder for 4" wafers
* Sputtering holder: Use only for sputtering
===AJA2 holders===
* Au holder (kept inside the load lock)
*: '''If your entire process ends with Au deposition, use the dedicated Au sample holder'''
* General holder
*: '''If your process doesn't end with Au, but any other material, use the generic sample holder'''
* NbTiN holder: Use only for RF3 sputtering of NbTiN
''All the holders are being kept in the N<sub>2</sub> cabinet in the Process Lab 213''
</div>
</div>

==Loading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
#: Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Load your chip either using the mechanical clamps or the double-sided Kapton tape.
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Wait until the chamber pressure goes down to 3x10<sup>-6</sup> Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
# Open the gate valve between the main chamber and the load lock.
# Load the sample holder in the main chamber.
#* AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
#* AJA2: Screw in the sample holder into the stage.
#: Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
# Close the load lock gate valve.
# Check main chamber vacuum.
# Check cryo pump temperature.
</div>

==Unloading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Rotate the sample to the correct position (same orientation as the beginning of the loading procedure).
# Open the gate valve between the main chamber and the load lock.
# Remove the sample holder from the main chamber.
# Close the load lock gate valve.
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Take your sample
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Fill out the Excel log file.
# Clean up after yourself. If the workstation is found untidy, be proactive and leave the setup neat as it is supposed to be.
</div>

==Evaporating metal==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading posion'''
# Choose the material on the linear crucible drive as well as on the deposition controller.
# Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
#: This exposes the metal to be evaporated.
#: '''If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!'''
# Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
# Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
#: '''Be very sure that you have opened the e-beam shutter.'''
# Two clicks of the knob and the current set point is set to 4 mA.
#: Wait until the current increases to this value.
# Can you see the bright spot where the beam hits the metal in the crucible?
# Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
#: In the dedicated page for ''materials evaporation'', you can read more information for each material that you can evaporate in the cleanroom.
# Consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
# Ramp the current up at about '''1 click/15 seconds''' to half the value (typically around 20mA).
# Let it sit at that value for 2 mins while the metal soaks (''thermal soaking'') and thermally equilibrates.
#: Too fast and you'll crack the crucible liner or your evaporated metal film will be rough.
# Continue ramping '''1 click/15 seconds''' while monitoring the deposition rate:
#: 1 Å/s is a good rate for metal film evaporation. Try and stay around this value.
# When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
#: The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronising the zero with the shutter opening.
# Wait until the right thickness is evaporated.
# Close the substrate shutter.
# Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds).
#: '''Don't be too quick about it.''' We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
# Turn off the high voltage on the hand remote.
# Wait 2-3 mins for the metal to cool down before moving over to the next metal or finishing your process.
#: '''The metal inside the crucible should stop glowing.'''
# If you're done, turn off the Carrera voltage supply.
# Close the e-beam shutter, '''if the metal is no longer red hot'''.
</div>

==AJA1: Kaufman ion milling==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the sample to face the ion milling gun.
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: ''apex'')
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# In the program, click on the <code>Ion gas</code> button. It should turn green. This diverts the Ar gas flow to the gun.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) according to your recipe.
# In the program, select the <code>Pressure</code> button and set the value according to your recipe.
# Select <code>Pressure</code> button and set the value according to your recipe.
#: A [https://en.wikipedia.org/wiki/PID_controller ''PID-controlled''] gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
# Turn on the Kaufman source controller power supply by physically flicking the switch.
# On the PC at the preparation table, there are several shortcuts to scripts.
#: Execute the relevant beam voltage script (100 V or 300 V) according to your recipe and confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.
#: Wait till the script is done.
# Go back to the laptop.
# Click on the small <code>Output</code> button to turn on the gun.
#: This fires the Ar ions. The ion source shutter still protects your sample.
# Wait for the indicator to turn purple.
# Wait for 2 mins
# Start your timer and open the shutter with the big <code>Shutter</code> button.
#: '''You are now milling.'''
# Click on the big <code>Shutter</code> button to stop the milling.
# Click on the small <code>Output</code> button to turn off the gun (it should turn red).
# Wait for 2 mins while the gun cools down.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# In the program, click on the <code>Ion gas</code> button.
# Turn off the Kaufman source controller power supply by physically flicking the switch.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Proceed with evaporating metal or unloading your sample following the guidelines.
</div>

==AJA2: RF milling (auto - RF1)==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the RF1 power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
#: Your recipe will start automatically
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.

===Do you want to run in manual mode?===
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'''Chamber conditioning'''
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the RF1 stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: ''Max set pt is 50 W''
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are milling'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 25 W.
# Once the system ramps down to 25 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

==AJA1 & AJA2: Sputtering metals==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
#: '''Note:''' ''The sputter sources are angled a bit. 10-20 degrees might give you a more head on sputtering.''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the relevant power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the power source unit.
# Fill out the Excel log file.
# Proceed with any other steps or unload.
===Do you want to run in manual mode?===
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'''Important warning before you start: For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!'''

'''Striking the plasma'''
# Open the substrate shutter. The sputter sources have individual shutters.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the power stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are sputtering'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 50 W.
# Once the system ramps down to 50 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

== Oxidation in loadlock ==
AJA1 is equipped with all the necessary gas lines and pressure gauges to oxidise the surface of a sample in the loadlock.

However, currently, the oxygen bottle is not connected. Please contact the cleanroom staff responsible for AJA to request a training on this tool feature.

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The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.
<div>
<div>



==Troubleshooting==

Having trouble with the tool? Please contact the tool responsible from the cleanroom.

If you feel comfortable, please consult the troubleshooting guide below:
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; Unable to ignite the plasma (either DC, RF or ion plasma)?
:* Start by checking for shorts between pins on the power supply input, on the sputtering arm/ion source.

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in the crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on the remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters the [[AJA service#Phase II J software configurations |Phase II J software configurations]].
:: user: apex
</div>
</div>
[[Category:Tools]]
[[Category:Deposition]]

Training

2026-06-26T13:55:04Z

Harry: /* Micromanipulator */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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</div>

== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
</div>
</div>

== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
</div>
</div>

=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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</div>

=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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</div>

== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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</div>

=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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</div>

=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Apply for sign-off via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].

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* Cleanroom doesn't train users in this tool.
* You need to get trained within your research group.
* Cleanroom will provide a sign-off session to ensure safety and verify that the user is aware of the dangers of working with nanoparticles.
==== Before you start your training sessions====
* You need to carefully read and familiarise yourself with the risks of exposure while [[Working with nanowires and nanotubes]]
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[[Category:Tools]]

Training

2026-06-26T13:49:25Z

Harry: /* ALD1 and ALD2 */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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</div>

=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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</div>

=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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</div>

=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T13:49:18Z

Harry: /* AJA1 and AJA2: metallization, sputtering or ion milling */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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</div>

== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T13:49:10Z

Harry: /* Plassys Evaporator */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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</div>

=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]..
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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</div>

== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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</div>

=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T13:48:57Z

Harry: /* AJA1 and AJA2: metallization, sputtering or ion milling */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]..
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T13:48:49Z

Harry: /* ALD1 and ALD2 */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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</div>

=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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</div>

[[Category:Tools]]

Training

2026-06-26T13:48:36Z

Harry: /* F&S autobonder */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical Handling==

=== HF Safety Training ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The HF Safety introduction is offered on a monthly basis.
* Training sessions are conducted in groups of up to 4 participants.
* Once a training date has been proposed by the Cleanroom staff, participants must confirm their attendance by email.
* Users are required to complete the HF Handling Questionnaire (that you will receive from a Cleanroom staff) and submit it to the instructor during the training session.
* Each user must also designate an HF buddy. This person must be an authorized Cleanroom user with valid HF access and training.
* As HF handling involves significant safety risks, strict compliance to all safety requirements is mandatory.
* Users are expected to arrive fully prepared for the training session.
* The instructor reserves the right to suspend or terminate the training if a participant has not completed the required preparation or does not demonstrate an adequate understanding of the relevant safety procedures.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form].
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T13:47:31Z

Harry: /* F&S autobonder */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical handling==

=== HF handling ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T13:47:10Z

Harry: /* F&S autobonder */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical handling==

=== HF handling ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
A semi-automatic bonder to bond semiconductor substrates to PCB daughterboards from F&S Bondtec.

Apply for training via the training form.

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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a '''chip''' ready for bonding.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* You must know which '''daughterboard''' you will use for bonding (CPH, QBOARD1,2, QCAGE, Sydney, IC, custom).
* You must know what material you use to '''mount''' the chip to the daughterboard (mechanical clamping, silver paint, PMMA, other).
* Confirm that you have prepared a '''bonding schematic''' .
* By default, this bonder is using Al wire. You can request a special training if you want to use Au wire, but be aware it can be challenging.
*: Users are more likely to use the [[K&S bonder| K&S manual bonder]] for Au wire bonding.
* Specify the name of the recipe.
====Before the training session====
* Read the standard operating procedure on the [[FS bonder| FS bonder tool page]]
* Verify with one of your colleagues that your bonding schematic is correct.
==== Training ====
You'll need 2 sessions to get trained on this tool.
* Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T13:23:52Z

Harry: /* ALD1 and ALD2 */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom General Introduction ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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</div>

=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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</div>

=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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</div>

=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T13:23:38Z

Harry: /* AJA1 and AJA2: metallization, sputtering or ion milling */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom General Introduction ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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</div>

=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
</div>
</div>

== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
</div>
</div>

=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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</div>

=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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</div>

== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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</div>

=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

[[Category:Tools]]

Training

2026-06-26T13:23:23Z

Harry: /* Plassys Evaporator */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form ([https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]). '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom General Introduction ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]). ''Expand to view more information''.
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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</div>

== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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</div>

== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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</div>

=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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</div>

== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Confirm that you have shadowed your colleagues using the tool 2-3 times.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
</div>
</div>

=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T13:15:00Z

Harry: /* Training */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]. '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom General Introduction ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]).
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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</div>

=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

[[Category:Tools]]

Training

2026-06-26T13:14:08Z

Harry: /* Plassys Evaporator */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]. '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom General Introduction ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]).
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
</div>
</div>

== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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</div>

== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T13:14:00Z

Harry: /* AJA1 and AJA2: metallization, sputtering or ion milling */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]. '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom General Introduction ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]).
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
</div>
</div>

== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
</div>
</div>

== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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</div>

=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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</div>

=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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</div>

== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication. Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T13:13:47Z

Harry: /* ALD1 and ALD2 */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]. '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom General Introduction ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]).
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication. Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling. Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition.

Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T13:13:30Z

Harry: /* AJA1 and AJA2: metallization, sputtering or ion milling */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]. '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom General Introduction ===
Before attending the training session, all users must read and familiarize themselves with the relevant safety information ([[Safety]]).
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* The introductory session is scheduled from 09:15 to 15:00.
* Training sessions are conducted in group of 3-4 participants. Once a training date has been proposed by the Cleanroom staff, participants are required to confirm their attendance by email ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]).
* If fewer than 3 participants are available for a scheduled session, an alternative training date may be proposed. If a session reaches its maximum capacity of 4 participants, additional users will be placed on a waiting list and offered the next available training opportunity.
* Please identify a superuser from your research group who will serve as your mentor during your first few weeks of working in the Cleanroom.
* The designated mentor is responsible for guiding you through the standard procedures and best practices after the Cleanroom General Introduction.
* Once the mentor has determined that you are competent to work independently, they must notify the Cleanroom team via email.
* Full access to the Cleanroom laboratories will only be granted after the Cleanroom team has received this confirmation.
* Standard Training Program:
** 09:15-10:30: Cleanroom introduction
** Coffee break
** 10:45-12:00: Asher, spinners and optical microscopes
** Lunch break
** 13:00-14:00: Practical information
** 14:00-15:00: Q&A and account setup
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== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
</div>
</div>

=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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</div>
</div>

=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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</div>

== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication. Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
</div>
</div>

=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Two nearly identical Orion physical vapour deposition (PVD) systems from AJA International for sputtering and e-beam evaporation, and substrate milling. Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* Which tool do you want to use?
** '''AJA1'''
*** e-beam materials: Ti, Al, Au, SiOx, Pt, Ti, Ge
*** DC sputtering: Nb2Ti, Ti
*** DC Kaufman milling
*** Oxidation
*** Stage rotation, no stage cooling
** '''AJA2'''
*** e-beam materials: Ti, Al, Au, Cr, Pt, Pd
*** DC sputtering: Ti
*** RF sputtering: Ti, Nb2Ti
*** RF milling
*** Stage cooling, no stage rotation
* Specify the process steps you want to run.
*: Either the name of the recipe or all required process parameters.

===Before the training session===
* Watch the instruction video(s)
*Read the standard operating procedure on the [[AJA Systems|AJA Systems tool page]].

==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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</div>

=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition. Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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</div>

== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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</div>

=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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</div>

[[Category:Tools]]

Training

2026-06-26T13:02:15Z

Harry: /* Plassys Evaporator */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]. '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom general introduction ===
Request cleanroom introduction training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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* Name a superuser from your group who will be your mentor for the first few weeks in the cleanroom.
* Introduction training requires acceptance from all of you and typically runs from 9.30 to 15.00.
* Before training, read the safety information: https://wiki.nbi.ku.dk/cleanroom/Safety
* Typical schedule:
** 9.15-10.30: Cleanroom introduction
** Coffee break
** 10.45-12.00: Asher, spinners, and optical microscopes
** Lunch break
** 13.00-14.00: Practical information inside and outside the lab
** 14.00-15.00: Q&A and account setup

The mentor will assist you in the first few weeks after your safety/introduction training. The mentor should teach you the standard processes used in the group until you are both comfortable that you can work independently.
When the mentor has assessed that you are ready to work independently, they must inform the cleanroom team and '''only then will you get full access to cleanroom labs'''.
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</div>

== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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</div>

=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
</div>
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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</div>

=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
</div>
</div>

== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication. Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 (2 hr.) - sign off session
'''The instructor has the right to ask for additional training sessions.'''
</div>
</div>

=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Email your training request with shadowing, sample, tool, process, and recipe details for AJA.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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</div>

=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition. Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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</div>

== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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</div>

=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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</div>

[[Category:Tools]]

Training

2026-06-26T13:00:14Z

Harry: /* ALD1 and ALD2 */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]. '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom general introduction ===
Request cleanroom introduction training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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* Name a superuser from your group who will be your mentor for the first few weeks in the cleanroom.
* Introduction training requires acceptance from all of you and typically runs from 9.30 to 15.00.
* Before training, read the safety information: https://wiki.nbi.ku.dk/cleanroom/Safety
* Typical schedule:
** 9.15-10.30: Cleanroom introduction
** Coffee break
** 10.45-12.00: Asher, spinners, and optical microscopes
** Lunch break
** 13.00-14.00: Practical information inside and outside the lab
** 14.00-15.00: Q&A and account setup

The mentor will assist you in the first few weeks after your safety/introduction training. The mentor should teach you the standard processes used in the group until you are both comfortable that you can work independently.
When the mentor has assessed that you are ready to work independently, they must inform the cleanroom team and '''only then will you get full access to cleanroom labs'''.
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== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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</div>

== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication. Apply for training via the training form.
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Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Email your training request with shadowing, sample, tool, process, and recipe details for AJA.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition. Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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</div>

=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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</div>

[[Category:Tools]]

Training

2026-06-26T12:59:43Z

Harry: /* ALD1 and ALD2 */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]. '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom general introduction ===
Request cleanroom introduction training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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* Name a superuser from your group who will be your mentor for the first few weeks in the cleanroom.
* Introduction training requires acceptance from all of you and typically runs from 9.30 to 15.00.
* Before training, read the safety information: https://wiki.nbi.ku.dk/cleanroom/Safety
* Typical schedule:
** 9.15-10.30: Cleanroom introduction
** Coffee break
** 10.45-12.00: Asher, spinners, and optical microscopes
** Lunch break
** 13.00-14.00: Practical information inside and outside the lab
** 14.00-15.00: Q&A and account setup

The mentor will assist you in the first few weeks after your safety/introduction training. The mentor should teach you the standard processes used in the group until you are both comfortable that you can work independently.
When the mentor has assessed that you are ready to work independently, they must inform the cleanroom team and '''only then will you get full access to cleanroom labs'''.
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== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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</div>

== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication. Apply for training via the training form.
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Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Email your training request with shadowing, sample, tool, process, and recipe details for AJA.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition. Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
'''The instructor has the right to ask for additional training sessions.'''
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== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

[[Category:Tools]]

Training

2026-06-26T12:59:19Z

Harry: /* ==Confirmation */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]. '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom general introduction ===
Request cleanroom introduction training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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* Name a superuser from your group who will be your mentor for the first few weeks in the cleanroom.
* Introduction training requires acceptance from all of you and typically runs from 9.30 to 15.00.
* Before training, read the safety information: https://wiki.nbi.ku.dk/cleanroom/Safety
* Typical schedule:
** 9.15-10.30: Cleanroom introduction
** Coffee break
** 10.45-12.00: Asher, spinners, and optical microscopes
** Lunch break
** 13.00-14.00: Practical information inside and outside the lab
** 14.00-15.00: Q&A and account setup

The mentor will assist you in the first few weeks after your safety/introduction training. The mentor should teach you the standard processes used in the group until you are both comfortable that you can work independently.
When the mentor has assessed that you are ready to work independently, they must inform the cleanroom team and '''only then will you get full access to cleanroom labs'''.
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== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
</div>
</div>

== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication. Apply for training via the training form.
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Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Email your training request with shadowing, sample, tool, process, and recipe details for AJA.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition. Apply for training via the training form.
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====Confirmation====
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
The instructor has the right to ask for additional training sessions.
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== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T12:58:46Z

Harry: /* ALD1 and ALD2 */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form [https://forms.office.com/e/b3PDKjsZ88?origin=lprLink NBI-Cleanroom Training Request Form]. '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom general introduction ===
Request cleanroom introduction training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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* Name a superuser from your group who will be your mentor for the first few weeks in the cleanroom.
* Introduction training requires acceptance from all of you and typically runs from 9.30 to 15.00.
* Before training, read the safety information: https://wiki.nbi.ku.dk/cleanroom/Safety
* Typical schedule:
** 9.15-10.30: Cleanroom introduction
** Coffee break
** 10.45-12.00: Asher, spinners, and optical microscopes
** Lunch break
** 13.00-14.00: Practical information inside and outside the lab
** 14.00-15.00: Q&A and account setup

The mentor will assist you in the first few weeks after your safety/introduction training. The mentor should teach you the standard processes used in the group until you are both comfortable that you can work independently.
When the mentor has assessed that you are ready to work independently, they must inform the cleanroom team and '''only then will you get full access to cleanroom labs'''.
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== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication. Apply for training via the training form.
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Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Email your training request with shadowing, sample, tool, process, and recipe details for AJA.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition. Apply for training via the training form.
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====Confirmation==
Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
* Session 1 (30 mins) - teaches you how to load/unload the sample and how to run a recipe.
* Session 2 (30 mins) - sign off session
*: '''Note:''' An ALD session can have a long duration (often >12 hours). A usual training starts in the afternoon (load, setup, prepare recipe, run), and the film will grow throughout the evening. The next day, the user and the instructor will finish the training session (unloading).
The instructor has the right to ask for additional training sessions.
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== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-26T12:51:14Z

Harry: /* ALD1 and ALD2 */

Before submitting a training request, please review the prerequisites for each instrument listed below.

Starting in July 2026, a standardized training request form will be introduced. The new system will allow users to request training for multiple instruments using a single form [[Link:https://forms.office.com/e/b3PDKjsZ88?origin=lprLink]]. '''Please only request training for instruments that require immediate access'''. Following submission of the request form, email communication will continue to be used for scheduling and coordinating training activities. The Cleanroom staff will acknowledge and respond to training requests within 1-2 working days.

Please note that access to the Cleanroom, tool laboratories and individual instruments can only be granted after the required safety instructions and instrument training have been completed and approved by the Cleanroom staff. Upon successful completion of the training, users will be granted booking privileges through the Cleanroom Booking System.

To ensure continued competency and safe operation, booking privileges and laboratory access may expire after a period of inactivity (typically '''90 days''') for a given instrument or Cleanroom usage. In such cases, users will be required to complete a refresher training session before access can be reinstated.

== Cleanroom General Introduction ==

=== Cleanroom general introduction ===
Request cleanroom introduction training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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* Name a superuser from your group who will be your mentor for the first few weeks in the cleanroom.
* Introduction training requires acceptance from all of you and typically runs from 9.30 to 15.00.
* Before training, read the safety information: https://wiki.nbi.ku.dk/cleanroom/Safety
* Typical schedule:
** 9.15-10.30: Cleanroom introduction
** Coffee break
** 10.45-12.00: Asher, spinners, and optical microscopes
** Lunch break
** 13.00-14.00: Practical information inside and outside the lab
** 14.00-15.00: Q&A and account setup

The mentor will assist you in the first few weeks after your safety/introduction training. The mentor should teach you the standard processes used in the group until you are both comfortable that you can work independently.
When the mentor has assessed that you are ready to work independently, they must inform the cleanroom team and '''only then will you get full access to cleanroom labs'''.
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== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
</div>
</div>

== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication. Apply for training via the training form.
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Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
</div>
</div>

=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Email your training request with shadowing, sample, tool, process, and recipe details for AJA.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
</div>
</div>

=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition. Apply for training via the training form.
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Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* Specify the process steps you want to run.
** Either the name of the recipe or all required process parameters.
====Before the training session====
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
====Training====
You'll need 2 sessions to get trained on this tool.
Session 1 (2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
Session 2 (2 hr.) - sign off session
The instructor has the right to ask for additional training sessions.
</div>
</div>

== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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</div>

=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

[[Category:Tools]]

Training

2026-06-26T12:45:16Z

Harry: /* PLASSYS Evaporator */

A prerequisite for using the cleanroom [[Tools|tools]] is that a [[About|cleanroom staff]] member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system].
However, after a certain period of inactivity (typically 90 days) on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Cleanroom General Introduction ==

=== Cleanroom general introduction ===
Request cleanroom introduction training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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* Name a superuser from your group who will be your mentor for the first few weeks in the cleanroom.
* Introduction training requires acceptance from all of you and typically runs from 9.30 to 15.00.
* Before training, read the safety information: https://wiki.nbi.ku.dk/cleanroom/Safety
* Typical schedule:
** 9.15-10.30: Cleanroom introduction
** Coffee break
** 10.45-12.00: Asher, spinners, and optical microscopes
** Lunch break
** 13.00-14.00: Practical information inside and outside the lab
** 14.00-15.00: Q&A and account setup

The mentor will assist you in the first few weeks after your safety/introduction training. The mentor should teach you the standard processes used in the group until you are both comfortable that you can work independently.
When the mentor has assessed that you are ready to work independently, they must inform the cleanroom team and '''only then will you get full access to cleanroom labs'''.
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</div>

== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
</div>
</div>

== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
</div>
</div>

=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
</div>
</div>

=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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</div>

== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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</div>

=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
</div>
</div>

=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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</div>

=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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</div>

=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
</div>
</div>

== Thin Film Deposition ==

=== Plassys Evaporator ===
A physical vapour deposition tool of aluminium via e-beam evaporation for Josephson junction fabrication. Apply for training via the training form.
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Once you sign up via the form, the tool responsible will contact you for the following details:
* Confirm that you have a sample ready.
* Specify process steps you want to run
*: Materials, thickness, tilt, milling, oxidation
* The name of the recipe.
==== Restrictions====
* Only Si and sapphire samples are allowed in the chamber.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
</div>
</div>

=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Email your training request with shadowing, sample, tool, process, and recipe details for AJA.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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</div>

=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition. Apply for training via the training form.
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Once you sign up via the form, the tool responsible will contact you and ask you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
Before the training session:
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
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</div>

== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
</div>
</div>

=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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</div>

== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

[[Category:Tools]]

Training

2026-06-26T12:35:59Z

Harry: /* Thin Film Deposition */

A prerequisite for using the cleanroom [[Tools|tools]] is that a [[About|cleanroom staff]] member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system].
However, after a certain period of inactivity (typically 90 days) on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Cleanroom General Introduction ==

=== Cleanroom general introduction ===
Request cleanroom introduction training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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* Name a superuser from your group who will be your mentor for the first few weeks in the cleanroom.
* Introduction training requires acceptance from all of you and typically runs from 9.30 to 15.00.
* Before training, read the safety information: https://wiki.nbi.ku.dk/cleanroom/Safety
* Typical schedule:
** 9.15-10.30: Cleanroom introduction
** Coffee break
** 10.45-12.00: Asher, spinners, and optical microscopes
** Lunch break
** 13.00-14.00: Practical information inside and outside the lab
** 14.00-15.00: Q&A and account setup

The mentor will assist you in the first few weeks after your safety/introduction training. The mentor should teach you the standard processes used in the group until you are both comfortable that you can work independently.
When the mentor has assessed that you are ready to work independently, they must inform the cleanroom team and '''only then will you get full access to cleanroom labs'''.
</div>
</div>

== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
</div>
</div>

== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
</div>
</div>

=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
</div>
</div>

=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
</div>
</div>

== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
</div>
</div>

=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
</div>
</div>

=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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</div>

== Thin Film Deposition ==

=== PLASSYS Evaporator ===
Email your PLASSYS request with shadowing, sample, and process parameters.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Specify the required process parameters( material, thickness, tilt etc)
* What is your project alias? If unsure, contact your supervisor first.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== AJA1 and AJA2: metallization, sputtering or ion milling ===
Email your training request with shadowing, sample, tool, process, and recipe details for AJA.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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</div>

=== ALD1 and ALD2===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition. Apply for training via the training form.
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Once you sign up via the form, the tool responsible will contact you and ask you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
Before the training session:
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
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</div>

== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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</div>

=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

[[Category:Tools]]

Training

2026-06-26T12:35:07Z

Harry: /* ALD 1 */

A prerequisite for using the cleanroom [[Tools|tools]] is that a [[About|cleanroom staff]] member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system].
However, after a certain period of inactivity (typically 90 days) on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Cleanroom General Introduction ==

=== Cleanroom general introduction ===
Request cleanroom introduction training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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* Name a superuser from your group who will be your mentor for the first few weeks in the cleanroom.
* Introduction training requires acceptance from all of you and typically runs from 9.30 to 15.00.
* Before training, read the safety information: https://wiki.nbi.ku.dk/cleanroom/Safety
* Typical schedule:
** 9.15-10.30: Cleanroom introduction
** Coffee break
** 10.45-12.00: Asher, spinners, and optical microscopes
** Lunch break
** 13.00-14.00: Practical information inside and outside the lab
** 14.00-15.00: Q&A and account setup

The mentor will assist you in the first few weeks after your safety/introduction training. The mentor should teach you the standard processes used in the group until you are both comfortable that you can work independently.
When the mentor has assessed that you are ready to work independently, they must inform the cleanroom team and '''only then will you get full access to cleanroom labs'''.
</div>
</div>

== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
</div>
</div>

== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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</div>

=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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</div>

=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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</div>

== Characterization ==

=== Bruker Dimension Icon AFM ===
Bruker Dimension Icon is an atomic force microscope used for high-resolution and accurate measurements of surface topography.
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* AFM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the AFM operating procedures ([[Bruker Dimension Icon AFM|AFM]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F SEM-EDS===
JEOL 7800F is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology and compositional analysis.
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* SEM-EDS training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== JEOL 7800F Prime SEM (QuanTech) ===
JEOL 7800F Prime is a field-emission scanning electron microscope used for high-resolution imaging of surface morphology.
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* SEM training is offered upon user request and is typically conducted on a one-on-one basis. Completion of the training usually requires 2-3 sessions, with each session lasting approximately 2-3 hours.
* Prior to attending the training sessions, users are expected to review and familiarize themselves with the SEM operating procedures ([[JEOL 7800F|JEOL JSM-7800F]]). Users are encouraged to shadow an authorized user on the instrument 2-3 times before starting formal training. In addition, having a suitable sample prepared in advance of the training is highly recommended.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
Training is usually 2-3 sessions of 2-hour per session.
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=== Thermo Fisher Scientific Talos F200i S/TEM ===
Talos F200i is a versatile 200-kV field-emission (scanning) transmission electron microscope designed for high-throughput, high-resolution materials characterization.
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* This instrument is classified as a high-level tool, and training is selective. Users are required to have prior experience with TEM/STEM before being considered for training. Cleanroom staff reserves the right to decline a training request if the prerequisite requirements are not met.
* Where appropriate and subject to staff availability and project timelines, a staff member may also assist in carrying out user projects.
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=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
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=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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== Thin Film Deposition ==

=== PLASSYS Evaporator ===
Email your PLASSYS request with shadowing, sample, and process parameters.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Specify the required process parameters( material, thickness, tilt etc)
* What is your project alias? If unsure, contact your supervisor first.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== AJA metallization, sputtering or ion milling ===
Email your training request with shadowing, sample, tool, process, and recipe details for AJA.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
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=== ALDs===
Two nearly identical Savannah S100-like systems are used for atomic layer deposition. Apply for training via the training form.
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Once you sign up via the form, the tool responsible will contact you and ask you for the following details:
* Confirm that you have a sample ready.
* Which tool do you want to use?
** '''ALD1''' available grown oxides: AlOx, HfOx, TiOx
** '''ALD2''' available grown oxides: AlOx, HfOx, ZrOx
** In ALD1, you are allowed to use resist for lift-off processes. In ALD2, '''you are not allowed to use a sample with resist on'''.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
Before the training session:
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].
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=== ALD 2 ===
Email your ALD 2 request with shadowing, sample, and full process details.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

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== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
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=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
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[[Category:Tools]]

Training

2026-06-25T11:15:23Z

Harry: /* Cleanroom general introduction */

A prerequisite for using the cleanroom [[Tools|tools]] is that a [[About|cleanroom staff]] member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system].
However, after a certain period of inactivity (typically 90 days) on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Cleanroom General Introduction ==

=== Cleanroom general introduction ===
Request cleanroom introduction training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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* Name a superuser from your group who will be your mentor for the first few weeks in the cleanroom.
* Introduction training requires acceptance from all of you and typically runs from 9.30 to 15.00.
* Before training, read the safety information: https://wiki.nbi.ku.dk/cleanroom/Safety
* Typical schedule:
** 9.15-10.30: Cleanroom introduction
** Coffee break
** 10.45-12.00: Asher, spinners, and optical microscopes
** Lunch break
** 13.00-14.00: Practical information inside and outside the lab
** 14.00-15.00: Q&A and account setup

The mentor will assist you in the first few weeks after your safety/introduction training. The mentor should teach you the standard processes used in the group until you are both comfortable that you can work independently.
When the mentor has assessed that you are ready to work independently, they must inform the cleanroom team and '''only then will you get full access to cleanroom labs'''.
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== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
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== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
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=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
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=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
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== Characterization ==

=== Bruker Dimension Icon Atomic Force Microscope (AFM) ===
Contact NBI-CR staff ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]) to request for AFM training.
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* Have a sample ready that you want to characterize. Think about what you want to learn about the sample: step height, roughness, etc.
* Only request for training if you plan on using the tool regularly.
* Training is usually 2-3 sessions of 2-hour per session.
* Staff can also carry out user projects, subject to availability and timeframe.
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=== JEOL 7800-F ===
Prepare a real sample and imaging goals before booking JEOL 7800-F training.
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* Training is usually 2-3 sessions of 2-hour per session.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.
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</div>

=== JEOL 7800-F prime (QuanTech) ===
Prepare a real sample and imaging goals before booking JEOL 7800-F Prime training.
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<div class="mw-collapsible-content">
* Training takes about 2-3 sessions.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
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<div class="mw-collapsible-content">
* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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</div>
</div>

=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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<div class="mw-collapsible-content">
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
</div>
</div>

== Thin Film Deposition ==

=== PLASSYS Evaporator ===
Email your PLASSYS request with shadowing, sample, and process parameters.
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<div class="mw-collapsible-content">
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Specify the required process parameters( material, thickness, tilt etc)
* What is your project alias? If unsure, contact your supervisor first.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
</div>
</div>

=== AJA metallization, sputtering or ion milling ===
Email your training request with shadowing, sample, tool, process, and recipe details for AJA.
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Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
</div>
</div>

=== ALD 1 ===
Email your ALD 1 request with shadowing, sample, and full process details.
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<div class="mw-collapsible-content">
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

</div>
</div>

=== ALD 2 ===
Email your ALD 2 request with shadowing, sample, and full process details.
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<div class="mw-collapsible-content">
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

</div>
</div>

== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
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<div class="mw-collapsible-content">
Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
</div>
</div>

=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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</div>

== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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<div class="mw-collapsible-content">
* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

[[Category:Tools]]

Training

2026-06-25T11:14:54Z

Harry: /* Cleanroom general introduction */

A prerequisite for using the cleanroom [[Tools|tools]] is that a [[About|cleanroom staff]] member has given the necessary instruction or training.
This includes basic instruments such as hotplates and microscopes.
For '''all''' training requests, please read the prerequisites below and afterwards contact [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
A cleanroom staff member will typically respond within one workday.
Do not contact individual staff members for training.

Once the user has completed the training, they are given booking rights in the [http://cleanroom.brickhost.com cleanroom booking system].
However, after a certain period of inactivity (typically 90 days) on a given tool, the booking rights will expire and the user will need to be retrained in order to continue using the tool.

== Cleanroom General Introduction ==

=== Cleanroom general introduction ===
Request cleanroom introduction training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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* Name a superuser from your group who will be your mentor for the first few weeks in the .
* Introduction training requires acceptance from all of you and typically runs from 9.30 to 15.00.
* Before training, read the safety information: https://wiki.nbi.ku.dk/cleanroom/Safety
* Typical schedule:
** 9.15-10.30: Cleanroom introduction
** Coffee break
** 10.45-12.00: Asher, spinners, and optical microscopes
** Lunch break
** 13.00-14.00: Practical information inside and outside the lab
** 14.00-15.00: Q&A and account setup

The mentor will assist you in the first few weeks after your safety/introduction training. The mentor should teach you the standard processes used in the group until you are both comfortable that you can work independently.
When the mentor has assessed that you are ready to work independently, they must inform the cleanroom team and '''only then will you get full access to cleanroom labs'''.
</div>
</div>

== Chemical handling==

=== HF handling ===
Request an HF handling training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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<div class="mw-collapsible-content">
Send an email with the following info before the training can be arranged:
* The name of the person you have supported as an HF-buddy and the number of times you've done it (at least 2).
* Before training, read the safety information carefully: https://wiki.nbi.ku.dk/cleanroom/HF_safety
* Before training, fill out the questionnaire related to HF handling that you will receive from a CR staff.
HF handling requires strict safety protocols. In the case that the user is not prepared for the training, the instructor has the right to stop the training.
</div>
</div>

== Lithography ==

=== Elionix 7000 (100 kV) ===
Elionix 7000 training is for advanced users and requires prior cleanroom tool competency.

Contact Harry (cleanroom@nbi.ku.dk) to request training.
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==== Prerequisites ====
* You must be at least a Master student or signed up for a long term (>6 months) project to be allowed to use the tool.
* Elionix is a high level tool. Make sure you are already trained to:
** Enter the cleanroom
** Use the microscope, spinner, asher

==== Training ====
* You'll need 4 sessions to get trained on this tool.
** Session 1 ( 1 hr.) - teaches you how to load/unload the sample and how to condition the beam.
** Session 2 ( 3 hr.) - involves exposing alignment marks and test patterns (any design: preferably one half of the overlay ,so to understand alignment later ).
** Session 3 ( 3 hr.) - involves using the exposed alignment marks for marker registration and exposing the 2nd pattern (i.e. the 2nd half of the overlay pattern).
** Session 4 involves exposing a "real" pattern on a "real" chip on your own to gain access.

==== Preparation ====
Before any training slots are booked on the tool you'll need all of the following prepared:
* Shadow senior users on the tool 2-3 times.
* Chip (comfortable to handle) spin coated with resist. This chip will be used for sessions 1 & 2. Please be aware of the coating and baking parameters for the resist.
* Any test design is preferred which has marks, overlay patterns that you will use to test alignment precision between two lithography steps. A Vernier pattern is commonly used. Feel free to test your ideas. Make sure you have something for both ''x'' and ''y'' directions. If you don't know how to start, check the [[Design template for EBL]].
* Convert your design files into the Elionix exposure format .co7. This can be done using Beamer in 4th floor design computers.
* Make sure all write fields are entirely in the positive coordinate space.
* Make sure neither exposure will take longer than 60 minutes at 500 pA current and dose of 1000 uC/cm2.
</div>
</div>

=== Elionix F-125 (125 kV at QuanTech) ===
Contact Zhe Liu to arrange access and training for Elionix F-125.
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* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
</div>
</div>

=== Heidelberg upg501 ===
Prepare your design file and coated chip before requesting Heidelberg upg501 training.
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<div class="mw-collapsible-content">
* Have a design file ready. GDS, DXF or CIF format works fine. Make sure you are familiar with the design before your actual session.
* Have a chip spin coated with an appropriate photoresist before the training session.
** The photoresist is sensitive to white light. Use the yellow filter on the microscopes. The light source in the both scribers is white and will already expose your resist.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video and read the standard operating procedure on the [[Heidelberg µPG 501|Heidelberg µPG 501 tool page]], shadow the tool with your group members, and ask for a sign-off session.
</div>
</div>

== Characterization ==

=== Bruker Dimension Icon Atomic Force Microscope (AFM) ===
Contact NBI-CR staff ([mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk]) to request for AFM training.
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<div class="mw-collapsible-content">
* Have a sample ready that you want to characterize. Think about what you want to learn about the sample: step height, roughness, etc.
* Only request for training if you plan on using the tool regularly.
* Training is usually 2-3 sessions of 2-hour per session.
* Staff can also carry out user projects, subject to availability and timeframe.
</div>
</div>

=== JEOL 7800-F ===
Prepare a real sample and imaging goals before booking JEOL 7800-F training.
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<div class="mw-collapsible-content">
* Training is usually 2-3 sessions of 2-hour per session.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

=== JEOL 7800-F prime (QuanTech) ===
Prepare a real sample and imaging goals before booking JEOL 7800-F Prime training.
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<div class="mw-collapsible-content">
* Training takes about 2-3 sessions.
* You need a chip/sample to be imaged before a session is booked.
* Be familiar with the materials on the sample to be imaged and what feature is it that is of critical interest -- something that makes or breaks your device.
* Request the training session only once you have gathered the chips and information.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

=== Raith e-Line ===
Bring a prepared design package for sessions 1 and 2, including alignment and overlay test patterns.
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b8e2d5; border-left:6px solid #14866d; background:#f2fbf8; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
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<div class="mw-collapsible-content">
* A design (gds, dxf, cif) for sessions 1 & 2 with:
** 4 alignment crosses (find out what marks work on the tool from your sub-group).
** Something to break the symmetry so you can tell chip orientation with your bare eye.
** A pattern that you will use to test overlay (alignment between two lithography steps). A Vernier pattern is commonly used. Feel free to test your ideas.
** Something creative, somethin fun :) This is an exercise in learning CAD as well.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

=== Woollam alpha-SE Ellipsometer ===
Request Woollam alpha-SE Ellipsometer training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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</div>
</div>

=== Filmetrics reflectometer ===
Contact Zhe Liu to arrange access and training for the Filmetrics reflectometer.
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<div class="mw-collapsible-content">
* Please contact Zhe Liu ([mailto:zhe.liu@nbi.ku.dk zhe.liu@nbi.ku.dk])
</div>
</div>

== Thin Film Deposition ==

=== PLASSYS Evaporator ===
Email your PLASSYS request with shadowing, sample, and process parameters.
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<div class="mw-collapsible-content">
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Specify the required process parameters( material, thickness, tilt etc)
* What is your project alias? If unsure, contact your supervisor first.
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
</div>
</div>

=== AJA metallization, sputtering or ion milling ===
Email your training request with shadowing, sample, tool, process, and recipe details for AJA.
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<div class="mw-collapsible-content">
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use: AJA1 or AJA2?
* What process do you want to run ?
* Either the recipe name or specify the required process parameters.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video on how to load/unload and read the standard operating procedures on the [[AJA Systems|AJA Systems tool page]]
==== Training ====
* You'll need 2 sessions to get trained on this tool.
** Session 1 ( 2 hr.) - teaches you how to load/unload the sample and how to run a recipe.
** Session 2 ( 2 hr.) - sign off session
</div>
</div>

=== ALD 1 ===
Email your ALD 1 request with shadowing, sample, and full process details.
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<div class="mw-collapsible-content">
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

</div>
</div>

=== ALD 2 ===
Email your ALD 2 request with shadowing, sample, and full process details.
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<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">
Send an email with the following info before the training can be arranged:
* The name of the person you have shadowed and the number of times you've done it.
* Confirm that you have a sample ready.
* Which tool you want to use.
* What process steps you want to run.
** Either the recipe name or all required process parameters.
** How long does the process take.
* What is your project alias? If unsure, contact your supervisor first.

Before the training session:
* Watch the instruction video(s)
* Study the [[Atomic layer deposition|ALD principles]]
* Read the standard operating procedure on the [[Cambridge ALD|ALD tool page]].

</div>
</div>

== Packaging ==

=== F&S autobonder ===
Prepare shadowing and bonding documentation, then request F&S autobonder training.
<div class="mw-collapsible mw-collapsed" style="border:1px solid #d9c8b7; border-left:6px solid #8b5e3c; background:#fbf6f1; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">
Send an email with the following info before the training can be arranged:

* Shadow colleagues using the tool 2-3 times.
* You must have a '''chip''' for bonding.
* You must know which '''daughterboard''' you will use for bonding.
* You must know what material you use to '''mount''' the chip to the daughterboard (silver paint, PMMA or whatever is specific to your measurement).
* You must prepare a '''bonding schematic''' and have one of your team members verify that it is correct.
* What is your project alias? If unsure, contact your supervisor first.
* Read through the wiki page: https://wiki.nbi.ku.dk/cleanroom/FS_bonder
* Request a training session at this point.

Two training sessions are required to get access to the bonder:

# 3 hours: Basic bonder training and chip bonding
# 2 hours: Sign-off session
</div>
</div>

=== Manual bonder ===
Request manual bonder training via [mailto:cleanroom@nbi.ku.dk cleanroom@nbi.ku.dk].
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<div class="mw-collapsible-content">
</div>
</div>

== Miscellaneous ==

=== Micromanipulator ===
Complete group-level training first, then request a micromanipulator sign-off session.
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<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">
* Please get trained within your research group first. Then request a sign-off session.
* What is your project alias? If unsure, contact your supervisor first.
</div>
</div>

[[Category:Tools]]

AJA systems

2026-06-23T11:55:07Z

Harry: /* AJA1 & AJA2: Sputtering metals */

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Harry
|secondary = Martin
}}
''Page last updated: 22 Jun 2026''

There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside. Oxidation chamber on the loadlock.
* System 2: One regular 2" DC sputtering target, one 3" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10<sup>-8</sup> Torr and 6x10<sup>-8</sup> Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.
The chamber vacuum is monitored periodically by shutting the cryo-valve and recording the rise of pressure rise for 10 mins. The ''rate-of-rise'' history is provided here [link].

Service notes and troubleshooting issues are all gathered in the dedicated [[AJA service]] page. Maintenance logs are collected in the Excel czar log page.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2024 July 2):

{|
|-
|
{| class="wikitable"
|-
! AJA1 !! Material !! Liner !! Thickness limit
|-
| 1 || Al || Intermetallic ||
|-
| 2 || Ti1 || Fabmate ||
|-
| 3 || SiOx || Tungsten ||
|-
| 4 || Au2 || Tungsten ||
|-
| 5 || Ge || Fabmate ||
|-
| 6 || Pt || FabMate || 200 nm*
|-
| DC1 || W || -- ||
|-
| DC2 || Nb<sub>2</sub>Ti || -- ||
|-
|}
|
<span style="display:inline-block; width: 20px;"></span>
|
{| class="wikitable"
|-
! AJA2 !! Material !! Liner !! Thickness limit
|-
| 1 || Pt || Tungsten || 200 nm*
|-
| 2 || Au2 || FabMate ||
|-
| 3 || Al || Intermetallic ||
|-
| 4 || Ti || intermetallic ||
|-
| 5 || Pd || FabMate ||
|-
| 6 || Cr || FabMate ||
|-
| DC1 || Ti || -- ||
|-
| RF2 || Mo || -- ||
|-
| RF3
| Nb<sub>2</sub>Ti || -- ||
|-
|}
|-
|}

Notes:
* If you need to deposit a thicker layer, you need to book enough time for the cryo pump to reach base temperature before continuing with a second layer.
* When you make a booking, you have to select if your deposition includes gold. If yes, you will be asked to fill out the total Au thickness you plan to deposit.
=== Other available materials ===
'''Evaporation''': SiO<sub>2</sub>, MgB<sub>2</sub>, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb<sub>2</sub>Ti<sub>1</sub>, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si<sub>3</sub>N<sub>4</sub>, Ta, Nb<sub>4</sub>Ti<sub>1</sub>, Nb

There is a big [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm compatibility chart] next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

= Instruction videos =

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

= Standard operating procedures =

==System pre-checks==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
* Check the cryo-pump monitor. It should be between '''12-17 K'''. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is '''1500 Hz'''. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is '''<1x10<sup>-7</sup> Torr'''.
*:'''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is '''closed'''.

==Which holder are you using?==
<div style="background-color: #17a2b8; border: 1px solid #1491A5; padding: 10px; border-radius: 5px;">
===AJA1 holders===
* General holder with modular brackets (kept inside the load lock)
* General holder for 4" wafers
* Sputtering holder: Use only for sputtering
===AJA2 holders===
* Au holder (kept inside the load lock)
*: '''If your entire process ends with Au deposition, use the dedicated Au sample holder'''
* General holder
*: '''If your process doesn't end with Au, but any other material, use the generic sample holder'''
* NbTiN holder: Use only for RF3 sputtering of NbTiN
''All the holders are being kept in the N<sub>2</sub> cabinet in the Process Lab 213''
</div>
</div>

==Loading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
#: Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Load your chip either using the mechanical clamps or the double-sided Kapton tape.
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Wait until the chamber pressure goes down to 3x10<sup>-6</sup> Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
# Open the gate valve between the main chamber and the load lock.
# Load the sample holder in the main chamber.
#* AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
#* AJA2: Screw in the sample holder into the stage.
#: Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
# Close the load lock gate valve.
# Check main chamber vacuum.
# Check cryo pump temperature.
</div>

==Unloading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Rotate the sample to the correct position (same orientation as the beginning of the loading procedure).
# Open the gate valve between the main chamber and the load lock.
# Remove the sample holder from the main chamber.
# Close the load lock gate valve.
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Take your sample
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Fill out the Excel log file.
# Clean up after yourself. If the workstation is found untidy, be proactive and leave the setup neat as it is supposed to be.
</div>

==Evaporating metal==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading posion'''
# Choose the material on the linear crucible drive as well as on the deposition controller.
# Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
#: This exposes the metal to be evaporated.
#: '''If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!'''
# Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
# Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
#: '''Be very sure that you have opened the e-beam shutter.'''
# Two clicks of the knob and the current set point is set to 4 mA.
#: Wait until the current increases to this value.
# Can you see the bright spot where the beam hits the metal in the crucible?
# Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
#: In the dedicated page for ''materials evaporation'', you can read more information for each material that you can evaporate in the cleanroom.
# Consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
# Ramp the current up at about '''1 click/15 seconds''' to half the value (typically around 20mA).
# Let it sit at that value for 2 mins while the metal soaks (''thermal soaking'') and thermally equilibrates.
#: Too fast and you'll crack the crucible liner or your evaporated metal film will be rough.
# Continue ramping '''1 click/15 seconds''' while monitoring the deposition rate:
#: 1 Å/s is a good rate for metal film evaporation. Try and stay around this value.
# When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
#: The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronising the zero with the shutter opening.
# Wait until the right thickness is evaporated.
# Close the substrate shutter.
# Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds).
#: '''Don't be too quick about it.''' We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
# Turn off the high voltage on the hand remote.
# Wait 2-3 mins for the metal to cool down before moving over to the next metal or finishing your process.
#: '''The metal inside the crucible should stop glowing.'''
# If you're done, turn off the Carrera voltage supply.
# Close the e-beam shutter, '''if the metal is no longer red hot'''.
</div>

==AJA1: Kaufman ion milling==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the sample to face the ion milling gun.
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: ''apex'')
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# In the program, click on the <code>Ion gas</code> button. It should turn green. This diverts the Ar gas flow to the gun.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) according to your recipe.
# In the program, select the <code>Pressure</code> button and set the value according to your recipe.
# Select <code>Pressure</code> button and set the value according to your recipe.
#: A [https://en.wikipedia.org/wiki/PID_controller ''PID-controlled''] gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
# Turn on the Kaufman source controller power supply by physically flicking the switch.
# On the PC at the preparation table, there are several shortcuts to scripts.
#: Execute the relevant beam voltage script (100 V or 300 V) according to your recipe and confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.
#: Wait till the script is done.
# Go back to the laptop.
# Click on the small <code>Output</code> button to turn on the gun.
#: This fires the Ar ions. The ion source shutter still protects your sample.
# Wait for the indicator to turn purple.
# Wait for 2 mins
# Start your timer and open the shutter with the big <code>Shutter</code> button.
#: '''You are now milling.'''
# Click on the big <code>Shutter</code> button to stop the milling.
# Click on the small <code>Output</code> button to turn off the gun (it should turn red).
# Wait for 2 mins while the gun cools down.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# In the program, click on the <code>Ion gas</code> button.
# Turn off the Kaufman source controller power supply by physically flicking the switch.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Proceed with evaporating metal or unloading your sample following the guidelines.
</div>

==AJA2: RF milling (auto - RF1)==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the RF1 power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
#: Your recipe will start automatically
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.

===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

'''Chamber conditioning'''
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the RF1 stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: ''Max set pt is 50 W''
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are milling'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 25 W.
# Once the system ramps down to 25 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

==AJA1 & AJA2: Sputtering metals==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
#: '''Note:''' ''The sputter sources are angled a bit. 10-20 degrees might give you a more head on sputtering.''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the relevant power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the power source unit.
# Fill out the Excel log file.
# Proceed with any other steps or unload.
===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
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<div class="mw-collapsible-content">

'''Important warning before you start: For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!'''

'''Striking the plasma'''
# Open the substrate shutter. The sputter sources have individual shutters.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the power stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are sputtering'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 50 W.
# Once the system ramps down to 50 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

== Oxidation in loadlock ==

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.



==Troubleshooting==

Having trouble with the tool? Please contact the tool responsible from the cleanroom.

If you feel comfortable, please consult the troubleshooting guide below:
<div class="mw-collapsible mw-collapsed" style="border:1px solid #f5c6cb; border-left:6px solid #f5c6cb; background:#f8d7da; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

; Unable to ignite the plasma (either DC, RF or ion plasma)?
:* Start by checking for shorts between pins on the power supply input, on the sputtering arm/ion source.

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in the crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on the remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters the [[AJA service#Phase II J software configurations |Phase II J software configurations]].
:: user: apex
</div>
</div>
[[Category:Tools]]
[[Category:Deposition]]

AJA systems

2026-06-23T11:54:49Z

Harry: /* AJA2: RF milling (auto - RF1) */

{{Infobox tool
|image = Tool AJA2.jpg
|toolfullname = AJA Orion
|website = http://www.ajaint.com/atc-orion-series-sputtering-systems.html
|company = AJA INTERNATIONAL INC.
|description = Thin film deposition and milling systems
|location = 03.2.218
|primary = Harry
|secondary = Martin
}}
''Page last updated: 22 Jun 2026''

There are two AJA Orion physical vapor deposition (PVD) systems at the [[Main Page|NBI cleanroom]].
They both have 2" magnetron sputtering and electron beam evaporation capabilities, as well as some form of substrate milling/sputtering.
Most users utilize the tools for thin film metal deposition and substrate surface cleaning.

Other deposition tools at the [[Main Page|NBI cleanroom]]:
* Metal PVD:
** [[E-Gun evaporator]]
** [[Edwards evaporator|Edwards thermal evaporator]]
** [[Leica sputter coater]]
* Oxide ALD:
** [[Cambridge ALD]]
* III-V growth:
** [[MBE]]

== Overview ==

Systems 1 and 2 are identical in terms of operating procedures. The password for logging in is ''apex''.

They differ slightly in their outfitting:
* System 1: Two 2" DC sputtering targets, Kaufman ion source for cleaning. Mechanically clamped to the loading arm and magnetically clamped to the rotating stage inside. Oxidation chamber on the loadlock.
* System 2: One regular 2" DC sputtering target, one 3" DC sputtering target with adjustable working distance, one 2" RF sputtering target, and an RF supply to the stage for substrate sputtering (ion milling). Mechanically clamped to the loading arm as well as the stage inside the chamber. Stage water cooling (same 19°C chiller circuit as for magnetrons and e-beam crucibles). Stray electrons on the near side are stopped by an extra static shutter, magnetically steered away on the far side.

Systems 1 and 2 are expected to at least reach a vacuum of about 2x10<sup>-8</sup> Torr and 6x10<sup>-8</sup> Torr (respectively) after pumping for 24 hours on the main chamber from atmosphere.
The chamber vacuum is monitored periodically by shutting the cryo-valve and recording the rise of pressure rise for 10 mins. The ''rate-of-rise'' history is provided here [link].

Service notes and troubleshooting issues are all gathered in the dedicated [[AJA service]] page. Maintenance logs are collected in the Excel czar log page.

== Currently loaded materials ==

The materials currently available for deposition are as follows (updated 2024 July 2):

{|
|-
|
{| class="wikitable"
|-
! AJA1 !! Material !! Liner !! Thickness limit
|-
| 1 || Al || Intermetallic ||
|-
| 2 || Ti1 || Fabmate ||
|-
| 3 || SiOx || Tungsten ||
|-
| 4 || Au2 || Tungsten ||
|-
| 5 || Ge || Fabmate ||
|-
| 6 || Pt || FabMate || 200 nm*
|-
| DC1 || W || -- ||
|-
| DC2 || Nb<sub>2</sub>Ti || -- ||
|-
|}
|
<span style="display:inline-block; width: 20px;"></span>
|
{| class="wikitable"
|-
! AJA2 !! Material !! Liner !! Thickness limit
|-
| 1 || Pt || Tungsten || 200 nm*
|-
| 2 || Au2 || FabMate ||
|-
| 3 || Al || Intermetallic ||
|-
| 4 || Ti || intermetallic ||
|-
| 5 || Pd || FabMate ||
|-
| 6 || Cr || FabMate ||
|-
| DC1 || Ti || -- ||
|-
| RF2 || Mo || -- ||
|-
| RF3
| Nb<sub>2</sub>Ti || -- ||
|-
|}
|-
|}

Notes:
* If you need to deposit a thicker layer, you need to book enough time for the cryo pump to reach base temperature before continuing with a second layer.
* When you make a booking, you have to select if your deposition includes gold. If yes, you will be asked to fill out the total Au thickness you plan to deposit.
=== Other available materials ===
'''Evaporation''': SiO<sub>2</sub>, MgB<sub>2</sub>, SiGe (p-doped), Ta, Nb, Pd, W
'''Sputtering''': Nb<sub>2</sub>Ti<sub>1</sub>, Cu, InSb, Bi, Ti, Re, Mo, Ni, Si<sub>3</sub>N<sub>4</sub>, Ta, Nb<sub>4</sub>Ti<sub>1</sub>, Nb

There is a big [https://www.lesker.com/newweb/deposition_materials/materialdepositionchart.cfm compatibility chart] next to the prep bench behing AJA1.
For each deposition material it lists a compatible evaporation crucible material, and a compatible sputtering power mode.

= Instruction videos =

Various procedures on the system are shown in the video and in a step by step guide below:

[[File:AJA_load_movie.mp4|500px]]

[https://youtu.be/irRtsm70ggU Click here to watch the video on YouTube]

([[Media:How_to_Evaporate_metal_in_AJA1.pdf|An illustrated guide for new users by Mingtang]]. A physical copy of the same lies by the tool. It is a bit outdated but may help you remember some steps)

= Standard operating procedures =

==System pre-checks==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
* Check the cryo-pump monitor. It should be between '''12-17 K'''. If it's higher than 20 K, grab a tool responsible or a technical staff member.
* Check that the turbo frequency is '''1500 Hz'''. The turbo pumps on the load lock.
* Check that the pressure in the main chamber (ion gauge sensor) is '''<1x10<sup>-7</sup> Torr'''.
*:'''Log this value.'''
* Check that the load lock gate valve (connects the load lock to the main chamber) is '''closed'''.

==Which holder are you using?==
<div style="background-color: #17a2b8; border: 1px solid #1491A5; padding: 10px; border-radius: 5px;">
===AJA1 holders===
* General holder with modular brackets (kept inside the load lock)
* General holder for 4" wafers
* Sputtering holder: Use only for sputtering
===AJA2 holders===
* Au holder (kept inside the load lock)
*: '''If your entire process ends with Au deposition, use the dedicated Au sample holder'''
* General holder
*: '''If your process doesn't end with Au, but any other material, use the generic sample holder'''
* NbTiN holder: Use only for RF3 sputtering of NbTiN
''All the holders are being kept in the N<sub>2</sub> cabinet in the Process Lab 213''
</div>
</div>

==Loading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
#: Do not apply force and pull the load lock lid out. The load lock may not be vented yet.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Load your chip either using the mechanical clamps or the double-sided Kapton tape.
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Wait until the chamber pressure goes down to 3x10<sup>-6</sup> Torr. This can take 5-30 minutes, depending on your sample. The turbo will have revved up to 1500 Hz by now. Confirm this.
# Open the gate valve between the main chamber and the load lock.
# Load the sample holder in the main chamber.
#* AJA1: You should feel the magnetic pull when the sample holder is close enough to the stage to be coupled. Then unlock the loading arm from the sample holder and retract the arm.
#* AJA2: Screw in the sample holder into the stage.
#: Take note of the sample holder orientation on the stage as well as the rotation/orientation of the loading arm. In principle, you should unload using the same orientation as this will be the easiest.
# Close the load lock gate valve.
# Check main chamber vacuum.
# Check cryo pump temperature.
</div>

==Unloading your sample==
<div style="background-color: #fff3cd; border: 1px solid #ffc107; padding: 10px; border-radius: 5px;">
# Rotate the sample to the correct position (same orientation as the beginning of the loading procedure).
# Open the gate valve between the main chamber and the load lock.
# Remove the sample holder from the main chamber.
# Close the load lock gate valve.
# Push down the 'Load Lock' switch on the main rack to vent the load lock.
# Wait till the load lock reaches ~760 Torr and pops out a bit.
# Place the load lock lid, handle up, on the three rubber bumps.
# Remove the sample holder. It's held in place by three pins that lock into a groove.
# Grab a fresh cleanroom wipe and place the sample holder on the wipe.
# Take your sample
# Load the sample holder inside the load lock, rotate the holder to confirm all three pins are locked in place, replace the lid
# Push up the 'Load Lock' switch on the main rack to evacuate the load lock.
# Fill out the Excel log file.
# Clean up after yourself. If the workstation is found untidy, be proactive and leave the setup neat as it is supposed to be.
</div>

==Evaporating metal==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading posion'''
# Choose the material on the linear crucible drive as well as on the deposition controller.
# Open the e-beam shutter by flicking the physical e-beam shutter switch to open.
#: This exposes the metal to be evaporated.
#: '''If you don't open this shutter, the accelerated focused electron beam will hit the shutter instead of the metal and drill a hole through it!'''
# Switch on the Carrera Ferro Tec high voltage power supply. The switch is green and is labelled 'Main'.
# Turn on the high voltage on the hand remote. It sets the beam acceleration voltage to 10 kV. This is fixed and cannot be changed by the users.
#: '''Be very sure that you have opened the e-beam shutter.'''
# Two clicks of the knob and the current set point is set to 4 mA.
#: Wait until the current increases to this value.
# Can you see the bright spot where the beam hits the metal in the crucible?
# Center the beam and make sure the beam is <del>neither too focused nor too defocused</del> not sweeping (unless required for some materials).
#: In the dedicated page for ''materials evaporation'', you can read more information for each material that you can evaporate in the cleanroom.
# Consult the Excel log sheet to determine the typical current needed to get a finite evaporation rate.
# Ramp the current up at about '''1 click/15 seconds''' to half the value (typically around 20mA).
# Let it sit at that value for 2 mins while the metal soaks (''thermal soaking'') and thermally equilibrates.
#: Too fast and you'll crack the crucible liner or your evaporated metal film will be rough.
# Continue ramping '''1 click/15 seconds''' while monitoring the deposition rate:
#: 1 Å/s is a good rate for metal film evaporation. Try and stay around this value.
# When you are ready to evaporate, zero the counter on the deposition controller and open the sample shutter.
#: The shutter takes about 1-2 secs to open, so you don't have to be paranoid about synchronising the zero with the shutter opening.
# Wait until the right thickness is evaporated.
# Close the substrate shutter.
# Ramp the beam down to 0 in a period of a couple of minutes (1 click/10 seconds).
#: '''Don't be too quick about it.''' We want the metal and the liner to cool down slowly to stop the liner from cracking due to thermal stress.
# Turn off the high voltage on the hand remote.
# Wait 2-3 mins for the metal to cool down before moving over to the next metal or finishing your process.
#: '''The metal inside the crucible should stop glowing.'''
# If you're done, turn off the Carrera voltage supply.
# Close the e-beam shutter, '''if the metal is no longer red hot'''.
</div>

==AJA1: Kaufman ion milling==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the sample to face the ion milling gun.
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: ''apex'')
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# In the program, click on the <code>Ion gas</code> button. It should turn green. This diverts the Ar gas flow to the gun.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) according to your recipe.
# In the program, select the <code>Pressure</code> button and set the value according to your recipe.
# Select <code>Pressure</code> button and set the value according to your recipe.
#: A [https://en.wikipedia.org/wiki/PID_controller ''PID-controlled''] gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
# Turn on the Kaufman source controller power supply by physically flicking the switch.
# On the PC at the preparation table, there are several shortcuts to scripts.
#: Execute the relevant beam voltage script (100 V or 300 V) according to your recipe and confirm the settings are reflected on the power supply.
# Execute the discharge script: enter the desired discharge time in seconds and press ENTER.
#: Wait till the script is done.
# Go back to the laptop.
# Click on the small <code>Output</code> button to turn on the gun.
#: This fires the Ar ions. The ion source shutter still protects your sample.
# Wait for the indicator to turn purple.
# Wait for 2 mins
# Start your timer and open the shutter with the big <code>Shutter</code> button.
#: '''You are now milling.'''
# Click on the big <code>Shutter</code> button to stop the milling.
# Click on the small <code>Output</code> button to turn off the gun (it should turn red).
# Wait for 2 mins while the gun cools down.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# In the program, click on the <code>Ion gas</code> button.
# Turn off the Kaufman source controller power supply by physically flicking the switch.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Proceed with evaporating metal or unloading your sample following the guidelines.
</div>

==AJA2: RF milling (auto - RF1)==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the RF1 power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
#: Your recipe will start automatically
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.

===Do you want to run in manual mode?===
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

'''Chamber conditioning'''
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the RF1 stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: ''Max set pt is 50 W''
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are milling'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 25 W.
# Once the system ramps down to 25 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

==AJA1 & AJA2: Sputtering metals==
<div style="background-color: #d1ecf1; border: 1px solid #17a2b8; padding: 10px; border-radius: 5px;">
# Load your sample via the load lock following the procedure detailed above.
# Rotate the stage to face the crucible liners (90<sup>o</sup> degrees down - follow the instructions on the lever).
#: '''Never rotate the lever towards the top from the loading position'''
#: '''Note:''' ''The sputter sources are angled a bit. 10-20 degrees might give you a more head on sputtering.''
# Turn off the ion gauge (pressure gauge).
# On the laptop, make sure the PhaseIIJ program is running.
#: If not, start it up. (password: apex)
# Set the adaptive pressure controller to 'Remote' (3 sec long press).
# Turn on the relevant power source unit.
# In the program, click on the <code>run process</code> button.
# Scroll down to the desired recipe
# <code>Run</code>
# Once the milling starts, note down the <code>Voltage</code> from the power unit into the excel
# Once the recipe terminates, you will get a pop-up window.
# Press <code>Okay</code>
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the power source unit.
# Fill out the Excel log file.
# Proceed with any other steps or unload.
====Do you want to run in manual mode?====
<div class="mw-collapsible mw-collapsed" style="border:1px solid #b7e1c1; border-left:6px solid #2a9d5b; background:#f2fbf5; border-radius:6px; margin:0.45em 0 1.0em; padding:0.55em 0.75em 0.55em;">
<div class="mw-collapsible-toggle" style="text-align:right; margin:-0.62em 0 0.25em; line-height:1;">'''Expand'''</div>
<div class="mw-collapsible-content">

'''Important warning before you start: For safe operation of the RF ALWAYS enter a ramp rate such that the RF circuitry never ramps faster than 1W/second. Enter ramp rate BEFORE changing wattage!'''

'''Striking the plasma'''
# Open the substrate shutter. The sputter sources have individual shutters.
# In the program, click on the <code>Ar gas</code> button and set the 'STPT' (set point) to 80 sccm
# In the program, select the <code>Pressure</code> button and set the pressure to 30 mTorr.
#: A PID-controlled gate valve between the cryo pump and the chamber will adjust so that the Ar pressure in the chamber matches the set point. You'll hear the valve adjusting when you set the controller to remote. On the adaptive pressure controller display, look at the '''SP''' and the '''P1'''. These should match the value that you want and keyed into the PhaseIIJ program.
'''Striking the plasma'''
# Set the power stpt to 25 W and turn on the output.
# Once the plasma ignites, the pressure can be lowered to 2-4 mTorr and flow to 20 sccm.
#: Check that the plasma is visible (a faint purple blueish hue inside the main chamber). ''There is a little pink indicator in the software that should light up in the control software congruent with when the plasma is visible in the chamber.''
# '''Ramping:''' Enter the ramp time first and '''then''' the new set point such that the ramp rate is 1 W/s. Hit enter or click away after entering the new set point.
#: Entering the new set point before entering the ramp time will result in the system jumping to the set point in one step. This will cause rapid heating.
# Close the viewport shutter.
# Once the desired set point is reached, start the timer.
#:''' Now you are sputtering'''
'''Ramping down'''
# Enter the ramp down time and THEN the set point of 50 W.
# Once the system ramps down to 50 W, turn off the output.
# In the program, (pressure control section) select the <code>Open</code> button to completely open the cryo gate valve and pump the Ar out.
# In the program, click on the <code>Ar gas</code> button to turn off the Ar gas flow.
# Set the adaptive pressure controller to 'Local' (3 sec long press).
# Turn on the ion gauge (pressure gauge).
# Turn off the RF1 power source unit.
# Fill out the Excel log file.
# Proceed with other steps such as evaporation, unloading, etc.
</div>
</div>
</div>

== Oxidation in loadlock ==

The process is set up for ~10 Torr. In practice it should be between 9.8-10.0 Torr (see log sheet).

[[Media:Oxidation upgrade.xlsx|Data gathered during initial testing (xlsx)]]

Empirically: ''regulator_valve = (desired_pressure / 9) - 1''

The Baratron gauge only goes up to 10 Torr. Therefore this is the maximum allowed pressure for oxidation.

The gas hooked up for the process is 85% Ar / 15% O2.

Reference Figure for valve numbering.
The actual placement of the parts is slightly different, but all six valves have stickers with numbers on them.

[[Image:AJA oxidation valves.jpg]]

==== Changing the oxidation pressure ====

Consult the speadsheet describing regulator valve reading vs Baratron pressure.

Decide on the regulator valve reading you will go for.

Quick guess: ''(desired pressure in Torr / 9) - 1''

# Make sure '''Valves 1, 3, 5, 6''' are closed.
#: Make sure '''Valve 4''' is closed in the software.
# Close '''Valve 2''' (turbo iso).
#: Open '''Valve 5''' (roughing).
#: Open '''Valve 3''' (soak).
# Move behind the tool so you can comfortably reach '''Valve 1''' and the regulator valve.
# Open '''Valve 1''' (fill). The regulator valve pressure should drop about 0.05 bar.
#: Adjust the regulator valve to desired value.
#: Close '''Valve 1'''.
# Open '''Valve 4''' (turbo purge) in the software. Wait for the pressure to go down to 0.148 Torr. You can safely continue if it is lower.
# Close '''Valve 5''' (roughing).
#: Open '''Valve 2''' (turbo iso). Wait until the pressure in the loadlock is below 3e-6 Torr.
# Close '''Valve 3''' (soak).

==== Standard oxidation procedure ====

Before you start make sure that:
* The loadlock is below 3e-6 Torr and your sample is already transferred in; ready for the oxidation process.
* Gate valve to the main chamber is closed.
* '''Valves 1, 3, 5, 6''' are closed.
* '''Valve 4''' (LL tp) is closed in the software.
* '''Valve 2''' is open.
* O2/Ar gas bottle regulator valve shows a reading that will give you a desirable pressure in the loadlock. '''Log this value.''' The pressure reading is relative to ambient atmosphere.

# Open '''Valve 1''' (Fill valve) for <del>~30</del> ''a few'' seconds in order to charge the gas ballast section. You will hear the gas quickly filling the volume.
# Close '''Valve 1'''.
# Close '''Valve 2''' (Turbo Iso valve) in order to isolate the load lock volume from the turbo.
# Open '''Valve 3''' (Soak valve) in order to expose O2 gas ballast to load lock volume. '''Start a timer.'''
#: If at any point the load lock increases above 10 Torr, it is safest/best to vent the load lock up to atmospheric pressure by opening '''Valve 6''' (manual N2 vent).
#:: Do not attempt to rough out the load lock if above 10 Torr through the manual bypass '''Valve 5'''.
# Soak for desired oxidation time. '''Log the Baratron pressure''' (red LEDs at the bottom of the tool). '''Log the oxidation time.'''
#: ''This needs data feedback from the users. --Karolis''
# Open '''Valve 4''' (turbo N2 purge valve) through the ''AJA PhaseIIJ'' software to initiate the purging process.
# Once ready to rough out the load lock body, slowly crack open '''Valve 5''' (rough valve) – monitor the load lock turbo's DCU display to ensure the turbo's speed doesn't get bogged down (the exhaust/foreline pressure will increase while roughing out the load lock of course).
#: ''It should be fine. --Karolis''
#: ''In case it is not fine and the turbo starts spinning down: turn loadlock pumping off and back on. If there's still a problem, repeat with Valve 4 closed. --Karolis''
#: The max foreline pressure that the turbo can handle is 10 Torr – this is only for short durations of time when roughing out after an oxidation process. Normally the foreline pressure would be ~e-3 – e-2 Torr range.
# Continue to monitor the load lock pressure as '''Valve 5''' continues to remain open while roughing.
# Once the pressure levels off after a couple minutes, you can close '''Valve 5'''.
#: ''The Baratron reading should reach 0.138 Torr while Valve 4 is open. --Karolis''
# Slowly crack open '''Valve 2''' (turbo iso valve) in order to continue pumping the load lock as normal; there will be a slight pressure differential, but well within the limits of valve operation.
#: ''It should be fine. --Karolis''
#: The Turbo iso '''Valve 2''' (or VAT Isolation valve) should not be operated with a high pressure differential. The greatest pressure differential this valve can operate is 100 mTorr. If following the example process above, this warning has already been taken into account.
# After the pressure goes down to 3e-6 Torr, you can close off '''Valve 4''' (turbo purge) from the software & also close '''Valve 3''' (soak valve). This will ensure the gas ballast returns to high vacuum before isolating.
# The load lock oxidation process is now complete. Repeat from Step 1 as necessary.



==Troubleshooting==

Having trouble with the tool? Please contact the tool responsible from the cleanroom.

If you feel comfortable, please consult the troubleshooting guide below:
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; Unable to ignite the plasma (either DC, RF or ion plasma)?
:* Start by checking for shorts between pins on the power supply input, on the sputtering arm/ion source.

; No rate?
:* E-beam shutter open?
:* Correct material selected on deposition controller?
:* Enough current?
:* Beam in center of crucible and hitting the material?
:* Enough material in the crucible?

; Rate falling during deposition?
: Material running out. Needs top-up.

; Crucible drive getting stuck?
:* Drive support shafts worn + linear bearings gunked up. Replace
:** Protect by wiping with IPA
:** and covering with Al foil
:* Crucible liner sideways. Abort and open system.

; Can't turn on HV on the remote emission controller?
:* Clear yellow error
:* Make sure power supply is on
:* Reconnect the controller cable
:*: Login as service: "2013"
:*: Adjust max emission so that 1% = 2.0/2.5 mA

; Can't adjust current?
:* Left in auto mode. Change back to manual
:* Emission knob encoder broken. Send back to factory to repair/replace.

; Red LED on loadlock gauge?
: Power cycle should fix it during next vent/pump.

; Lots of reflected power for an RF power source?
:* The matching network for RF3 on AJA2 sometimes needs a bigger kick.
:** Try turning on the power without ramping it.
:** Another option would be to set the matching network to manual mode and strike the plasma, then turn it back to manual mode.
:* The RF1 cable in the red shroud on AJA2 sometimes gets loose:
:*: Abort process, turn off RF milling power supply, reconnect cable, tighten as much as possible.
:* The RF1 power supply controls are very sensitive, maybe someone touched them?
:*: Extremely slowly adjust Load to reach minimum of reflected power. If not 0 W, adust Tune. Iterate until 0 W.

; Recipes failing when adjusting gas flow?
: Adjust MFC timeout to 30 s
:: user: service

; Software empty?
: Fill in with parameters the [[AJA service#Phase II J software configurations |Phase II J software configurations]].
:: user: apex
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[[Category:Tools]]
[[Category:Deposition]]